发布求助
文献互助 智能选刊 最新文献

2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME)最新文献

筛选
英文 中文
Human-computer interface based on eye tracking with dwell time selection 基于眼动追踪和停留时间选择的人机界面
2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2017-10-01 DOI: 10.1109/SIITME.2017.8259929
A. Pasarica, R. Bozomitu, H. Costin, Casian Miron, C. Rotariu
{"title":"Human-computer interface based on eye tracking with dwell time selection","authors":"A. Pasarica, R. Bozomitu, H. Costin, Casian Miron, C. Rotariu","doi":"10.1109/SIITME.2017.8259929","DOIUrl":"https://doi.org/10.1109/SIITME.2017.8259929","url":null,"abstract":"Human-computer interfaces are designed to allow the control and interaction of a computer using uncommon methods. A method that has gained popularity in recent years due to the advancement of technology, specifically video technology and processing power of portable devices, is the eye tracking method for human-computer interface. The application presented is designed for people with neuro-motor disabilities and is represented by an on-line web interface. The interface is based on the selection of ideograms that are suggestive for different actions/desires of the patient. The paper presents the selection method implemented and the analysis of the precision of this method using a testing interface implemented in Matlab that allows the quantification of clicks/selections for different areas of the screen and the selection time required.","PeriodicalId":138347,"journal":{"name":"2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"167 ","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114058918","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Maintenance-free IOT gateway design for bee hive monitoring 蜂巢监控免维护物联网网关设计
2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2017-10-01 DOI: 10.1109/SIITME.2017.8259886
M. Vidrascu, P. Svasta
{"title":"Maintenance-free IOT gateway design for bee hive monitoring","authors":"M. Vidrascu, P. Svasta","doi":"10.1109/SIITME.2017.8259886","DOIUrl":"https://doi.org/10.1109/SIITME.2017.8259886","url":null,"abstract":"Ultra-low power nodes of a wireless sensor network (WSN) have limited communication range, usually a few hundred meters. To make the sensor data available outside the local network, a gateway module is required. It interfaces the sensor network to a large coverage network, such as 3G and 4G. This project describes the design of a maintenance-free, energetically independent gateway module using super-capacitors as energy storage devices.","PeriodicalId":138347,"journal":{"name":"2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114368160","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Low power renewable energy system used for power back-up applications: Thermoelectric generator system with geothermal water in simulations 用于备用电源的低功耗可再生能源系统:模拟中的地热热水热电发电机系统
2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2017-10-01 DOI: 10.1109/SIITME.2017.8259900
Marius Ovidiu Neamtu, Nistor Daniel Trip, A. Burcă
{"title":"Low power renewable energy system used for power back-up applications: Thermoelectric generator system with geothermal water in simulations","authors":"Marius Ovidiu Neamtu, Nistor Daniel Trip, A. Burcă","doi":"10.1109/SIITME.2017.8259900","DOIUrl":"https://doi.org/10.1109/SIITME.2017.8259900","url":null,"abstract":"During the use of the geothermal energy for hose heating, there are many situations when the temperature of the geothermal water at the extraction point has to be decreased to the usable values. On this path, the authors propose the use of a low power renewable energy system that could be used in many back-up electric power applications. This system does not diminish in any way the efficiency of the house heating system. The proposed system comprises an electro thermal generation unit with TEG (Thermo Electric Generator) modules, a maximum power point tracking system and a storage unit with Li-ion battery. Due to the fact that the geothermal energy is available all the time, the thermal energy recovered with this system may be used as a reliable back-up energy source for low power applications, such as: security transmission systems, monitoring systems to mention only some of the possibilities. The paper shows the operating principle of the systems modeling based on experimental results and a set o simulations results that confirm the usefulness of the proposed equipment.","PeriodicalId":138347,"journal":{"name":"2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133705636","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Active tamper detection circuit based on statistical analysis 基于统计分析的有源篡改检测电路
2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2017-10-01 DOI: 10.1109/SIITME.2017.8259884
D. Vasile, P. Svasta
{"title":"Active tamper detection circuit based on statistical analysis","authors":"D. Vasile, P. Svasta","doi":"10.1109/SIITME.2017.8259884","DOIUrl":"https://doi.org/10.1109/SIITME.2017.8259884","url":null,"abstract":"Communications have a significant role in our daily activities, whether they concern the private life of people or they provide the data for enterprises (healthcare, industry, media, defense, etc.). In order to trust the communications, they must be protected by cryptographic methods. The secure data are produced and processed in different types of equipment and they must be protected against physical intrusion attacks, using tamper detection circuit. This work proposes an active tamper detection circuit based on statistical analysis of signals used in probing a conductive mesh that covers and seals the security module.","PeriodicalId":138347,"journal":{"name":"2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"277 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133969532","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Influence of temperature on supercapacitors behavior in series/parallel connections 温度对串联/并联超级电容器性能的影响
2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2017-10-01 DOI: 10.1109/SIITME.2017.8259927
R. Negroiu, C. Ionescu, P. Svasta, A. Vasile
{"title":"Influence of temperature on supercapacitors behavior in series/parallel connections","authors":"R. Negroiu, C. Ionescu, P. Svasta, A. Vasile","doi":"10.1109/SIITME.2017.8259927","DOIUrl":"https://doi.org/10.1109/SIITME.2017.8259927","url":null,"abstract":"Supercapacitors or Electrochemical Double Layer Capacitors, briefly named EDLC, are very promising energy storage components. The need for higher rated voltages of capacitors or for the higher capacitance makes necessary the construction of capacitive modules (CM) using series connection or parallel connection. Such modules can be used in large temperature range. The temperature has a very important role in influencing the supercapacitors charge/discharge mode and its electrical parameters change during operation [1]. In order to verify the performances of the CMs and to identify the influence of interconnection solution of the modules, the paper targets to compare the capacitance values for individual capacitors with those obtained by serial or parallel connection for the same components. The measurements are realized at different temperature values.","PeriodicalId":138347,"journal":{"name":"2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129895108","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Effect of resistance of conductive adhesive joint on course of its aging 导电胶接头电阻对其老化过程的影响
2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2017-10-01 DOI: 10.1109/SIITME.2017.8259865
P. Mach, S. Barto
{"title":"Effect of resistance of conductive adhesive joint on course of its aging","authors":"P. Mach, S. Barto","doi":"10.1109/SIITME.2017.8259865","DOIUrl":"https://doi.org/10.1109/SIITME.2017.8259865","url":null,"abstract":"Electrically conductive adhesives are widely used for electronic assembly of electronic devices, for connections in solar panels, for repair of diiferent types of connections based on thin conductive films and in many other applications. Basic parameter of an adhesive joint is stability of its resistance, because the joints are often used in a wide spectrum of climatic conditions. During adhesive assembly the resistances of joints are not the same due to different contact areas of different components. The goal of the work was to find if the initial resistance of the joint influences resistance changes during its climatic aging. The aging was carried out at the high temperature, at the combination high temperature/high humidity and in the high humidity. It was found that the initial resistance of the joint influences changes of this parameter during climatic aging to the minimum extent only.","PeriodicalId":138347,"journal":{"name":"2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122494621","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Technological solutions for throughput improvement of a Secure Hash Algorithm-256 engine 安全哈希算法-256引擎吞吐量改进的技术方案
2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2017-10-01 DOI: 10.1109/SIITME.2017.8259881
Flavius Opritoiu, Sorin Liviu Jurj, M. Vladutiu
{"title":"Technological solutions for throughput improvement of a Secure Hash Algorithm-256 engine","authors":"Flavius Opritoiu, Sorin Liviu Jurj, M. Vladutiu","doi":"10.1109/SIITME.2017.8259881","DOIUrl":"https://doi.org/10.1109/SIITME.2017.8259881","url":null,"abstract":"This article describes a set of techniques for improving the performance of an Secure Hash Algorithm 256 (SHA-256) hardware implementation. The proposed solution reduces the latency incurred for updating the intermediate hash values and relies on using combinational tree structures of CSAs interconnected in a Wallace tree manner for multi-operand addition. Furthermore, the paper investigates the throughout improvement provided by a combined implementation of architecture's binary adders with the round functions used by the hash computation process. The proposed acceleration techniques can be adapted to the other members of the SHA-2 family of algorithms. The architecture represents a case study for hardware optimization based on different combinational structures for binary addition and the effect of the carry propagate layer on the overall performance. The synthesis results of the proposed designs are provided as support for the performance analysis presented in this work.","PeriodicalId":138347,"journal":{"name":"2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"161 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123027373","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
LTCC substrates based on low dielectric permittivity diopside-glass composite 基于低介电常数透晶玻璃复合材料的LTCC衬底
2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2017-10-01 DOI: 10.1109/SIITME.2017.8259857
B. Synkiewicz, D. Szwagierczak, J. Kulawik
{"title":"LTCC substrates based on low dielectric permittivity diopside-glass composite","authors":"B. Synkiewicz, D. Szwagierczak, J. Kulawik","doi":"10.1109/SIITME.2017.8259857","DOIUrl":"https://doi.org/10.1109/SIITME.2017.8259857","url":null,"abstract":"Implementation of LTCC (low temperature coflred ceramics) technology for advanced substrates and packages destined for microwave circuits creates several challenges related to proper choice of materials and processing parameters. In this paper, a new low dielectric permittivity material based on a diopside-glass composite was developed, characterized and applied for fabrication of LTCC substrates. For comparison, properties of pure diopside ceramic were also investigated. Heating microscope studies were used for determination of sintering conditions. Microstructure of laminates was examined by optical and scanning electron microscopy. Measurements of dielectric properties carried out in the temperature range from 25 to 150°C at frequencies 100 Hz–2 MHz revealed low dielectric permittivity of the substrates at a level of 7.2–7.9. Analysis of test LTCC structures with screen printed patterns of conductive paths with different width proved good compatibility of the developed material with co-sintered layers made of commercial AgPd pastes.","PeriodicalId":138347,"journal":{"name":"2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"99 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115314570","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Vehicles diagnosis based on LabVIEW and CAN interfaces 基于LabVIEW和CAN接口的车辆诊断
2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2017-10-01 DOI: 10.1109/SIITME.2017.8259930
L. Perisoara, A. Vasile, D. Săcăleanu
{"title":"Vehicles diagnosis based on LabVIEW and CAN interfaces","authors":"L. Perisoara, A. Vasile, D. Săcăleanu","doi":"10.1109/SIITME.2017.8259930","DOIUrl":"https://doi.org/10.1109/SIITME.2017.8259930","url":null,"abstract":"This paper presents a customized virtual instruments cluster designed for real-time monitoring and logging of vehicles data and reading or clearing Diagnostic Trouble Codes (DTC). The virtual instrument is developed in LabVIEW using the Automotive Diagnosis Command Set (ADCS) toolbox and communicates with the vehicle's Electronic Control Units (ECUs) through the On Board Diagnostics (OBD) interface using the Controller Area Network (CAN) protocol. To test the functionality and to optimize the virtual instrument, different tests and measurements were performed on three vehicles.","PeriodicalId":138347,"journal":{"name":"2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"128 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115444056","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
Network analyzer concept based on quadrature demodulation 基于正交解调的网络分析仪概念
2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2017-10-01 DOI: 10.1109/SIITME.2017.8259870
I. Alexandru, L. Viman, D. Pitica
{"title":"Network analyzer concept based on quadrature demodulation","authors":"I. Alexandru, L. Viman, D. Pitica","doi":"10.1109/SIITME.2017.8259870","DOIUrl":"https://doi.org/10.1109/SIITME.2017.8259870","url":null,"abstract":"Actual paper describes the theoretical approach of a network analyzer using quadrature demodulation as part of a software defined radio. The main idea is strictly connected with the extraction of phase difference and amplitude information for further processing in a microcontroller unit. The system contains variable frequency sine wave quadrature oscillators for frequency sweeping, double balanced active mixers and a microcontroller unit. The analyzer is able to calculate the complex impedance of an unknown network as well as the S parameters and reflection coefficient.","PeriodicalId":138347,"journal":{"name":"2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"256 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115786473","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
首页 上一页 下一页 尾页
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整，为了账户安全，请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
请完成安全验证×
相关产品
×
本文献相关产品
联系我们：info@booksci.cn Book学术提供免费学术资源搜索服务，方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号：604180095
Book学术官方微信