2008 2nd Electronics System-Integration Technology Conference最新文献_第4页

Gigabits in the home with plugless plastic optical fiber (POF) interconnects 千兆比特在家庭与无插头塑料光纤(POF)互连

2008 2nd Electronics System-Integration Technology Conference Pub Date : 2008-11-21 DOI: 10.1109/ESTC.2008.4684535

T. Wipiejewski, T. Moriarty, V. Hung, P. Doyle, G. Duggan, D. Barrow, B. McGarvey, M. O'Gorman, T. Calvert, M. Maute, V. Gerhardt, J. Lambkin

引用次数: 11

Formation of thermomechanical interconnection stresses in a high-end portable product 在高端便携产品中形成的热力互连应力

2008 2nd Electronics System-Integration Technology Conference Pub Date : 2008-11-21 DOI: 10.1109/ESTC.2008.4684547

J. Karppinen, T. Mattila, J. Kivilahti

{"title":"Formation of thermomechanical interconnection stresses in a high-end portable product","authors":"J. Karppinen, T. Mattila, J. Kivilahti","doi":"10.1109/ESTC.2008.4684547","DOIUrl":"https://doi.org/10.1109/ESTC.2008.4684547","url":null,"abstract":"Thermomechanical reliability of electronics has commonly been studied by employing the standard temperature cycling tests. However, due to the localized heating in modern consumer devices, power cycling can be considered a more realistic testing alternative. To better understand the correlation between the thermomechanical loadings caused by the accelerated tests and the real-life operation, a high-end portable device was used to study the stresses and strains induced during both test conditions. Power cycling was executed by running the device's built-in functions to closely represent the typical use. The thermal response was measured with the thermal camera and the displacements quantified with the optical Topography and Deformation Measurement system (TDM). Deformation measurements were also carried out in power cycling at the elevated temperature of 40degC and temperature cycling from room temperature up to 40degC, 60degC, 80degC and 100degC. The induced stresses to interconnections were calculated from the measured displacements with the help of the finite element method. The TDM measurements showed considerable warpage of the printed wiring board during all the tests. The stress and strain fields within component interconnections were not uniform due to the asymmetric design of the device. However, the relative stress distributions were similar in both power and thermal cycling, implying that the method of heating does not markedly influence the stress distribution. In addition, it was found out that the device casing and mounting of the circuit board significantly affect the local strains. The observed stresses and strains serve as a valuable guide in the further development of more realistic and comprehensive reliability testing methods.","PeriodicalId":146584,"journal":{"name":"2008 2nd Electronics System-Integration Technology Conference","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-11-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121059381","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 7

Laser assisted polymer bonding technology for advanced MEMS packaging 用于先进MEMS封装的激光辅助聚合物键合技术

2008 2nd Electronics System-Integration Technology Conference Pub Date : 2008-11-21 DOI: 10.1109/ESTC.2008.4684528

J. Zeng, C.H. Wang

引用次数: 3

Property evaluations of polymers used as housing material for passivation of electronic devices 用作电子器件钝化外壳材料的聚合物的性能评价

2008 2nd Electronics System-Integration Technology Conference Pub Date : 2008-11-21 DOI: 10.1109/ESTC.2008.4684359

E. Engelien, N. Beshchasna, M. Braunschweig, J. Uhlemann, K. Wolter

{"title":"Property evaluations of polymers used as housing material for passivation of electronic devices","authors":"E. Engelien, N. Beshchasna, M. Braunschweig, J. Uhlemann, K. Wolter","doi":"10.1109/ESTC.2008.4684359","DOIUrl":"https://doi.org/10.1109/ESTC.2008.4684359","url":null,"abstract":"In electronics, and especially in medicine technology, the significance of polymers rises at the present time. According to various publications about properties of polymers from different manufacturers, polymers have good dielectric properties, high conformity of coating, low permeability and high stability. Consequently, polymers are a good choice for many different applications. They allow flexible passivation for protection against harmful substances from dust to molecules in liquids. In this context the determination of the diffusion coefficient allows important insight into the protection performance of different polymers. At the example of a 1% NaCl-solution the permeability of different housing materials was measured as a parameter of their protection performance. These tests were broadened by experiments of the optic and geometric surface properties and the determination of the materialspsila adhesion forces. As housing polymers of electronic devices were examined a non-elastic and a flexible solder resist, a sealing wax, a sole gel as well as a Chlor-Poly-Para-Xylylen.","PeriodicalId":146584,"journal":{"name":"2008 2nd Electronics System-Integration Technology Conference","volume":"53 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-11-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125011435","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

High voltage batteries for maritime applications 船用高压电池

2008 2nd Electronics System-Integration Technology Conference Pub Date : 2008-11-21 DOI: 10.1109/ESTC.2008.4684412

M. Alcaraz, S. D. de Haan, J. Ferreira

引用次数: 0

Investigation of the flow properties of adhesives in electronic packaging 电子封装中胶粘剂流动性能的研究

2008 2nd Electronics System-Integration Technology Conference Pub Date : 2008-11-21 DOI: 10.1109/ESTC.2008.4684538

A. Paproth, J. Kolbe

{"title":"Investigation of the flow properties of adhesives in electronic packaging","authors":"A. Paproth, J. Kolbe","doi":"10.1109/ESTC.2008.4684538","DOIUrl":"https://doi.org/10.1109/ESTC.2008.4684538","url":null,"abstract":"Adhesives in electronic packaging processes are applied in finer and finer structures and in very small quantities. The quality of adhesives is accompanied by the growing requirements on their application, such as screen and stencil printing, stamping and inkjet. The application of adhesives depends on their rheological behaviour. Technical data sheets give viscosity values that have been determined using simple, standardised analytical methods. It is impossible to select an adhesive for an application on the basis of these values alone. Even today, it is still necessary to test the adhesives directly in the application process. This is a complex and time-consuming procedure and does not produce any transfer results. The key to overcoming these problems lies in the rheology of adhesives. The quality of applying an adhesive is crucially influenced by its flow behaviour. In the past, the rheological behaviour of adhesives was under investigation for screen and stencil printing and was described and published in a previous paper. This work is continued and focuses on adhesive application in stamping and ink jet printing thereby taking account of the rheological behaviour. Different adhesives were used in these studies. The application behaviour and the evenness of the deposits were evaluated. The flow behaviour of the adhesives was characterised in detail. Adhesives for inkjet printing with Newtonian flow behaviour with and without polymer additives were investigated. For the application by stamping, a correlation was found between storage modulus and loss factor on the one hand and the adhesive amount transferred on the other. This paper presents some of the research results obtained for stamping and inkjet concerning the correlation between the rheological properties of adhesives and their application behaviour. The critical rheological value is indicated and characterised.","PeriodicalId":146584,"journal":{"name":"2008 2nd Electronics System-Integration Technology Conference","volume":" 10","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-11-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114053494","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Key Standards for BT’s 21st Century Network 英国电信21世纪网络的关键标准

2008 2nd Electronics System-Integration Technology Conference Pub Date : 2008-11-21 DOI: 10.1109/ESTC.2008.4684324

K. Dickerson, J. Dixon

引用次数: 0

Reliability of die attached AlN-DBC module using Zn-Sn high temperature lead-free solders 采用Zn-Sn高温无铅焊料的AlN-DBC模组的可靠性

2008 2nd Electronics System-Integration Technology Conference Pub Date : 2008-11-21 DOI: 10.1109/ESTC.2008.4684383

Seongjun Kim, Keun-Soo Kim, G. Izuta, K. Suganuma

{"title":"Reliability of die attached AlN-DBC module using Zn-Sn high temperature lead-free solders","authors":"Seongjun Kim, Keun-Soo Kim, G. Izuta, K. Suganuma","doi":"10.1109/ESTC.2008.4684383","DOIUrl":"https://doi.org/10.1109/ESTC.2008.4684383","url":null,"abstract":"Interfacial reaction and reliability of Si die attached joints with Zn-xSn (chi= 20, 30, 40 wt%) were investigated, and Pb-5wt%Sn, and Au-20wt% were compared as a typical high temperature solder alloy. The joining strength of Cu/solder/Cu joints was investigated using the as soldered joints and thermal cycled joints up to 2000 cycles. At the interface with Si die coated with Au/TiN thin layers, the TiN layer did not react with the solder and worked as a good protective layer. At the interface with Cu, for Zn-Sn solders, CuZn5 and Cu5Zn8 IMC layers was confirmed. Au-20Sn and Pb-5Sn solder forms zeta-Au5Sn and Cu3Sn IMC layers at the interface with Cu, respectively. For improving the joint reliability, TiN layer was proposed as a protective layer and was applied to the DBC substrates. For the die attached joints on DBC substrates coated with Au/TiN thin layers, no fatigue crack has been found until 1000 cycles of thermal cycling test. The joining strength of the Cu/solder/Cu joints with Zn-Sn solder was about 30~34 MPa, which was higher than that of Pb-5Sn solder (26.2 MPa). For the thermal cycled Cu/solder/Cu joints up to 2000cycles, Zn-Sn solder also shows the higher joining strength than that of Pb-5Sn solder.","PeriodicalId":146584,"journal":{"name":"2008 2nd Electronics System-Integration Technology Conference","volume":"84 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-11-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122517312","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 6

Global joint effort to solve electronics supply chain technology issues 全球共同努力解决电子供应链技术问题

2008 2nd Electronics System-Integration Technology Conference Pub Date : 2008-11-21 DOI: 10.1109/ESTC.2008.4684410

Richard Bergman, M. Andrews, P. Collander

引用次数: 0

Reliability of ceramic microwave packages for space applications 空间应用微波陶瓷封装的可靠性

2008 2nd Electronics System-Integration Technology Conference Pub Date : 2008-11-21 DOI: 10.1109/ESTC.2008.4684523

M. Mach, J. Muller, K. Drue, G. Prinz

{"title":"Reliability of ceramic microwave packages for space applications","authors":"M. Mach, J. Muller, K. Drue, G. Prinz","doi":"10.1109/ESTC.2008.4684523","DOIUrl":"https://doi.org/10.1109/ESTC.2008.4684523","url":null,"abstract":"Packaging of microwave components and systems for space use is very challenging since high frequency, thermal and hermeticity aspects need to be considered. Furthermore, these packages have to be reliable under various environmental work conditions. Ball Grid Array (BGA) or Land Grid Array (LGA) packages are typically used for microwave applications. BGAs are better investigated in terms of reliability than LGAs. However, LGAs offer a lower profile than BGAs which might be advantageous with regard to mechanical shock and vibration. Prior to the reliability investigations of packages a screening test of silver, silver-palladium and silver- platinum thick film pastes was made to identify the optimum combination of pad metal and solder. The best thick film pastes with the highest shear forces before and after aging were DP6116 for SAC and DP6146 for SnPbAg. Three different sizes (5times7.5 mm2, 10times15 mm2, 14times20 mm2) of LTCC-LGA were investigated on reliability to determine the critical package size. Two different base board materials were included in the thermal cycling test between -40degC and 125degC (glued microwave PCB on an aluminium base plate and standard FR4). The aluminium board construction showed poor reliability of only 100 to maximal 300 cycles for both solders. FR4 boards offered a much better performance from 600 to over 1000 cycles.","PeriodicalId":146584,"journal":{"name":"2008 2nd Electronics System-Integration Technology Conference","volume":"51 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-11-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131482633","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2