LTCC substrates based on low dielectric permittivity diopside-glass composite

2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME) Pub Date : 2017-10-01 DOI:10.1109/SIITME.2017.8259857

B. Synkiewicz, D. Szwagierczak, J. Kulawik

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引用次数: 2

Abstract

Implementation of LTCC (low temperature coflred ceramics) technology for advanced substrates and packages destined for microwave circuits creates several challenges related to proper choice of materials and processing parameters. In this paper, a new low dielectric permittivity material based on a diopside-glass composite was developed, characterized and applied for fabrication of LTCC substrates. For comparison, properties of pure diopside ceramic were also investigated. Heating microscope studies were used for determination of sintering conditions. Microstructure of laminates was examined by optical and scanning electron microscopy. Measurements of dielectric properties carried out in the temperature range from 25 to 150°C at frequencies 100 Hz–2 MHz revealed low dielectric permittivity of the substrates at a level of 7.2–7.9. Analysis of test LTCC structures with screen printed patterns of conductive paths with different width proved good compatibility of the developed material with co-sintered layers made of commercial AgPd pastes.

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基于低介电常数透晶玻璃复合材料的LTCC衬底

用于微波电路的先进基板和封装的LTCC(低温彩色陶瓷)技术的实施带来了与正确选择材料和加工参数相关的几个挑战。本文研制了一种新型的低介电常数材料，并对其进行了表征，并将其应用于LTCC衬底的制备。为了比较，还研究了纯透辉石陶瓷的性能。采用加热显微镜法测定烧结条件。用光学显微镜和扫描电镜对层合板的微观结构进行了观察。在温度范围为25至150°C，频率为100 Hz-2 MHz的情况下进行的介电特性测量显示，衬底的介电常数在7.2-7.9之间。对具有不同宽度导电路径网印图案的LTCC结构的测试分析表明，所开发的材料与商用AgPd浆料共烧结层具有良好的相容性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

2017 IEEE 23rd International Symposium for Design and Technology in Electronic Packaging (SIITME)

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