Global joint effort to solve electronics supply chain technology issues

Abstract

High Density Packaging User Group, HDPUG, is an international consortium working with specific, most urgent, technology issues related to the changing world of electronics industry needs and complex supply chains. The organisation has for 12 years offered industrial top players a collaborative base for analysing, testing and improving emerging technologies at and before their public introduction. Suppliers and users working together at that stage improve business efficiency and performance up and down the supply chain.