2008 2nd Electronics System-Integration Technology Conference最新文献_第10页

Modelling and simulation of simple mechatronic system - position control solution based on linear variable inductor displacement transducer 简单机电系统的建模与仿真——基于线性可变电感位移传感器的位置控制方案

2008 2nd Electronics System-Integration Technology Conference Pub Date : 2008-11-21 DOI: 10.1109/ESTC.2008.4684354

A. Drumea, A. Vasile, P. Svasta, I. Ilie

引用次数: 2

Influence of megasonic agitation on the electrodeposition of high aspect ratio blind vias 超声速搅拌对高纵横比盲孔电沉积的影响

2008 2nd Electronics System-Integration Technology Conference Pub Date : 2008-11-21 DOI: 10.1109/ESTC.2008.4684530

J. Kaufmann, M. Desmulliez, D. Price, M. Hughes, N. Strussevich, Chris Bailey

{"title":"Influence of megasonic agitation on the electrodeposition of high aspect ratio blind vias","authors":"J. Kaufmann, M. Desmulliez, D. Price, M. Hughes, N. Strussevich, Chris Bailey","doi":"10.1109/ESTC.2008.4684530","DOIUrl":"https://doi.org/10.1109/ESTC.2008.4684530","url":null,"abstract":"This paper presents preliminary studies in electroplating using megasonic agitation to avoid the formation of voids within high aspect ratio microvias that are used for the redistribution of interconnects in high density interconnection technology in printed circuit boards. Through this technique, uniform deposition of metal on the side walls of the vias is possible. High frequency acoustic streaming at megasonic frequencies enables the decrease of the Nernst diffusion layer down to the sub-micron range, allowing thereby conformal electrodeposition in deep grooves. This effect enables the normally convection free liquid near the surface to be agitated. Higher throughput and better control of the material properties of the deposits can be achieved for the manufacturing of embedded interconnections and metal-based MEMS. For optimal filling performance of the microvias, a full design of experiments (DOE) and a multi-physics numerical simulation have been conducted to analyse the influence of megasonic agitation on the plating quality of the microvias. Megasonic based deposition has been found to increase the deposition rate as well as improving the quality of the metal deposits.","PeriodicalId":146584,"journal":{"name":"2008 2nd Electronics System-Integration Technology Conference","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-11-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125346916","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Embedded test & health monitoring strategies for bio-fluidic microystems 生物流体微系统的嵌入式测试和健康监测策略

2008 2nd Electronics System-Integration Technology Conference Pub Date : 2008-11-21 DOI: 10.1109/ESTC.2008.4684386

H. Liu, A. Richardson, T. Harvey, T. Ryan, C. Pickering

引用次数: 7

Modelling and prototyping the conceptual design of 3D CMM micro-probe 三维三坐标测量机微探头概念设计的建模与原型设计

2008 2nd Electronics System-Integration Technology Conference Pub Date : 2008-11-21 DOI: 10.1109/ESTC.2008.4684348

S. Stoyanov, C. Bailey, R. Leach, B. Hughes, A. Wilson, W. O'Neill, R. Dorey, C. Shaw, D. Underhill, H. Almond

{"title":"Modelling and prototyping the conceptual design of 3D CMM micro-probe","authors":"S. Stoyanov, C. Bailey, R. Leach, B. Hughes, A. Wilson, W. O'Neill, R. Dorey, C. Shaw, D. Underhill, H. Almond","doi":"10.1109/ESTC.2008.4684348","DOIUrl":"https://doi.org/10.1109/ESTC.2008.4684348","url":null,"abstract":"This paper details the prototyping of a novel three axial micro probe based on utilisation of piezoelectric sensors and actuators for true three dimensional metrology and measurements at micro- and nanometre scale. Computational mechanics is used first to model and simulate the performance of the conceptual design of the micro-probe. Piezoelectric analysis is conducted to understand performance of three different materials - silicon, glassy carbon, and nickel - and the effect of load parameters (amplitude, frequency, phase angle) on the magnitude of vibrations. Simulations are also used to compare several design options for layout of the lead zirconium titanate (PZT) sensors and to identify the most feasible from fabrication point of view design. The material options for the realisation of the device have been also tested. Direct laser machining was selected as the primary means of production. It is found that a Yb MOPA based fiber laser was capable of providing the necessary precision on glassy carbon (GC), although machining trials on Si and Ni were less successful due to residual thermal effects.To provide the active and sensing elements on the flexures of the probe, PZT thick films are developed and deposited at low temperatures (Lt720 degC) allowing a high quality functional ceramic to be directly integrated with selected materials. Characterisation of the materials has shown that the film has a homogenous and small pore microstructure.","PeriodicalId":146584,"journal":{"name":"2008 2nd Electronics System-Integration Technology Conference","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-11-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125096229","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 16

In-situ temperature monitoring for process control in laser assisted polymer bonding for MEMS packaging 用于MEMS封装激光辅助聚合物键合过程控制的现场温度监测

2008 2nd Electronics System-Integration Technology Conference Pub Date : 2008-11-21 DOI: 10.1109/ESTC.2008.4684349

Yufei Liu, J. Zeng, Changhai Wang

{"title":"In-situ temperature monitoring for process control in laser assisted polymer bonding for MEMS packaging","authors":"Yufei Liu, J. Zeng, Changhai Wang","doi":"10.1109/ESTC.2008.4684349","DOIUrl":"https://doi.org/10.1109/ESTC.2008.4684349","url":null,"abstract":"Laser assisted polymer bonding is a novel promising technique for MEMS packaging. In this method, a thermally cured polymer seal using localised laser heating is used to produce a microcavity between a capping substrate and a MEMS chip or wafer. The cavity is necessary to protect the fragile micromechanical structures of the MEMS devices in the subsequent manufacturing processes after wafer fabrication and to provide a stable environment for operation. The laser based bonding method is a fast process and can reduce/eliminate the potential damage to temperature sensitive devices during packaging. However, due to the localised nature of the temperature rise it is difficult to monitor the temperature change precisely during the bonding process using conventional methods. In this paper we present the development of thin film miniature temperature sensors for in-situ processing monitoring in the laser assisted polymer bonding process for MEMS packaging. Distributed temperature sensors are fabricated on the substrate and are successfully used to monitor the in-situ temperature rise and distribution in the bonding process.","PeriodicalId":146584,"journal":{"name":"2008 2nd Electronics System-Integration Technology Conference","volume":"150 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-11-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123432339","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Design and fabrication of an epoxy flow stopper with convex corner compensation of V-grooves on a silicon optical bench for the passive alignment of optical fibers 光纤被动对准用v型槽凸角补偿环氧流塞的设计与制造

2008 2nd Electronics System-Integration Technology Conference Pub Date : 2008-11-21 DOI: 10.1109/ESTC.2008.4684369

J. Lam, S. Lee

{"title":"Design and fabrication of an epoxy flow stopper with convex corner compensation of V-grooves on a silicon optical bench for the passive alignment of optical fibers","authors":"J. Lam, S. Lee","doi":"10.1109/ESTC.2008.4684369","DOIUrl":"https://doi.org/10.1109/ESTC.2008.4684369","url":null,"abstract":"In this paper, a stopper mechanism is introduced to control the length of the epoxy flow in the V-grooves. In fact, such a stopper is another V-groove which is perpendicular to the V-grooves for passive fiber alignment. During the fabrication of prototypes, one critical issue was identified. Due to the undercutting of wet etching, the right angles at the intersection of the stopper and alignment V-grooves were severely eroded by the etching solution. Consequently the intended ldquocrossrdquo intersection became a diamond shaped area. As a result, the length of epoxy flow could not be precisely controlled. During the course of the present study, a convex corner compensation scheme was implemented to resolve the undercutting problem. A parametric study was performed with various kinds of redundant silicon beam patterns at the corners of the intersection. Experimental results showed that relatively sharp corners could be achieved with certain compensation patterns. Furthermore, the epoxy flow did indeed stop when the flow hit the intersection of the stopper and the V-grooves. The design and processing parameters for the epoxy flow stopper and the convex corner compensation scheme will be discussed in detail in this paper.","PeriodicalId":146584,"journal":{"name":"2008 2nd Electronics System-Integration Technology Conference","volume":"35 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-11-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123623549","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Hybrid integration for a low cost telecommunication component 用于低成本电信组件的混合集成

2008 2nd Electronics System-Integration Technology Conference Pub Date : 2008-11-21 DOI: 10.1109/ESTC.2008.4684508

L. Maggi, S. Lorenzotti, D. Caccioli

引用次数: 0

Reliability evaluation and structure design optimization of Wafer Level Chip Scale Packaging (WLCSP) 晶圆级芯片规模封装(WLCSP)可靠性评估与结构设计优化

2008 2nd Electronics System-Integration Technology Conference Pub Date : 2008-11-21 DOI: 10.1109/ESTC.2008.4684436

Shan Gao, Jupyo Hong, Jinsu Kim, Jingu Kim, Seogmoon Choi, S. Yi

{"title":"Reliability evaluation and structure design optimization of Wafer Level Chip Scale Packaging (WLCSP)","authors":"Shan Gao, Jupyo Hong, Jinsu Kim, Jingu Kim, Seogmoon Choi, S. Yi","doi":"10.1109/ESTC.2008.4684436","DOIUrl":"https://doi.org/10.1109/ESTC.2008.4684436","url":null,"abstract":"In this study a WLCSP structure in microelectronic application is considered. In the current development of WLCSP solder post is used to bridge the die and solder bump to release part of the stress concentration caused by mismatch of Thermal Expansion Coefficient (CTE). Thermal cycle reliability analysis on solder joints with 3D finite element simulation is firstly carried out. The stress/creep strain distribution and evolution are analyzed and the fatigue lives of solder joints are estimated. Finite element model is also verified and the fatigue property of currently used solder is determined with JEDEC thermal cycle reliability test. Structure design optimization is thereafter performed to improve the reliability of WLCSP. Parametric studies on the geometry structures are carried out, such as die thickness, solder post height and solder bump diameter, etc. The results show that solder post does great help to improve the solder bumpspsila reliability, the height of which plays an important role in controlling the fatigue life of the package. Higher post helps to release the stress concentration and therefore extend the fatigue life of solder bumps. In addition, die thickness plays the most important role in affecting fatigue life of solder joints. The thinner the die, the better the reliability of WLCSP is. Other parameters, such as the diameter of the solder bump, only have tiny effect on the solder joints reliability of WLCSP.","PeriodicalId":146584,"journal":{"name":"2008 2nd Electronics System-Integration Technology Conference","volume":"64 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-11-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121689345","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 9

Optimizing CPW to MSL transition in the mm domain thanks to the LP filter theory 基于LP滤波理论，优化了在mm域的CPW到MSL的转换

2008 2nd Electronics System-Integration Technology Conference Pub Date : 2008-11-21 DOI: 10.1109/ESTC.2008.4684405

J. R. Cubillo, J. Gaubert, S. Bourdel

引用次数: 0

Material characterization of organic packaging materials to increase the accuracy of FEM based stress analysis 有机包装材料的材料表征，提高有限元应力分析的精度

2008 2nd Electronics System-Integration Technology Conference Pub Date : 2008-11-21 DOI: 10.1109/ESTC.2008.4684391

B. Boehme, M. Roellig, K. Wolter

{"title":"Material characterization of organic packaging materials to increase the accuracy of FEM based stress analysis","authors":"B. Boehme, M. Roellig, K. Wolter","doi":"10.1109/ESTC.2008.4684391","DOIUrl":"https://doi.org/10.1109/ESTC.2008.4684391","url":null,"abstract":"Organic packaging materials gain a steady increasing importance for electronics packaging assemblies. They are used in various ways in substrate materials, adhesives, encapsulations, underfills and many more. This paper outlines the importance of thermo-mechanical characterization of these polymeric packaging materials to improve the accuracy of Finite Element Modeling for advanced reliability analysis of electronics packaging solutions. Therefore the effects of including temperature-and time dependent mechanical material properties of a PPS molding compound were investigated. This molding compound should be used as a coupling element to decrease the occurring stresses in an array of solder connections between substrate and package. The setup was analyzed by FEM (Finite Element Modeling). For the material characterization a DMA 2980 equipment was utilized to determine the time- and temperature dependent elongation modulus of the molding compound material. A description of the measurement setup and parameter selection is given. Subsequently the measurement results are presented. To use this measurement results in a material model for time dependent elongation modulus the results needed to be fitted to a Prony series model which allows implementing this complex material behavior in the FEM simulation software Ansysreg. Additional the WLF (Williams-Landel-Ferry) shift function was determined and implemented to add the temperature effect to the viscoelastic material data used for simulation. For the stress analysis the package setup was implemented as geometric model of the real structure and the loading conditions were defined. The simulations showed that there are significant differences in the occurring stress levels in the setup. For higher temperatures the stress levels were decreased due to stress relaxation in the polymer.","PeriodicalId":146584,"journal":{"name":"2008 2nd Electronics System-Integration Technology Conference","volume":"167 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-11-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121708724","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 9