Ming Yeng Lim, Sik Hong Gan, S. Lee, Z. Lee, M. Devarajan
{"title":"不同电连接和驱动电流的多芯片LED封装的热光学分析","authors":"Ming Yeng Lim, Sik Hong Gan, S. Lee, Z. Lee, M. Devarajan","doi":"10.1109/ACQED.2012.6320507","DOIUrl":null,"url":null,"abstract":"The junction temperature and the thermal resistance are vital characteristics that will determine the overall performance of LED packages. The influence of two different electrical connections of multi-chip LED packages on the thermal and optical characteristics is discussed in this paper. The thermal and optical characteristics of the LED package are investigated. Measurements are carried out on LED packages with series and parallel connections in sequence. The objective of this study is to compare the thermal and optical performance of the LED packages with different electrical connections. Experimental results revealed that there is a slight variation of 3 to 5% in RthJA and ΔTJ values between both connections. For both thermal and optical measurements, the results for parallel connection are observed to be better than that for series connection.","PeriodicalId":161858,"journal":{"name":"2012 4th Asia Symposium on Quality Electronic Design (ASQED)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-07-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"Thermal and optical analysis of multi-chip LED packages with different electrical connection and driving current\",\"authors\":\"Ming Yeng Lim, Sik Hong Gan, S. Lee, Z. Lee, M. Devarajan\",\"doi\":\"10.1109/ACQED.2012.6320507\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The junction temperature and the thermal resistance are vital characteristics that will determine the overall performance of LED packages. The influence of two different electrical connections of multi-chip LED packages on the thermal and optical characteristics is discussed in this paper. The thermal and optical characteristics of the LED package are investigated. Measurements are carried out on LED packages with series and parallel connections in sequence. The objective of this study is to compare the thermal and optical performance of the LED packages with different electrical connections. Experimental results revealed that there is a slight variation of 3 to 5% in RthJA and ΔTJ values between both connections. For both thermal and optical measurements, the results for parallel connection are observed to be better than that for series connection.\",\"PeriodicalId\":161858,\"journal\":{\"name\":\"2012 4th Asia Symposium on Quality Electronic Design (ASQED)\",\"volume\":\"22 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-07-10\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2012 4th Asia Symposium on Quality Electronic Design (ASQED)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ACQED.2012.6320507\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 4th Asia Symposium on Quality Electronic Design (ASQED)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ACQED.2012.6320507","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Thermal and optical analysis of multi-chip LED packages with different electrical connection and driving current
The junction temperature and the thermal resistance are vital characteristics that will determine the overall performance of LED packages. The influence of two different electrical connections of multi-chip LED packages on the thermal and optical characteristics is discussed in this paper. The thermal and optical characteristics of the LED package are investigated. Measurements are carried out on LED packages with series and parallel connections in sequence. The objective of this study is to compare the thermal and optical performance of the LED packages with different electrical connections. Experimental results revealed that there is a slight variation of 3 to 5% in RthJA and ΔTJ values between both connections. For both thermal and optical measurements, the results for parallel connection are observed to be better than that for series connection.
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