{"title":"热循环对铅锡焊料蠕变疲劳损伤的微观力学研究","authors":"P. Sharma, A. Dasgupta","doi":"10.1115/imece2000-2260","DOIUrl":null,"url":null,"abstract":"\n This paper presents a micro-mechanistic approach for modeling fatigue damage initiation due to cyclic creep in eutectic Pb-Sn solder. Damage mechanics due to cyclic creep is modeled with void nucleation, void growth and void coalescence model based on micro-structural stress fields. Micro-structural stress states are estimated under viscoplastic phenomena like grain boundary sliding and its blocking at 2nd phase particles, and diffusional creep relaxation. A conceptual framework is provided to quantify the creep-fatigue damage due to thermo-mechanical cycling. Some parametric studies are provided to better illustrate the utility of the developed model.","PeriodicalId":179094,"journal":{"name":"Packaging of Electronic and Photonic Devices","volume":"96 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-11-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Micro-Mechanics of Creep-Fatigue Damage in Pb-Sn Solder Due to Thermal Cycling\",\"authors\":\"P. Sharma, A. Dasgupta\",\"doi\":\"10.1115/imece2000-2260\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\\n This paper presents a micro-mechanistic approach for modeling fatigue damage initiation due to cyclic creep in eutectic Pb-Sn solder. Damage mechanics due to cyclic creep is modeled with void nucleation, void growth and void coalescence model based on micro-structural stress fields. Micro-structural stress states are estimated under viscoplastic phenomena like grain boundary sliding and its blocking at 2nd phase particles, and diffusional creep relaxation. A conceptual framework is provided to quantify the creep-fatigue damage due to thermo-mechanical cycling. Some parametric studies are provided to better illustrate the utility of the developed model.\",\"PeriodicalId\":179094,\"journal\":{\"name\":\"Packaging of Electronic and Photonic Devices\",\"volume\":\"96 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-11-05\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Packaging of Electronic and Photonic Devices\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1115/imece2000-2260\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Packaging of Electronic and Photonic Devices","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1115/imece2000-2260","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Micro-Mechanics of Creep-Fatigue Damage in Pb-Sn Solder Due to Thermal Cycling
This paper presents a micro-mechanistic approach for modeling fatigue damage initiation due to cyclic creep in eutectic Pb-Sn solder. Damage mechanics due to cyclic creep is modeled with void nucleation, void growth and void coalescence model based on micro-structural stress fields. Micro-structural stress states are estimated under viscoplastic phenomena like grain boundary sliding and its blocking at 2nd phase particles, and diffusional creep relaxation. A conceptual framework is provided to quantify the creep-fatigue damage due to thermo-mechanical cycling. Some parametric studies are provided to better illustrate the utility of the developed model.
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