Effect of resistance of conductive adhesive joint on course of its aging

Abstract

Electrically conductive adhesives are widely used for electronic assembly of electronic devices, for connections in solar panels, for repair of diiferent types of connections based on thin conductive films and in many other applications. Basic parameter of an adhesive joint is stability of its resistance, because the joints are often used in a wide spectrum of climatic conditions. During adhesive assembly the resistances of joints are not the same due to different contact areas of different components. The goal of the work was to find if the initial resistance of the joint influences resistance changes during its climatic aging. The aging was carried out at the high temperature, at the combination high temperature/high humidity and in the high humidity. It was found that the initial resistance of the joint influences changes of this parameter during climatic aging to the minimum extent only.