2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI)最新文献_第2页

Equivalent Inductance Analysis and Quantification for PCB PDN Design PCB PDN设计中的等效电感分析与量化

2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) Pub Date : 2019-07-22 DOI: 10.1109/ISEMC.2019.8825244

Yifan Ding, Biyao Zhao, Shuang Liang, S. Bai, S. Connor, M. Cocchini, B. Achkir, S. Scearce, E. Li, B. Archambeault, J. Fan, J. Drewniak

引用次数: 6

Decoupling Capacitor Selection Algorithm for PDN Based on Deep Reinforcement Learning 基于深度强化学习的PDN解耦电容选择算法

2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) Pub Date : 2019-07-22 DOI: 10.1109/ISEMC.2019.8825249

Ling Zhang, Zhongyang Zhang, Chenxi Huang, Han Deng, Hank Lin, B. Tseng, J. Drewniak, C. Hwang

{"title":"Decoupling Capacitor Selection Algorithm for PDN Based on Deep Reinforcement Learning","authors":"Ling Zhang, Zhongyang Zhang, Chenxi Huang, Han Deng, Hank Lin, B. Tseng, J. Drewniak, C. Hwang","doi":"10.1109/ISEMC.2019.8825249","DOIUrl":"https://doi.org/10.1109/ISEMC.2019.8825249","url":null,"abstract":"Selection of decoupling capacitors (decaps) is important for power distribution network (PDN) design in terms of lowering impedance and saving cost. Good PDN designs typically mean satisfying a target impedance with as less decaps as possible. In this paper, an inductance-based method is utilized to calculate the port priority fist, and afterwards deep reinforcement learning (DRL) with deep neural network (DNN) is applied to optimize the assignment of decaps on the prioritized locations. The DRL algorithm can explore by itself without any prior physical knowledge, and the DNN is trained with the exploration experience and eventually converges to an optimum state. The proposed hybrid method was tested on a printed-circuit-board (PCB) example. After some iterations of training the DNN successfully reached to an optimum design, which turned out to be the minimum number of decaps that can satisfy the target impedance. The usage of DRL with DNN makes the algorithm promising to include more variables as input and handle more complicated cases in the future.","PeriodicalId":137753,"journal":{"name":"2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI)","volume":"103 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-07-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133060427","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 17

Jitter-Aware Target Impedance 抖动感知目标阻抗

2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) Pub Date : 2019-07-22 DOI: 10.1109/ISEMC.2019.8825313

Yin Sun, Jingook Kim, C. Hwang

引用次数: 9

Simulation Investigation on Acoustic Noise Caused by “Singing” Capacitors on Mobile Devices 移动设备上电容“唱歌”噪声的仿真研究

2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) Pub Date : 2019-07-22 DOI: 10.1109/ISEMC.2019.8825205

Yin Sun, Jianmin Zhang, Zhiping Yang, C. Hwang, Songping Wu

{"title":"Simulation Investigation on Acoustic Noise Caused by “Singing” Capacitors on Mobile Devices","authors":"Yin Sun, Jianmin Zhang, Zhiping Yang, C. Hwang, Songping Wu","doi":"10.1109/ISEMC.2019.8825205","DOIUrl":"https://doi.org/10.1109/ISEMC.2019.8825205","url":null,"abstract":"Recently, the acoustic noise emanating from mobile devices becomes an important issue for user experience. The vibration of multilayer ceramic capacitors (MLCCs) mounted on printed circuit board (PCB) can transfer to the PCB and lead to acoustic noise. To mitigate singing cap acoustic noise, sometimes it has to trade off EMC/SI/PI performance during system design. So, simulation methodology is critical to predict critical acoustic issue and help design tradeoff. In this paper, a simulation methodology to provide design guideline for MLCC placement and PCB fixation with the aim to decrease board vibration is proposed. A finite element model of the multilayer PCB considering detailed copper/dielectric distribution of each layer is developed. Modal analysis is firstly performed to analyze the vibration characteristics of the bare PCB. Then the harmonic response of the board due to vibration excitation of MLCC is modeled. Based on the modal analysis result, the design guideline for MLCC placement and PCB fixation location can be established. The proposed guideline is validated through PCB harmonic response simulation.","PeriodicalId":137753,"journal":{"name":"2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI)","volume":"74 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-07-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134200540","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5

Causality Analyzing for Transmission Line with Surface Roughness 输电线路表面粗糙度的因果分析

2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) Pub Date : 2019-07-22 DOI: 10.1109/ISEMC.2019.8825246

Xinglin Sun, Yuandong Guo, Yin Sun, K. Song, Lingyun Ye, X. Ye, J. Drewniak, J. Fan

{"title":"Causality Analyzing for Transmission Line with Surface Roughness","authors":"Xinglin Sun, Yuandong Guo, Yin Sun, K. Song, Lingyun Ye, X. Ye, J. Drewniak, J. Fan","doi":"10.1109/ISEMC.2019.8825246","DOIUrl":"https://doi.org/10.1109/ISEMC.2019.8825246","url":null,"abstract":"Surface roughness of the conductor in transmission lines will introduce extra losses. The recently proposed Huray model is quite accurate for modeling these additional losses by changing R terms in RLGC models. However, only focusing on the loss modeling of the transmission line may lead to causality issues in time domain simulations. In this paper, the causality requirements of the RLGC models are theoretically analyzed firstly. Then, two solutions of the causality problems in Huray model-based transmission line with rough conductors modeling were proposed and compared. One of them is based on the numerical Hilbert transform, and the other one is analytically based on a complex-valued roughness factor. The causalities of those two solutions are validated by a time domain pulse through a transmission line. The results comparisons of the received pulse responses after the transfer functions show that both methods can improve the causality of the wave propagation term significantly, whereas the analytical solution has better performances and the numerical method has some limitations.","PeriodicalId":137753,"journal":{"name":"2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI)","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-07-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125143522","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

A Practical De-embedding Error Analysis Method Based on Statistical Circuit Models of Fixtures 一种实用的基于统计电路模型的夹具去嵌入误差分析方法

2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) Pub Date : 2019-07-22 DOI: 10.1109/ISEMC.2019.8825291

Shaohui Yong, Yuanzhuo Liu, Han Gao, S. Hinaga, S. De, Darja Padilla, Douglas Yanagawa, J. Drewniak, V. Khilkevich

引用次数: 10

Active Coil System for Magnetic Field Reduction in an Automotive Wireless Power Transfer System 汽车无线电力传输系统中磁场减小的有源线圈系统

2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) Pub Date : 2019-07-22 DOI: 10.1109/ISEMC.2019.8825202

T. Campi, S. Cruciani, F. Maradei, M. Feliziani

引用次数: 15

Power Delivery Network Optimization Approach using an Innovative Hybrid Target Impedance 基于创新混合目标阻抗的输电网优化方法

2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) Pub Date : 2019-07-22 DOI: 10.1109/ISEMC.2019.8825309

Jun Xu, S. Bai, Kartheek Nalla, Mike Sapozhnikov, J. Drewniak, C. Hwang, J. Fan

{"title":"Power Delivery Network Optimization Approach using an Innovative Hybrid Target Impedance","authors":"Jun Xu, S. Bai, Kartheek Nalla, Mike Sapozhnikov, J. Drewniak, C. Hwang, J. Fan","doi":"10.1109/ISEMC.2019.8825309","DOIUrl":"https://doi.org/10.1109/ISEMC.2019.8825309","url":null,"abstract":"A well-designed power delivery network (PDN) demands a set of efficient and effective modeling and optimization methodology for the Chip-Package-PCB System. This paper work provided and validated the hybrid target impedance for the PDN impedance optimization in frequency domain and the physics-based equivalent circuit model with small signal model for voltage response validation in time domain. The hybrid target impedance defined with current profile-based discrete and continuous target impedance. Two key impedance points in discrete were identified for on-chip worst case switching scenario and voltage regulator module switching ripple, more points can be added if specific core power switching scenario identified. The continuous impedance points are from the conventional target impedance by voltage ripple to dynamic current change. This hybrid method provides a more effective and convergent way to perform system level decoupling capacitors optimization in frequency domain and to meet voltage specification in time domain, also to avoid overdesigning for cost saving.","PeriodicalId":137753,"journal":{"name":"2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI)","volume":"50 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-07-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124778075","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

A Novel Method for High Frequency Battery Impedance Measurements 一种新的高频电池阻抗测量方法

2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) Pub Date : 2019-07-22 DOI: 10.1109/ISEMC.2019.8825315

Thomas F. Landinger, Guenter Schwarzberger, A. Jossen

引用次数: 18

Efficient Automotive Simulation Using Reciprocity for Intentional Electromagnetic Interference 利用互易性进行有意电磁干扰的高效汽车仿真

2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) Pub Date : 2019-07-22 DOI: 10.1109/ISEMC.2019.8825233

Yang Zhong, Woncheol Song, Cheolhan Kim, Changyul Park, C. Hwang

引用次数: 4