{"title":"Accurate and fast cell spreading for force directed placement","authors":"Sifei Wang, Qiang Zhou, Xu Qian, Yici Cai, Wenchao Gao, Wenjun Zhou","doi":"10.1109/ACQED.2012.6320470","DOIUrl":"https://doi.org/10.1109/ACQED.2012.6320470","url":null,"abstract":"As a key phase of force-directed placement, cell spreading can smooth the overlap linearly by adding additional forces to shift cells to the suitable place based on the utilization of bins. However, the magnitude and direction of these additional forces is hard to be determined. Unreasonable additional forces will bring great damage to the wire length and run time. In this paper, we present a new fast and accurate cell spreading technique called FACS to cope with these problems and further optimize wire length. It mainly takes the following measures: Firstly, cells are grouped into three steady sets according to their attributes, external connections and last move, and the different strategies of amending force are adopted base on the sets respectively. Secondly, the barrier is added during the cell spreading, which will limit the maximum step length and avoid breaking the integrity of original placement. This makes the average wire length reduced by 0.84%. Thirdly, the magnitude of half perimeter wire length (HPWL) change has also been put into additional forces function to amend the deviation which caused by quadratic wire length model. The experimental results show that the average wire length can be reduced by 12%.","PeriodicalId":161858,"journal":{"name":"2012 4th Asia Symposium on Quality Electronic Design (ASQED)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128233157","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Ming Yeng Lim, Sik Hong Gan, S. Lee, Z. Lee, M. Devarajan
{"title":"Thermal and optical analysis of multi-chip LED packages with different electrical connection and driving current","authors":"Ming Yeng Lim, Sik Hong Gan, S. Lee, Z. Lee, M. Devarajan","doi":"10.1109/ACQED.2012.6320507","DOIUrl":"https://doi.org/10.1109/ACQED.2012.6320507","url":null,"abstract":"The junction temperature and the thermal resistance are vital characteristics that will determine the overall performance of LED packages. The influence of two different electrical connections of multi-chip LED packages on the thermal and optical characteristics is discussed in this paper. The thermal and optical characteristics of the LED package are investigated. Measurements are carried out on LED packages with series and parallel connections in sequence. The objective of this study is to compare the thermal and optical performance of the LED packages with different electrical connections. Experimental results revealed that there is a slight variation of 3 to 5% in RthJA and ΔTJ values between both connections. For both thermal and optical measurements, the results for parallel connection are observed to be better than that for series connection.","PeriodicalId":161858,"journal":{"name":"2012 4th Asia Symposium on Quality Electronic Design (ASQED)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125100876","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Analyzing BTI effects on retention registers","authors":"Yao-Te Wang, Ing-Chao Lin","doi":"10.1109/ACQED.2012.6320478","DOIUrl":"https://doi.org/10.1109/ACQED.2012.6320478","url":null,"abstract":"As Bias Temperature Instability (BTI) effects increase the threshold voltage of transistors and decrease transistors speed, it has become a major problem for circuit reliability. Retention registers are the widely used storage cells in the power gating architecture. These registers can keep the current states in the always-on blocks. However, they suffer from significant BTl effects because the always-on block suffers from significant aging effects. This paper investigates the aging effect on various D-type retention registers. First, the paper analyzes the setup, hold and required times of retention registers under differing BTl effects. Second, because the always-on block always suffers from the BTl effects, the required time to store the data in an always-on block increases by between 0.6x-1.4x in 32nm technology. Finally, the selective transistor sizing technique is used to improve the setup, hold and required times of various D-type retention registers. Increasing the sizing of transistors between 20%-90% results in an improvement between 8.9%-41.2% in both setup and hold time.","PeriodicalId":161858,"journal":{"name":"2012 4th Asia Symposium on Quality Electronic Design (ASQED)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129977694","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Phosphor concentration effects on the thermal and optical performance of cool and warm white single chip LEDs","authors":"Hwang Hsien Shiung, A. Permal, M. Devarajan","doi":"10.1109/ACQED.2012.6320502","DOIUrl":"https://doi.org/10.1109/ACQED.2012.6320502","url":null,"abstract":"Phosphor converted light emitting diodes (LEDs) are emerging are the most promising solid state lighting source since the past few decades and with no doubt in few years to come, this technology would conveniently replace the current lighting industries. This paper elucidates the significance of thermal and optical performance difference between cool and warm white LEDs. The analyses were carried out in terms of effects of phosphor concentration on the rise in junction temperature, thermal resistance as well as the optical properties of the samples. It was observed that the cool white samples achieved 6.68% less junction temperature compared to warm white LED recorded at room temperature of 25.1°C and the average efficiency of the cool white LED was found to be higher in magnitude compared to warm white LEDs. The effects of phosphor concentration on degradation of LED performances were discussed in terms of photon scattering, light trapping and thermal loading phenomena.","PeriodicalId":161858,"journal":{"name":"2012 4th Asia Symposium on Quality Electronic Design (ASQED)","volume":"62 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117027542","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Fabrication and characterization of silicon-based Ba0.7Sr0.3TiO3 thin films for FeFET applications","authors":"A. Saif, P. Poopalan","doi":"10.1109/ACQED.2012.6320498","DOIUrl":"https://doi.org/10.1109/ACQED.2012.6320498","url":null,"abstract":"Ferroelectric Ba0.7Sr0.3TiO3 thin films have been fabricated as MFIS and MFM configurations using sol-gel technique to study the possibility of using these films in FeFET applications. To ensure the quality of the films, the dielectric properties of the material within MFM structure have been investigated using an impedance analyzer which shows good quality for the films. The ferroelectric properties of the MFM type films were studied using Sawyer-Tower circuit. The films show hysteresis loop, its strength increases with the film thickness which is attributed the grain size effect. Whereas the ferroelectric properties of the MFIS type films were studied using capacitance-voltage (C-V) characteristics. The films show memory window its width increases with the film thickness which is also attributed the grain size effect.","PeriodicalId":161858,"journal":{"name":"2012 4th Asia Symposium on Quality Electronic Design (ASQED)","volume":"46 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121442454","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Parasitic capacitance and density optimization modeling fill synthesis for VLSI interconnect","authors":"Joel Yeo Yee Kiat, K. Nyunt, Wong Hin Yong","doi":"10.1109/ACQED.2012.6320469","DOIUrl":"https://doi.org/10.1109/ACQED.2012.6320469","url":null,"abstract":"In transition to ultra deep sub-micron (UDSM) design technology nodes, fill synthesis solutions have increasingly caused performance impacts to the interconnect design, due to the parasitic capacitances induced by the dummy fill structures. Meeting chemical mechanical polishing (CMP) density design rules alone is no longer sufficient. Large spacing setbacks between functional interconnects and dummy fill structures are commonly used to minimize the parasitic capacitance. However, as designs scale further into the nanometer range, a huge percentage of metal densities are sacrificed and achieving minimum density requirements in certain areas is not feasible. In this paper, an innovative fill synthesis solution is proposed to optimize both the requirements between parasitic capacitance reduction and the improved density requirements. First, we develop various experimentation models on a 65nm layout topology to examine the capacitance behavior. From the experimentation, we propose a capacitance and density optimization modeling (OM) fill synthesis for lateral metal layers to increase the global CMP density up to ~80%, reduce the total capacitance by ~50% to preserve the interconnect capacitance and achieve much faster computation TPT (Throughput Time) as compared with traditional fill flows.","PeriodicalId":161858,"journal":{"name":"2012 4th Asia Symposium on Quality Electronic Design (ASQED)","volume":"54 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121459430","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"System management with relational database for mask tape-out","authors":"Ng Chow Leng, A. Har, Ow Yong Wai Tat","doi":"10.1109/ACQED.2012.6320488","DOIUrl":"https://doi.org/10.1109/ACQED.2012.6320488","url":null,"abstract":"Mask tooling document is a crucial component in the mask making process, it provides information to the mask maker on the specification and instruction on how to build the mask based on the mask data provided. This paper discusses the automation of this tedious and error prone process. A mask tooling system was designed to help minimize manual intervention during mask tooling document preparation and remove probability of human error, and thus save cost by saving on engineering resources and mask iterations. The system is developed with data management system that enables huge data storage and relational information. The automation of the mask tooling documentation has significantly improved the productivity by achieving 81.13% improvement and contributed to cost avoidance of buying replacement mask.","PeriodicalId":161858,"journal":{"name":"2012 4th Asia Symposium on Quality Electronic Design (ASQED)","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132146932","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Retention time characterization and optimization of logic-compatible embedded DRAM cells","authors":"A. Do, H. Yi, K. Yeo, T. T. Kim","doi":"10.1109/ACQED.2012.6320471","DOIUrl":"https://doi.org/10.1109/ACQED.2012.6320471","url":null,"abstract":"Logic-compatible 2T and 3T embedded DRAMs (eDRAM) have recently gained their popularity in embedded applications because of their high density and good voltage margin. The most important design requirements in eDRAM cells are cell area, data retention time and read speed. In this paper, we present an in-depth analysis on the data retention time of various logic-compatible eDRAM cells, followed by the effects of several design factors on the retention time. A systematic methodology is proposed for enhancing the retention time of the eDRAM cells. Simulation results using a standard 65nm CMOS technology show that the optimization process improves the data retention time more than 3×. Finally, the number of read operations per retention period is estimated to show the effectiveness of each eDRAM cell. Analysis demonstrates that although the 2T eDRAM cell has a shorter retention time than the conventional 3T cell, it has better effectiveness due to the faster read operation.","PeriodicalId":161858,"journal":{"name":"2012 4th Asia Symposium on Quality Electronic Design (ASQED)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131240362","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"3D IC implementation for MPSOC architectures: Mesh and butterfly based NoC","authors":"O. Hammami, A. M'zah, M. H. Jabbar, D. Houzet","doi":"10.1109/ACQED.2012.6320492","DOIUrl":"https://doi.org/10.1109/ACQED.2012.6320492","url":null,"abstract":"In the CMOS technologies below 65 nm the wire delay dominates the gate delay. 3D IC design is one solution to deal with this problem. We propose in this work to implement two different MPSOC architectures based on Mesh and Butterfly NoC topologies. We use the 3D IC technology from the Tezzaron Company. Thanks to its symmetry, the mesh based NoC architecture is easier to implement compared to the other one based on the Butterfly NoC. In fact with this one, we have to deal with additional problems like mapping and partitioning. With its long links, the Butterfly architecture is a better example than the mesh topology to prove the efficiency of 3D design.","PeriodicalId":161858,"journal":{"name":"2012 4th Asia Symposium on Quality Electronic Design (ASQED)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125607795","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
M. Ahmadi, A. Azarpeyvand, S. M. Fakhraie, R. Asadpour
{"title":"A novel hardware implementation for the IEEE 802.22 Turbo-Like Interleaver","authors":"M. Ahmadi, A. Azarpeyvand, S. M. Fakhraie, R. Asadpour","doi":"10.1109/ACQED.2012.6320505","DOIUrl":"https://doi.org/10.1109/ACQED.2012.6320505","url":null,"abstract":"In this paper, we present different designs for hardware implementation of the IEEE 802.22 Turbo-Like Interleaver. In addition to classical approaches such as direct and ROM-based implementation, a novel architecture is proposed. All of the new and classical designs are implemented using VHDL, synthesized with standard cells of a 180 nm typical CMOS technology and compared in terms of area, power, and delay. Based on the simulation results, the proposed method results in 33% and 46% improvements in terms of area and power compared to the direct method. It also shows 88% saving in area and 46% reduction in power consumption rather than ROM-based method. Furthermore, its operating frequency meets the standard requirements.","PeriodicalId":161858,"journal":{"name":"2012 4th Asia Symposium on Quality Electronic Design (ASQED)","volume":"65 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126511921","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}