2008 2nd Electronics System-Integration Technology Conference最新文献_第5页

Analytical model of adhesion for analyzing biological and synthetic nanostructured fibrillar adhesive pads 用于分析生物和合成纳米结构纤维粘合垫的粘附分析模型

2008 2nd Electronics System-Integration Technology Conference Pub Date : 2008-11-21 DOI: 10.1109/ESTC.2008.4684515

H. Parsaiyan, F. Barazandeh, S. M. Rezaei, M. Safdari

引用次数: 2

Aerospace and electronic systems prognostic health management 航空航天和电子系统预测健康管理

2008 2nd Electronics System-Integration Technology Conference Pub Date : 2008-11-21 DOI: 10.1109/ESTC.2008.4684329

J. Vian

{"title":"Aerospace and electronic systems prognostic health management","authors":"J. Vian","doi":"10.1109/ESTC.2008.4684329","DOIUrl":"https://doi.org/10.1109/ESTC.2008.4684329","url":null,"abstract":"The first 100 years of powered flight witnessed amazing strides in developing safe and economically viable aircraft by focusing on component reliability and system redundancy. More recent times have seen significant improvements in aircraft performance due in large part to more efficient engines, new lighter weight composite materials, and advanced electronics. An opportunity is now on the horizon to achieve even greater operational value, and to enable new capabilities, through the introduction of prognostic health management (PHM) technology into these systems. The field of prognostics has generally focused on methods to determine functional degradation of components with a goal of estimating remaining useful life of systems such that maintenance actions can be performed in a cost effective manner. PHM methods have benefited greatly from recent advances in sensing, computational intelligence algorithms, and microprocessors. Many systems are now able to continuously determine their own condition and capabilities, thus creating the opportunity for real-time reconfiguration and mission adaptation. This ability to characterize component and system performance limits in real-time stands to spawn a new era of control systems research that will move well beyond traditional adaptive control using parameter identification. These traits of self-awareness and adaptability are seen as essential to retaining mission reliability as systems become more complex, highly coupled, and autonomous. This presentation provides an overview of aerospace systems PHM applications, discusses several technical and economic challenges associated with electronics PHM, and describes how PHM technology is seen as an enabler for reliable autonomous systems operations.","PeriodicalId":146584,"journal":{"name":"2008 2nd Electronics System-Integration Technology Conference","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-11-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132718777","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Unsteady CFD modelling of turbulent flows for electronics 电子学湍流的非定常CFD建模

2008 2nd Electronics System-Integration Technology Conference Pub Date : 2008-11-21 DOI: 10.1109/ESTC.2008.4684516

J. Tyacke, P. Tucker, P. Nithiarasu

引用次数: 1

Electrical property of conductive adhesives using silver-coated copper filler 镀银铜填料导电胶粘剂的电性能

2008 2nd Electronics System-Integration Technology Conference Pub Date : 2008-11-21 DOI: 10.1109/ESTC.2008.4684458

H. Nishikawa, S. Mikami, N. Terada, K. Miyake, A. Aoki, T. Takemoto

引用次数: 10

Nanoparticle synthesis and formation of composite solder for harsh environments 纳米粒子的合成和恶劣环境下复合焊料的形成

2008 2nd Electronics System-Integration Technology Conference Pub Date : 2008-11-21 DOI: 10.1109/ESTC.2008.4684476

R. Ashayer, A. Cobley, O. Mokhtari, S. Mannan, S. Sajjadi, T. Mason

引用次数: 7

Application of genetic algorithm in numerical multi-objective optimization of ceramic capacitors 遗传算法在陶瓷电容器多目标优化中的应用

2008 2nd Electronics System-Integration Technology Conference Pub Date : 2008-11-21 DOI: 10.1109/ESTC.2008.4684378

L. Dowhan, A. Wymyslowski, J. Felba, S. Wiese, K. Wolter

{"title":"Application of genetic algorithm in numerical multi-objective optimization of ceramic capacitors","authors":"L. Dowhan, A. Wymyslowski, J. Felba, S. Wiese, K. Wolter","doi":"10.1109/ESTC.2008.4684378","DOIUrl":"https://doi.org/10.1109/ESTC.2008.4684378","url":null,"abstract":"Passive electronic elements such as capacitors and resistors are the most numerous parts used in electronics. In this paper, the ceramic capacitors were taken in the consideration. The purpose was to improve the reliability of such elements by carrying out the numerical multiobjective optimization process. In such components the reliability is strictly related to thermal-mechanical integrity. The key factor in such structures is the residual stress which occurs due to the differences of thermal expansion coefficients between the layers. To minimize the risk of failure (i.e. cracking, delamination) the 3D numerical parametric model of CC structure was elaborated using the finite element method. Afterwards, in order to minimize the failure risk in the crucial areas of the capacitor, the multi-objective optimization process was designed and carried out. To obtain the global extrema, as a result of the multi- objective optimization process, the classic genetic algorithm was applied. The idea of these algorithms is taken from the biology. They base on the natural evolution process in which the best suited individuals are taken for creating the next population. As a result, the best individuals survive and represent the optimization's solutions. In the investigation the self-made optimization tool was used. The tool was made in Python scripting language and it has implemented the multi-objective algorithms and methods that allow to apply and to optimize the numerical models (i.e. made in Ansys or Abaqus).","PeriodicalId":146584,"journal":{"name":"2008 2nd Electronics System-Integration Technology Conference","volume":"350 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-11-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133877829","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Electrofunctional polymer nanocomposites 电功能聚合物纳米复合材料

2008 2nd Electronics System-Integration Technology Conference Pub Date : 2008-11-21 DOI: 10.1109/ESTC.2008.4684561

G. Rebord, N. Hansrisuk, B. Lindsay, C. Lekakou, G. Reed, J. Watts

引用次数: 4

Room temperature sintering mechanism of Ag nanoparticle paste 银纳米颗粒膏体的室温烧结机理

2008 2nd Electronics System-Integration Technology Conference Pub Date : 2008-11-21 DOI: 10.1109/ESTC.2008.4684473

D. Wakuda, Chang-Jae Kim, Keun-Soo Kim, K. Suganuma

引用次数: 11

Thermo-mechanical damage accumulation during power cycling of lead-free surface mount solder joints 无铅表面贴装焊点在电源循环过程中的热机械损伤积累

2008 2nd Electronics System-Integration Technology Conference Pub Date : 2008-11-21 DOI: 10.1109/ESTC.2008.4684502

P. Hegde, D. Whalley, V. Silberschmidt

{"title":"Thermo-mechanical damage accumulation during power cycling of lead-free surface mount solder joints","authors":"P. Hegde, D. Whalley, V. Silberschmidt","doi":"10.1109/ESTC.2008.4684502","DOIUrl":"https://doi.org/10.1109/ESTC.2008.4684502","url":null,"abstract":"It is well known that in surface mount technology (SMT), thermal strains in electronic assemblies are induced in the solder joints by the mismatch between the coefficients of thermal expansion (CTE) of the components, substrate and solder, both during their processing and in service. Therefore, thermo-mechanical damage is likely to occur in the solder and the principle reliability hazard in SMT assemblies is the resulting fatigue cracking of the solder fillet, caused by cyclic thermal stresses. These stresses may be caused by both cyclic variations in power dissipation within equipment and by external environmental temperature changes. Most work reported to date has focused on the effects of environmental temperature changes, although for many types of equipment power cycling may result in significant stresses. The present paper describes the experimental determination of the actual temperature distribution in a chip resistor assembly when it is powered. The paper also discusses the significance of such experimentally determined non-uniform temperature distributions in electronic assemblies to fatigue damage accumulation due to both power cycling and to cyclic variations in the ambient temperature whilst the chip resistor is powered. This fatigue damage accumulation study is carried out using finite element analysis.","PeriodicalId":146584,"journal":{"name":"2008 2nd Electronics System-Integration Technology Conference","volume":"306 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-11-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116591285","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Design, modeling and characterization of a microinductor for future DC-DC power converters 用于未来DC-DC功率变换器的微电感的设计、建模和表征

2008 2nd Electronics System-Integration Technology Conference Pub Date : 2008-11-21 DOI: 10.1109/ESTC.2008.4684414

D. Flynn, Hua Lu, C. Bailey, M. Desmulliez

引用次数: 1