Optimization of PCB build-up layer configuration for electronic assemblies with active embedded components in the board

The manufacturing process of Printed Circuit Boards (PCB) with embedded active components requires several modifications on the build-up layer configuration, including the use of thinner layers and heterogeneous composite materials. From the point of view of second level interconnects the increase in density and complexity of the build-up of electronic board leads to an increase of the total resin-content. As demonstrated in a previous work, this increase of the ratio between resin and glass has a major consequence on the mechanical behavior of the assemblies, particularly on the fatigue resistance of component solder joints.