77GHz Cavity-Backed AiP Array in FOWLP Technology

Abstract

This paper presents a 4×8 AiP array implemented in Fan-Out Wafer-Level-Packaging (FOWLP) technology for 77GHz high resolution compact multi-functional MIMO radar applications. It features a cavity-backed 3D stacked structure to achieve stable patterns and wide bandwidth. The fabricated sample with a size of 16mm×16mm×0.402mm shows a measured |S11| <-12.2dB, Gain >14dBi and stable patterns with boresight radiations over 77-81GHz.