2008 2nd Electronics System-Integration Technology Conference最新文献

{"title":"Laser based fast prototyping methodology of producing stretchable and conformable electronic systems","authors":"F. Axisa, F. Bossuyt, T. Vervust, J. Vanfleteren","doi":"10.1109/ESTC.2008.4684558","DOIUrl":"https://doi.org/10.1109/ESTC.2008.4684558","url":null,"abstract":"For user comfort and reliability reasons, electronic circuits for human body related applications should ideally be soft, elastic and stretchable, for smart textile application, but also for applications which need a high level of biocompatibility. We are developing several roll-to roll technologies using MID (Molded Interconnect Device) and low cost standard PCB technology (Printed Circuit Board) to produce soft, stretchable, human-compatible packaging. All those technologies are based on a sacrificial layer on where meander shaped interconnections are patterned. Those stretchable interconnections are connecting together non-stretchable functional islands on where SMD components are soldered. All the system is then embedded in stretchable polymer matrix, silicone rubber or polyurethane. All these technologies are using standards methodologies for PCB productions (lamination, photolithography, copper etching, reflow oven lead free soldering). A fast prototyping technology has been developed to ease the development of stretchable electronic circuits. Less than 1 day is necessary from CAD design to finalization: Rigid or flexible standard components or electronic sub-systems are interconnected with YAG laser shaped meander interconnections and molded in silicone rubber afterwards. From any kind of flexible circuit, stretchable circuit can be produced using this methodology. The stretchable meander interconnection can be stretched more than 100% and can sustain at least 3000 cycles at 20% of deformation. This paper presents a general overview of stretchable electronic process, a detailed view of the fast prototyping technology using YAG laser cutting, and the demonstrators developed in the frame of the European project STELLA (Stretchable Electronic for large area) [7] and in the Belgian project SWEET (Stretchable and washable electronic in textile) [8] and BIOFLEX (Biocompatible stretchable electronic system) [9].","PeriodicalId":146584,"journal":{"name":"2008 2nd Electronics System-Integration Technology Conference","volume":"315 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-11-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132184412","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"NanoFlux — doping of solder pastes","authors":"P. Zerrer, A. Fix, M. Hutter, U. Pape","doi":"10.1109/ESTC.2008.4684475","DOIUrl":"https://doi.org/10.1109/ESTC.2008.4684475","url":null,"abstract":"The reliability of automotive electronics depends a great deal on solder joints. After the WEEE and RoHS came into effect the new focus became lead-free solder pastes such as SnAg or SnAgCu (SAC). One approach to improve the thermal fatigue properties of these alloys is to add a third or fourth alloying element SAC + X. Until now, this was always done by metallurgical alloying, requiring special apparatuses, conditions and, exceptional processing expertise. Hence, it is even more difficult and more expensive to produce a powder out of these alloys.The project \"nanoFlux\", funded by the German federal ministry of research and education, is a new approach to alloy special elements into a solder joint during a conventional reflow process used in SMD technology. A standard powder is mixed with a flux containing Al, Co, Fe, or mixtures of these elements. NanoFlux should not significantly influence the melting point or the pasty range to be used in established lead-free processes. This could drastically lower the costs for the manufacturing and storage of special alloys. Recent results already show successful alloying for Co and Fe. The thermal properties were monitored during an insitu reflow differential scanning calorimeter (DSC) experiment. To verify a successful doping, reflowed, cleaned, and dissolved solder balls were analysed by inductively coupled plasma optical emission spectroscopy (ICP OES). Parallel to those experiments, a test board was set up and a thermal cycle test has been conducted. The higher remaining shear strength was linked to the microstructural characteristics of the different solders, through scanning electron microscopy (SEM) and energy dispersive X-ray (EDX) analysis. It was possible to successfully dope a solder joint with a fourth element by mixing a Co or Fe containing flux with the solder powder.","PeriodicalId":146584,"journal":{"name":"2008 2nd Electronics System-Integration Technology Conference","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-11-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125627668","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"The IP landscape for photovoltaics","authors":"C. E. Bauer, H. Neuhaus","doi":"10.1109/ESTC.2008.4684322","DOIUrl":"https://doi.org/10.1109/ESTC.2008.4684322","url":null,"abstract":"The photovoltaic industry, originally established in the 1950s, remains far from financial parity with conventional energy sources. Nevertheless the intellectual property (IP) aspects of this field already encompass more than 3000 patents in the US alone not including a wide variety of enabling technologies not directly identified as photovoltaic! The authors review the relevant IP and organize it by generic technology categories. A unique mapping methodology provides greater understanding of the landscape of IP in the photovoltaic arena across a wide range of considerations including geography, IP development and ownership trends, infrastructure implications and application concepts. Finally, the authors also present a rudimentary valuation of IP within the photovoltaic field based on citation analysis.","PeriodicalId":146584,"journal":{"name":"2008 2nd Electronics System-Integration Technology Conference","volume":"50 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-11-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122586821","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Laser drilled through silicon vias: Crystal defect analysis by synchrotron x-ray topography","authors":"R. Landgraf, R. Rieske, A. Danilewsky, K. Wolter","doi":"10.1109/ESTC.2008.4684492","DOIUrl":"https://doi.org/10.1109/ESTC.2008.4684492","url":null,"abstract":"Three dimensional (3D) chip or wafer stacking and through silicon via (TSV) technologies are regarded as key technologies for next generation high-speed memories and microprocessors. In comparison to conventional chip technologies, three dimensional electrical networks allow much shorter wire lengths. This allows higher frequencies, less power consumption and smaller devices. A main technology to realise through silicon vias is laser drilling. Using laser drilling instead of deep reactive ion etching or the Bosch process makes masks unnecessary and thus allows great flexibility and lower costs. Today, vias with diameters of 10-80 mum are possible and can be laser drilled at speeds of about 2000 vias/s. However, laser drilling technology causes damages to the surrounding single-crystalline silicon. The paper surveys existing methods for defect structure analysis and evaluates them concerning their suitability for analysis of silicon TSV wafers. White beam X-ray topography at the synchrotron radiation source ANKA, Research Centre Karlsruhe, was selected as the best non-destructive method. For this paper three different laser types with normal (ns), short (ps) and ultra-short (fs) pulse width with varying parameter sets were used to drill TSVs into silicon wafers. For the first time, large area and section transmission topography were used to measure the strain affected zone around the TSVs. On the basis of these measurements femtosecond lasers were identified as superior to laser with longer pulse widths. The methodology presented in this paper is well suited for continuing studies with UV lasers and miniaturised vias, while at the same time electrical measurements become essential to finally answer how this affects the circuit performance of transistors, capacitors etc. adjacent to the through silicon vias.","PeriodicalId":146584,"journal":{"name":"2008 2nd Electronics System-Integration Technology Conference","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-11-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122628662","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Thermal optimization of 3D microcontacts using DOE and CFD analysis","authors":"N. Kafadarova, A. Andonova, S. Andreev, R. Arnaudov, S. Tzanova","doi":"10.1109/ESTC.2008.4684406","DOIUrl":"https://doi.org/10.1109/ESTC.2008.4684406","url":null,"abstract":"The present article describes an approach for optimization of thermal performance of 3D micro-components from pin-ring type implemented in IC package to PCB assembly and micro mechanical actuators by common use of DOE and CFD simulations. The goal of the considered approach is to define a real concurrent process for design of reliable microelectronic systems for specific applications. A model, containing all of the requisite design factors such as sizes, material and form was created using the commercially available CFD software, FLOTHERM. The results of simulation of test structures are verified by thermovision measurements by infrared camera P640 of FLIR. Advantages and disadvantages of different studied constructions of micro-contacts are analyzed in respect of better parameters of the process of heat transfer.","PeriodicalId":146584,"journal":{"name":"2008 2nd Electronics System-Integration Technology Conference","volume":"274 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-11-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122915241","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Collective hybridization of tantalum absorbers on a silicon thermistors array for X-ray spectro imaging devices","authors":"F. De Moro, A. Aliane, A. Gasse, P. Agnèse, H. Ribot, C. Pigot, J. Sauvageot, V. Szeflinski","doi":"10.1109/ESTC.2008.4684428","DOIUrl":"https://doi.org/10.1109/ESTC.2008.4684428","url":null,"abstract":"We are developing a low temperature X-ray spectro-imaging camera for astronomy concerns. A key technology for the success of this development is the flip chip collective hybridization of tantalum absorbers elements on a silicon thermistors array with pure indium solder as the thermal and mechanical link. This paper first describes the structure of the detector. Then, the 4 mains challenging steps of the collective hybridization of tantalum elements are detailed. In particular is discussed the properties of a new Ti/Au UBM suitable for In hybridization. Finally, first mechanical mock-ups are presented, showing collective hybridization of 8*8 tantalum pixels array with a 500 mum pitch on 5 mum thin brittle silicon membranes.","PeriodicalId":146584,"journal":{"name":"2008 2nd Electronics System-Integration Technology Conference","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-11-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121301834","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Effect of temperature on slumping behaviour of lead-free solder paste and its rheological simulation","authors":"A. Marks, S. Mallik, Nduka Nnamdi (Ndy) Ekere, A. Seman","doi":"10.1109/ESTC.2008.4684459","DOIUrl":"https://doi.org/10.1109/ESTC.2008.4684459","url":null,"abstract":"Variation in temperature can have a significant impact on the rheological characterisation of solder pastes used in the electronic assembly of surface mount devices. This paper concerns the study of the effect of temperature on slumping characteristics of lead-free solder pastes. The identification of the slumping characteristics can help in the correlation of the pastes characteristics to its printing performance. Further issues, which aid in justifying the undertaking of such a study, include the temperature differences identified both at the squeegee during the print, and during reflow. Due to these temperature variations, it is imperative to understand how slump differs with a temperature gradient.","PeriodicalId":146584,"journal":{"name":"2008 2nd Electronics System-Integration Technology Conference","volume":"121 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-11-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121395240","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Numerical processing of stereo optical images for autonomous navigation","authors":"P. Svasta, I. Hapenciuc","doi":"10.1109/ESTC.2008.4684426","DOIUrl":"https://doi.org/10.1109/ESTC.2008.4684426","url":null,"abstract":"Autonomous robots had been for a long time any engineers dream. First steps were done by creating robots able to move in well know space for restricted distances. The need of a robot able to navigate on an area with high irregularities and many unknowns obstacles lead to the organisation of the DARPA Grand Challenge. Most competitors used GPS and Laser Telemeters for terrain investigation. This paper is describing a different way to investigate the terrain topography: stereo images. This is the closest way of terrain investigation to the human sight. By gathering as much information from images the need for other sensors on the robot will be no more. This is an obvious fact since for human more than 90% of information about the surrounding environment is coming from sight. An equipment to capture and process stereo images had been build and the software was created to prove the accuracy of this method to detect and avoid obstacles and to investigate the terrain topography for uncharted areas. To extract the information needed for the navigation from the stereo optic images, complex algorithms of shape recognisance, pattern mach and cross correlation will be involved together with image calibration and sharpening. Because the processing power requirements will be huge methods to decrease the computation need will be used to increase the processing speed On site measurements will give a clear view of the performance and accuracy. For better measurements the stereo optical system will be backed up by other sensors: magnetic compass, gyroscopes, tri-axial accelerometers, pressure sensors, GPS and odometer. Some of these are redundant and are used just to confirm and improve the accuracy of the information gathered thru the stereo optical images.","PeriodicalId":146584,"journal":{"name":"2008 2nd Electronics System-Integration Technology Conference","volume":"54 6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-11-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116350017","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Modelling of the time-dependent flow behaviour of lead-free solder pastes used for flip-chip assembly applications","authors":"S. Mallik, Nduka Nnamdi (Ndy) Ekere, A. Marks, A. Seman, R. Durairaj","doi":"10.1109/ESTC.2008.4684527","DOIUrl":"https://doi.org/10.1109/ESTC.2008.4684527","url":null,"abstract":"The market for solder paste materials in the electronic manufacturing and assembly sector is very large and consists of material and equipment suppliers and end users. These materials are used to bond electronic components (such as flip-chip, CSP and BGA) to printed circuit boards (PCBpsilas) across a range of dimensions where the solder interconnects can be in the order of 0.05 mm to 5 mm in size. The non-Newtonian flow properties exhibited by solder pastes during its manufacture and printing/deposition phases have been of practical concern to surface mount engineers and researchers for many years. The printing of paste materials through very small-sized stencil apertures is known to lead to increased stencil clogging and incomplete transfer of paste to the substrate pads. At these very narrow aperture sizes the paste rheology and particle-wall interactions become crucial for consistent paste withdrawal. These non-Newtonian effects must be understood so that the new paste formulations can be optimised for consistent printing. The focus of the study reported in this paper is the characterisation of the rheological properties of solder pastes and flux mediums, and the evaluation of the effect of these properties on the pastespsila printing performance at the flip-chip assembly application level. Solder pastes are known to exhibit a thixotropic behaviour, which is recognised by the decrease in apparent viscosity of paste material with time when subjected to a constant shear rate. The proper characterisation of this time-dependent rheological behaviour of solder pastes is crucial for establishing the relationships between the pastespsila structure and flow behaviour; and for correlating the physical parameters with paste printing performance. In this paper, we present a number of methods which have been developed for characterising the time-dependent and non-Newtonian rheological behaviour of solder pastes and flux mediums as a function of shear rates. We also present results of the study of the rheology of the solder pastes and flux mediums using the structural kinetic modelling approach, which postulates that the network structure of solder pastes breaks down irreversibly under shear, leading to time and shear dependent changes in the flow properties. Our results show that for the solder pastes used in the study, the rate and extent of thixotropy was generally found to increase with increasing shear rate. The technique demonstrated in this study has wide utility for R&D personnel involved in new paste formulation, for implementing quality control procedures used in solder paste manufacture and packaging; and for qualifying new flip-chip assembly lines.","PeriodicalId":146584,"journal":{"name":"2008 2nd Electronics System-Integration Technology Conference","volume":"58 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-11-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114477664","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"The conceptual design of products benefiting from integrated micro-features","authors":"D. Topham, D. Harrison","doi":"10.1109/ESTC.2008.4684544","DOIUrl":"https://doi.org/10.1109/ESTC.2008.4684544","url":null,"abstract":"The benefits of micro-miniaturisation go beyond simply smaller size and reductions in cost and the use of raw materials. For example: in microelectronics, smaller feature sizes lead to higher frequency operation and lower power consumption; in micro-mechanics, micro-scale structures have low mass and high resonant frequencies, enabling high sensitivity yet robust operation; and, in micro-fluidics, micro-channels exhibit highly laminar flow, providing the potential for chemistry at molecular scales and the ability to single out and manipulate individual living cells.","PeriodicalId":146584,"journal":{"name":"2008 2nd Electronics System-Integration Technology Conference","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-11-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115306966","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}