用于极小尺寸封装的混合叠层封装解决方案

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) Pub Date : 2022-05-01 DOI:10.1109/ectc51906.2022.00096

Heeseok Lee, Kyoung-Min Lee, Daehan Youn, Kyojin Hwang, Junghwa Kim

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引用次数: 1

摘要

提出了基于再分布层(RDL)的扇出封装(FoPKG)的正面朝上和正面朝下混合结构，实现了满足小尺寸要求的多模堆叠。在这项工作中，作者将讨论用于3D-IC的具有通硅通孔(TSV)的混合堆叠封装(HSDP)解决方案以及无TSV配置将是实现极小尺寸封装的有前途的解决方案。

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Hybrid Stacked-Die Package Solution for Extremely Small-Form-Factor Package

Hybrid configuration including face-up and face-down with redistribution layer (RDL) based fan-out package (FoPKG) is presented to stack multiple dies with satisfying small form-factor requirement. In this work, authors will address that hybrid stacked die package (HSDP) solution with through silicon via (TSV) for 3D-IC as well as TSV-less configuration will be a promising solution to achieve extremely small form-factor package.

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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

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