Nanoparticle synthesis and formation of composite solder for harsh environments

Abstract

The demand for electronics capable of operating at high ambient temperatures above 150degC is increasing in the oil/gas drilling and automotive industries in particular. These demands have accelerated the progress of materials development and processing technology. Nanoparticle enhanced solders have been reported to have superior creep and reliability properties compared to simple alloyed materials. The nanoparticles, typically added at 1-2 vol% concentrations into the solder serve to harden the solder, stabilize the microstructure and improve reliability in high temperature environments. The nanoparticles may be added to the solder before production of solder particles, or added as a separate ingredient of the solder paste. This paper explores the latter approach.