2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)最新文献

{"title":"Optimization of PCB build-up layer configuration for electronic assemblies with active embedded components in the board","authors":"W. C. Maia Filho, M. Brizoux, A. Grivon","doi":"10.1109/ESIME.2010.5464607","DOIUrl":"https://doi.org/10.1109/ESIME.2010.5464607","url":null,"abstract":"The manufacturing process of Printed Circuit Boards (PCB) with embedded active components requires several modifications on the build-up layer configuration, including the use of thinner layers and heterogeneous composite materials. From the point of view of second level interconnects the increase in density and complexity of the build-up of electronic board leads to an increase of the total resin-content. As demonstrated in a previous work, this increase of the ratio between resin and glass has a major consequence on the mechanical behavior of the assemblies, particularly on the fatigue resistance of component solder joints.","PeriodicalId":152004,"journal":{"name":"2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132051896","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Theoretical analyses on the shear test","authors":"R. Dudek, R. Doering, K. Kreyssig, B. Michel","doi":"10.1109/ESIME.2010.5464570","DOIUrl":"https://doi.org/10.1109/ESIME.2010.5464570","url":null,"abstract":"In board manufacturing the shear test is frequently used to evaluate the quality of the solder joints shortly after the soldering process as well as after thermal cycling. The latter evaluation is in particular applied to leadless ceramic components; a certain load drop is linked to solder degradation in a certain region of the joint which is declared “failed” if the load drop of the shear force reaches a predefined limit. However, there are many uncertainties in this evaluation like component misalignment to the shear tool, excessive voiding of the joint or by a fracture mode away from solder bulk failure. As few is known about these effects from a theoretical viewpoint, FE-studies have been performed to close this gap The analyses comprise studies of size effects, misalignment, and voiding on the shear force response. Additionally, the simulated solder creep response was compared to the measured one to check for the validity of creep laws for SAC solder. For a realistic creep rate range reached in low cycle fatigue, very low shear velocities have to be applied to the joints. A new shear tester was designed with shear velocities down to 1 nm/s to reach this goal.","PeriodicalId":152004,"journal":{"name":"2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"107 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115166115","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Simulation of drop testing at extremely high accelerations","authors":"S. Douglas, M. Al-Bassyiouni, A. Dasgupta","doi":"10.1109/ESIME.2010.5464528","DOIUrl":"https://doi.org/10.1109/ESIME.2010.5464528","url":null,"abstract":"Advances in drop tower technology have extended the range of obtainable accelerations in drop testing from 5,000 Gs to as much as 100,000 Gs. To achieve excitations in excess of the conventional 5,000 Gs, a mechanical accelerator, called the Dual Mass Shock Amplifier (DMSA), is mounted on the drop table. This device produces extremely high, short duration shock amplitudes, by using secondary impacts. In this study, we use transient finite element analysis with nonlinear contact elements, to assess the DMSA table acceleration response profile (height and width) as a function of different system parameters like DMSA design parameters, programmer configuration, drop height, etc. DMSA design variables include table weight, height of the rebound travel rods, stiffness of rebound springs, and rebound damper materials. The programmer configuration includes: (i) height, diameter, material and surface shape of the programmer cylinder that is placed between the drop table and the shock table; (ii) thickness and damping coefficients of the programmer layers placed between the DMSA base and DMSA table; (iii) programmer tubes between the DMSA table and the DMSA rebound stopper bar. Contact elements in the finite element analysis (FEA) are introduced between the shock and drop tables and also between the DMSA base, DMSA table and DMSA rebound stopper bar. Specimen fixtures of different weights are introduced on the DMSA table to see the effect of the payload weight. The effect of these variables in the DMSA table acceleration profile are parametrically explored.","PeriodicalId":152004,"journal":{"name":"2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"248 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115755934","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Prediction of stiction in microswitch systems","authors":"Ling Wu, V. Rochus, L. Noels, J. Golinval","doi":"10.1109/ESIME.2010.5464599","DOIUrl":"https://doi.org/10.1109/ESIME.2010.5464599","url":null,"abstract":"Stiction is a major failure mode of MEMS as microscopic structures tend to adhere to each other when their surfaces enter into contact. Although increasing the restoring forces of switch devices could overcome the stiction effect, this is not practical, as in turn, it also increases the actuation voltage. Therefore stiction prediction is important to be considered when designing micro- and nano- devices. In this paper, the numerical prediction of stiction for capacitive MEMS switches is considered. Toward this end, a micro-adhesive-contact law is derived from previous work and combined with a finite-element model.","PeriodicalId":152004,"journal":{"name":"2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"451 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115867097","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Numerical-experimental analysis of combined bulk and interface fracture in a leadless package","authors":"S. Noijen, S. Walczyk, Roelf Groenhuis, O. van der Sluis","doi":"10.1109/ESIME.2010.5464532","DOIUrl":"https://doi.org/10.1109/ESIME.2010.5464532","url":null,"abstract":"In the 1960's surface mounted technology was developed. This technology as an alternative for through-hole technology made it easier to place components on both sides of the board by soldering, decreased package sizes, simplified assembly and reduced costs. Furthermore, higher mechanical robustness was obtained. In this paper, a numerical-experimental study is performed to investigate the robustness of two surface mounted devices (SMDs) under EN 60068-2-21:1999 Test Ue1 ‘Robustness of Terminations and Integral Mounting Devices: Substrate Bending Test’ as described in [1]. The relevant failure modes, body cracks between the pads and delamination of the leadframe/plastic interface is identified by experiments. Numerical analysis is carried out to explain the occurring failure and to explain differences between the two SMDs under investigation. First, straight-forward stress analysis gives insight in the stress distribution of the plastic body. As this analysis cannot explain the occurring delamination cohesive zone modeling is used to investigate the delamination sensitivity of the leadframe/EMC interfaces. These results give insight in the failure mechanism but do not explain the differences between the two SMDs. Therefore, a third numerical analysis with combined bulk and interface fracture is performed. This analysis is capable to explain the failure mechanism and the differences between the two SMD packages. This work shows that for this specific example more advanced numerical analysis is needed to explain the actual failure behavior of semiconductor packages.","PeriodicalId":152004,"journal":{"name":"2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126383516","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Interconnection technologies for photovoltaic modules - analysis of technological and mechanical problems","authors":"S. Wiese, F. Kraemer, Norbert Betzl, Dietmar Wald","doi":"10.1109/ESIME.2010.5464518","DOIUrl":"https://doi.org/10.1109/ESIME.2010.5464518","url":null,"abstract":"The paper describes the problems of interconnecting single solar cells with each other to create a photovoltaic module. High power und low voltages demand the transport of high currents through the interconnection wires. The resistance of the wiring is crucial, because it significantly influences the total module efficiency. However, increasing the width and height of the rectangular wires leads to significant mechanical problems, because the brittle silicon solar cells are prone to breakage. Therefore innovations in interconnection technologies are needed to release mechanical stresses during the assembly process.","PeriodicalId":152004,"journal":{"name":"2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"40 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127264789","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Numerical simulations of thermo-mechanical stresses during the casting of multi-crystalline silicon ingots","authors":"M. Oswald, M. Turek, J. Bagdahn","doi":"10.1109/ESIME.2010.5464525","DOIUrl":"https://doi.org/10.1109/ESIME.2010.5464525","url":null,"abstract":"Silicon is an important semiconductor substrate for manufacturing solar cells. The mechanical and electrical properties of multi-crystalline silicon (mc-Si) are primarily influenced by the quality of the feedstock material and the crystallization process. In this work, numerical calculations, applying finite element analysis (FEA) and finite volume methods (FVM) are presented, in order to predict thermo-mechanical stresses during the solidification of industrial size mc-Si ingots. A two-dimensional global model of an industrial multi-crystallization furnace was created for thermal stationary and time-dependent calculations using the software tool CrysMAS. Subsequent thermo-mechanical analyses of the silica crucible and the ingot were performed with the FEA code ANSYS, allowing additional calculations to define mechanical boundary conditions as well as material models. Our results show that thermal analyses are in good agreement with experimental measurements. Furthermore we show that our approach is suitable to describe the generation of thermo-mechanical stress within the silicon ingot.","PeriodicalId":152004,"journal":{"name":"2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"47 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127674740","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Global modelling and simulation of a Coriolis vibrating micro-gyroscope for quadrature error compensation","authors":"M. Descharles, J. Guerard, H. Kokabi","doi":"10.1109/ESIME.2010.5464608","DOIUrl":"https://doi.org/10.1109/ESIME.2010.5464608","url":null,"abstract":"ONERA has been developing a Coriolis Vibrating Gyroscope (CVG) named VIG (Vibrating Integrated Gyro). The fabrication process generates structural defects which induce asymetries in the tunning fork geometry. It results in undesirable quadrature error which limitates the performance by increasing sensitivity to phase and temperature variation and causing poor bias stability. This paper deals with the global modelling of the VIG to improve its performances by compensating quadrature error. A full model of the micro-gyroscope is presented, covering mechanical and electrical aspects. The analysis of its performances is focused on mechanical coupling and aims at implementing a solution to improve bias stability by 7 times.","PeriodicalId":152004,"journal":{"name":"2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"72 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127014274","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"FEM assisted development of a SHM-piezo-package for damage evaluation in airplane components","authors":"M. Roellig, L. Schubert, U. Lieske, B. Boehme, B. Frankenstein, N. Meyendorf","doi":"10.1109/ESIME.2010.5464585","DOIUrl":"https://doi.org/10.1109/ESIME.2010.5464585","url":null,"abstract":"Structural Health Monitoring (SHM) is a wide spread field for material condition observation of differential structure components. At the IZFP the guided wave (Lamb wave) technology is under higher investigation. Actual investigations are in progress to apply SHM-systems at structures in airplanes to perform condition monitoring. New materials like Carbon Fibre Reinforced Plastics (CFRP) will be placed in airplanes partially, because they provide very high stiffness, high rupture strength and reduced total mass. These SHM-systems are using different damage indicators, which are based on differences in amplitude or phase relation between two measured signals at two different times points (condition). Additionally, these signals are affected by environmental loads, sensor setup and changes in material properties of the adhesive layer. A successful material application can only be achieved by using an integrated reliable SHM-system. The validation of reliability comes along with high probability of detection and high robustness regarding environmental loads. This study tests and analyses the robustness of a novel piezo-sensor-package. The sensor package is very slim and consists of LTCC ceramic, which encloses a PZT piezo ceramic sheet and carries electronic components on its surface. Using the piezoelectric effect the package generates lamb waves and transmits them into a base substrate. The package is assembled on a 2 mm (thick) aluminium plate for study purposes, because aluminium possesses an isotropic material behaviour. Frequency ranges from 25 kHz up to 400 kHz produce excited symmetrical S0 and asymmetrical A0 lamb waves that are guided into the aluminium plate. Subsequently, a FEM-model of the package is calibrated to ensure correct physical behaviour of the simulation using analytical solutions of lamb wave propagation and experimental data. The calibration of the FEM-model provides the base for further investigations. The principle of wave propagation based on the new package configuration is studied and effects resulting from the package shape and construction are defined. Also, influences of the adhesive layer between the ceramic package and the aluminium plate are determined as a function of thickness and temperature depended stiffness and for the case of a delaminating progress.","PeriodicalId":152004,"journal":{"name":"2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126651564","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Evaluating the effect of shock absorber layers in the dynamic behavior of PWB with viscoelastic insert","authors":"C. Pagliosa, Joao Morais da Silva Neto","doi":"10.1109/ESIME.2010.5464609","DOIUrl":"https://doi.org/10.1109/ESIME.2010.5464609","url":null,"abstract":"Portable electronic devices are prone to shock impact and vibration loads in real use environment, e.g., when a portable device is dropped into the floor, resulting in stresses in electrical interconnects that may lead to catastrophic failures. During an impact event, the printed wiring board (PWB) may undergo excessive flexing and high stress levels arise in solder joints due to the relative motion between the PWB substrate and the components mounted on it. Minimizing the resonant vibrations of the PWB would lead to lower stress levels in solder joints, and in turn, reduction in failure risks. PWBs, which are multilayer composite structures, usually have a glass-fiber reinforced resin substrate. In this study, it is proposed a modification of the substrate in order to reduce the amplitude of ressonant vibrations, consisting in the insertion of viscoelastic damping layers into the laminate. The effect of thin damping layers in the dynamic behaviour of PWBs is investigated through numeric simulations. A finite element (FE) model of a conventional PWB substrate is built and validated through experimental testing. The validated FE model is modified adding damping layers with viscoelastic material properties previously determined, and the responses of different laminate layups determined from virtual tests are compared with the response of the actual rigid PWB.","PeriodicalId":152004,"journal":{"name":"2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123706600","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}