2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)最新文献_第4页

Simulation and Verification or Cu@Ag Core-shell Sintered Paste for Power Semiconductor Die-attach Applications 模拟与验证Cu@Ag用于功率半导体贴片的核壳烧结浆料

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) Pub Date : 2022-05-01 DOI: 10.1109/ectc51906.2022.00086

Xinyue Wang, Z. Zeng, Jing Zhang, Guoqi Zhang, Pan Liu

{"title":"Simulation and Verification or Cu@Ag Core-shell Sintered Paste for Power Semiconductor Die-attach Applications","authors":"Xinyue Wang, Z. Zeng, Jing Zhang, Guoqi Zhang, Pan Liu","doi":"10.1109/ectc51906.2022.00086","DOIUrl":"https://doi.org/10.1109/ectc51906.2022.00086","url":null,"abstract":"With the increasing application of wide bandgap materials such as silicon carbide and gallium nitride in power devices, the working temperature of power devices has been pushed further. Therefore, it brings higher requirements for packaging materials. Sintered silver is a widely accepted chip connection material. However, silver suffers from high prices and electromigration. Therefore, a novel sintered material based on silver-copper core-shell structured particles raises the attention of researchers to solve this deficiency. To accelerate the development of new materials and their related processes, a four-sphere model of the silver-coated copper structure is established in this paper. The mathematical relationship between the porosity and thermal conductivity of sintered body and the actual sintering process was preliminarily established through the calculation based on a series of FEM simulations. The model was further validated through experiments. The modeling method and conclusion are utilized for future process adjustment, which is of great significance to accelerate the development, application, and reliability of new packaging materials.","PeriodicalId":139520,"journal":{"name":"2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)","volume":"51 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133448529","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Two-Step Ar/N2 Plasma-Activated Al Surface for Al-Al Direct Bonding 两步Ar/N2等离子体活化铝表面的Al-Al直接键合

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) Pub Date : 2022-05-01 DOI: 10.1109/ectc51906.2022.00060

Liangxing Hu, Y. Lim, P. Zhao, Michael Joo Zhong Lim, Chuan Seng Tan

引用次数: 4

Flexible metamaterial lens for magnetic field and signal-to-noise ratio improvements in 1.5 T and 3 T magnetic resonance imaging 柔性超材料透镜用于1.5 T和3t磁共振成像的磁场和信噪比改善

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) Pub Date : 2022-05-01 DOI: 10.1109/ectc51906.2022.00247

Woosol Lee, Josh Lane, M. Febo, Y. Yoon

引用次数: 1

Die to Wafer Hybrid Bonding for Chiplet and Heterogeneous Integration: Die Size Effects Evaluation-Small Die Applications 晶片与异质集成的晶圆间杂化键合:晶圆尺寸效应评估-小晶圆应用

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) Pub Date : 2022-05-01 DOI: 10.1109/ectc51906.2022.00310

Guilian Gao, L. Mirkarimi, G. Fountain, D. Suwito, J. Theil, Thomas Workman, C. Uzoh, Bongsub Lee, K.M. Bang, Gabe Guevara

{"title":"Die to Wafer Hybrid Bonding for Chiplet and Heterogeneous Integration: Die Size Effects Evaluation-Small Die Applications","authors":"Guilian Gao, L. Mirkarimi, G. Fountain, D. Suwito, J. Theil, Thomas Workman, C. Uzoh, Bongsub Lee, K.M. Bang, Gabe Guevara","doi":"10.1109/ectc51906.2022.00310","DOIUrl":"https://doi.org/10.1109/ectc51906.2022.00310","url":null,"abstract":"The Direct Bond Interconnect (DBI®) Ultra technology, a die-to-wafer (D2W) and die-to-die (D2D) hybrid bonding, is a platform technology that offers a hermetically sealed solid Cu-Cu interconnect through room temperature bonding and low temperature anneal. DBI wafer to wafer (W2W) bonding has been in high volume production since 2015. Advancement in D2W hybrid bonding technology in recent years has enabled recent adoption the technology by Sony [1]. AMD [2] and Intel [3]. The DBI Ultra D2W technology offers die-on-tape processing with bonding speeds comparable to mass reflow flip chip assembly. The bonding takes place at room temperature in an ambient environment in a class 1000 cleanroom. A low temperature batch anneal following bonding creates a solid Cu-Cu connection with no solder and no underfill.The value of the DBI Ultra technology can be realized in diverse products ranging from very small die to reticle-size large die. Applications such as RF, sensors and microcontrollers are in the small die domain, while GPUs and FPGAs require bonding of very large die. Ultimate SoC disaggregation implementations may include D2W bonding of mid-large sized memory die (e.g. SRAM in V-Cache) as well as ultra-small die for analog functionalities. In this paper, we present the results of D2W bonding development in die size ranging from 0.4x0.4mm to 3.2x3.0mm. The module build process includes dicing, die preparation on tape, and direct pick & place from a tape frame. The bonding quality is characterized with C-mode scanning acoustic microscopy (CSAM) and cross-section microscopy analysis.","PeriodicalId":139520,"journal":{"name":"2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)","volume":"117 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115454196","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 6

77GHz Cavity-Backed AiP Array in FOWLP Technology FOWLP技术中的77GHz空腔支持AiP阵列

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) Pub Date : 2022-05-01 DOI: 10.1109/ectc51906.2022.00022

S. Mei, Lim Teck Guan, Chai Tai Chong

引用次数: 6

Development of Two-Tier FO-WLP AiPs for Automotive Radar Application 用于汽车雷达的两层FO-WLP AiPs的开发

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) Pub Date : 2022-05-01 DOI: 10.1109/ectc51906.2022.00221

S. W. Ho, Hsiao Hsiang-Yao, Lau Boon Long, Sharon Lim Pei Siang, Lim Teck Guan, C. T. Chong

引用次数: 0

Epoxy Resin with Metal Complex Additives for Improved Reliability of Epoxy-Copper Joint 金属复合添加剂环氧树脂对提高环氧铜接头可靠性的影响

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) Pub Date : 2022-05-01 DOI: 10.1109/ectc51906.2022.00318

Jiaxiong Li, John Wilson, D. Cheung, Zhijian Sun, K. Moon, Madhavan Swaminathan, C. Wong

{"title":"Epoxy Resin with Metal Complex Additives for Improved Reliability of Epoxy-Copper Joint","authors":"Jiaxiong Li, John Wilson, D. Cheung, Zhijian Sun, K. Moon, Madhavan Swaminathan, C. Wong","doi":"10.1109/ectc51906.2022.00318","DOIUrl":"https://doi.org/10.1109/ectc51906.2022.00318","url":null,"abstract":"Delamination and cracking of the many epoxy-copper interfaces under stress is one major failure mechanism in power packaging. It has therefore become a critical issue in the upcoming wide-bandgap semiconductor era that is expecting increased power density and device miniaturization. The higher operation temperature and voltage, as well as the harsh operation environments considering humidity factors, have posed great challenges on the robustness of these joints. Under moisture attack, the covalent bond or hydrogen bond formation based mechanism, which can be assisted by coupling agents, are intrinsically susceptible to hydrolysis degradation. Coordination bonds between copper and ligands with O or N doners, on the other hand, are a notably more stable mechanism. Furthermore, the costly and limited-access substrate pre-treatments are deemed less favorable in the fast-paced assembly process. The introduction of coordination compounds in epoxy resin that can function at interfaces without being consumed by the polymer backbone remains an obstacle. To address these issues, in this work an in-formulation metal complex-based modifier for epoxy resin is reported to enhance the adhesion performance of epoxy to copper under temperature-humidity aging. The curing, thermomechanical and chemical assessments are used to provide mechanistic insights into the adhesion and moisture resistance improvement.","PeriodicalId":139520,"journal":{"name":"2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)","volume":"53 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117064317","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Hybrid Stacked-Die Package Solution for Extremely Small-Form-Factor Package 用于极小尺寸封装的混合叠层封装解决方案

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) Pub Date : 2022-05-01 DOI: 10.1109/ectc51906.2022.00096

Heeseok Lee, Kyoung-Min Lee, Daehan Youn, Kyojin Hwang, Junghwa Kim

引用次数: 1

Fine Copper Lines with High Adhesion on High Rigidity Dielectrics 高硬度电介质上高附着力的细铜线

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) Pub Date : 2022-05-01 DOI: 10.1109/ectc51906.2022.00142

M. Nishida, H. Noma, Tetsuro Iwakura, Masaki Yamaguchi, Kazuyuki Mitsukura

引用次数: 2

"Smart" Packaging of Self-Identifying and Localizable mmID for Digital Twinning and Metaverse Temperature Sensing Applications 用于数字孪生和超宇宙温度传感应用的自识别和可定位mmID的“智能”封装

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) Pub Date : 2022-05-01 DOI: 10.1109/ectc51906.2022.00023

Charles A. Lynch, Ajibayo O. Adeyeye, M. Tentzeris

引用次数: 3