镀银铜填料导电胶粘剂的电性能

H. Nishikawa, S. Mikami, N. Terada, K. Miyake, A. Aoki, T. Takemoto
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引用次数: 10

摘要

作为导电胶粘剂中常用的金属填料,银因其高导电性和稳定性是最常用的。然而,使用银填料的导电胶粘剂的成本比通常的无铅焊料要高得多,因此,铜由于其低电阻率和低成本而成为导电填料金属的有希望的候选者,但氧化会导致这种金属失去其导电性。本文研究了以表面改性铜为填料的各向同性导电胶粘剂。特别是,为了克服铜的氧化问题,在银上涂覆了铜填料,并对镀银铜作为填充金属进行了测试。结果表明,经养护和可靠性试验,镀银铜填料的ICA的电阻明显低于含铜填料的ICA的电阻,且稳定性更好。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Electrical property of conductive adhesives using silver-coated copper filler
As metal fillers used in conductive adhesives, silver is the most commonly used due to its high conductivity and the stability. However the cost of conductive adhesives with silver fillers is much higher than usual lead-free solders So, copper can be a promising candidate for conductive filler metal due to its low resistivity and low cost, but oxidation causes this metal to lose its conductivity. In this study, isotropic conductive adhesives (ICAs) using surface modified copper fillers were developed. Especially, in order to overcome the problem associated with the oxidation of copper, the silver was coated with copper filler, and the silver-coated copper was tested as a filler metal. As a result, it was found that the electrical resistance of ICA with silver-coated copper filler was clearly lower and more stable than that of ICA with copper filler after curing and after reliability tests.
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