Hybrid Stacked-Die Package Solution for Extremely Small-Form-Factor Package

Abstract

Hybrid configuration including face-up and face-down with redistribution layer (RDL) based fan-out package (FoPKG) is presented to stack multiple dies with satisfying small form-factor requirement. In this work, authors will address that hybrid stacked die package (HSDP) solution with through silicon via (TSV) for 3D-IC as well as TSV-less configuration will be a promising solution to achieve extremely small form-factor package.