{"title":"光伏组件互连技术。技术和机械问题的分析","authors":"S. Wiese, F. Kraemer, Norbert Betzl, Dietmar Wald","doi":"10.1109/ESIME.2010.5464518","DOIUrl":null,"url":null,"abstract":"The paper describes the problems of interconnecting single solar cells with each other to create a photovoltaic module. High power und low voltages demand the transport of high currents through the interconnection wires. The resistance of the wiring is crucial, because it significantly influences the total module efficiency. However, increasing the width and height of the rectangular wires leads to significant mechanical problems, because the brittle silicon solar cells are prone to breakage. Therefore innovations in interconnection technologies are needed to release mechanical stresses during the assembly process.","PeriodicalId":152004,"journal":{"name":"2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"40 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2010-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"21","resultStr":"{\"title\":\"Interconnection technologies for photovoltaic modules - analysis of technological and mechanical problems\",\"authors\":\"S. Wiese, F. Kraemer, Norbert Betzl, Dietmar Wald\",\"doi\":\"10.1109/ESIME.2010.5464518\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The paper describes the problems of interconnecting single solar cells with each other to create a photovoltaic module. High power und low voltages demand the transport of high currents through the interconnection wires. The resistance of the wiring is crucial, because it significantly influences the total module efficiency. However, increasing the width and height of the rectangular wires leads to significant mechanical problems, because the brittle silicon solar cells are prone to breakage. Therefore innovations in interconnection technologies are needed to release mechanical stresses during the assembly process.\",\"PeriodicalId\":152004,\"journal\":{\"name\":\"2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)\",\"volume\":\"40 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2010-04-26\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"21\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ESIME.2010.5464518\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESIME.2010.5464518","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Interconnection technologies for photovoltaic modules - analysis of technological and mechanical problems
The paper describes the problems of interconnecting single solar cells with each other to create a photovoltaic module. High power und low voltages demand the transport of high currents through the interconnection wires. The resistance of the wiring is crucial, because it significantly influences the total module efficiency. However, increasing the width and height of the rectangular wires leads to significant mechanical problems, because the brittle silicon solar cells are prone to breakage. Therefore innovations in interconnection technologies are needed to release mechanical stresses during the assembly process.