2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI)最新文献

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2X-Thru De-embedding for Non-2N Even Number Port Network 非2n偶数口网络的2X-Thru反嵌入
Bichen Chen, X. Ye, J. Fan
{"title":"2X-Thru De-embedding for Non-2N Even Number Port Network","authors":"Bichen Chen, X. Ye, J. Fan","doi":"10.1109/ISEMC.2019.8825207","DOIUrl":"https://doi.org/10.1109/ISEMC.2019.8825207","url":null,"abstract":"2N–port de-embedding has been well studied previously by using the higher order modal-based S-parameters. Such idea is successfully validated by using the 2X-Thru de-embedding, as well as the classic TRL. Non-2N even number (such as 6, 10, 12, etc.) port network S-parameters de-embedding is derived and validated in this paper. By inserting a factitious single-ended 2X-Thru before the fixture characterization, the derivation and validation are demonstrated through a 6-port 2X-Thru de-embedding example. After the fixture characterization, the inserted artificially single-ended 2X-Thru will be removed before the step of fixture removing calculation. As the 2X-Thru de-embedding application always has even number of port 2X-Thru fixtures, the idea in this paper extend the 2X-Thru de-embedding to any arbitrary number of port. The derivation and justification are also suitable for other de-embedding algorithms with even number of port.","PeriodicalId":137753,"journal":{"name":"2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI)","volume":"191 2","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-07-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120832009","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Experimental Characterization of the Common-mode Current Sources in a Cable Harness 电缆线束中共模电流源的实验特性
S. Walunj, Fuwei Ma, T. Makharashvili, Ruijie He, C. Hwang, D. Beetner, Brian Booth, Kerry Martin
{"title":"Experimental Characterization of the Common-mode Current Sources in a Cable Harness","authors":"S. Walunj, Fuwei Ma, T. Makharashvili, Ruijie He, C. Hwang, D. Beetner, Brian Booth, Kerry Martin","doi":"10.1109/ISEMC.2019.8825258","DOIUrl":"https://doi.org/10.1109/ISEMC.2019.8825258","url":null,"abstract":"Common-mode current on cable harnesses is often the primary source of radiated emissions below several hundred megahertz. It is difficult, however, to estimate common-mode currents that will occur in a system from component level tests because the common-mode impedances are different in the system. Here, a method is proposed to use simple component level tests to estimate equivalent common-mode source voltages and source impedances responsible for generating common-mode current. This source information can be used to predict the common-mode currents on harnesses of different lengths or characteristic impedance. The common-mode load impedances are assumed to be approximately open or short compared to the characteristic impedance of the harness. Equivalent sources are predicted for those circuits terminated with an open and those terminated with a short. Source characteristics are found from the magnitude of the common-mode current measured at multiple locations along the harness while varying the component height above the return plane (i.e., by varying the common-mode source impedance). The proposed method was used to predict the common-mode current on multi-wire harnesses of different lengths. The common-mode current was predicted within a few decibels except at frequencies where the harness was resonant during source estimation.","PeriodicalId":137753,"journal":{"name":"2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-07-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125851420","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Power & Ground Bridging Trace Design for Improved Power Integrity 提高电源完整性的电源和接地桥接走线设计
Hank Lin, B. Tseng, Jackson Yen
{"title":"Power & Ground Bridging Trace Design for Improved Power Integrity","authors":"Hank Lin, B. Tseng, Jackson Yen","doi":"10.1109/ISEMC.2019.8825278","DOIUrl":"https://doi.org/10.1109/ISEMC.2019.8825278","url":null,"abstract":"Nowadays, demand for slimmer and better performance consumer electronics increases dramatically. As PCB size keeps shrinking, power integrity issues such as high voltage drop and power loss arise due to lack of power and ground planes and broken power and ground shapes caused by densely-populated signal vias. In this paper, a novel design of power and ground bridging trace, placed between anti-pads of through-hole vias, the voltage drop issue can be greatly improved.","PeriodicalId":137753,"journal":{"name":"2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI)","volume":"442 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117185891","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
EMC+SIPI 2019 Chairman’s Message EMC+SIPI 2019主席致辞
{"title":"EMC+SIPI 2019 Chairman’s Message","authors":"","doi":"10.1109/isemc.2019.8825251","DOIUrl":"https://doi.org/10.1109/isemc.2019.8825251","url":null,"abstract":"","PeriodicalId":137753,"journal":{"name":"2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI)","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125377992","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Precision Geolocation of Propagation Data Using GPS and Data Fusion 基于GPS和数据融合的传播数据精确地理定位
Anna Paulson
{"title":"Precision Geolocation of Propagation Data Using GPS and Data Fusion","authors":"Anna Paulson","doi":"10.1109/ISEMC.2019.8825198","DOIUrl":"https://doi.org/10.1109/ISEMC.2019.8825198","url":null,"abstract":"Geopositioning uncertainty degrades the usefulness of the data collected while conducting propagation measurements in the field. Researchers currently have access to highly detailed terrain, propagation, and locational data sets, but these data are useless if you don’t know where you are in the world; this, in turn, hampers the development of propagation models. This paper describes a commercial off-the-shelf engineering solution being developed by the US Department of Commerce’s Institute for Telecommunication Sciences that mitigates the problem of dynamic positioning in urban corridors and reduces our positioning uncertainty by as much as an order of magnitude in the horizontal plane.","PeriodicalId":137753,"journal":{"name":"2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI)","volume":"2086 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129942750","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
A Novel Statistical Model for the Electromagnetic Coupling to Electronics inside Enclosures 一种新的机箱内电子电磁耦合统计模型
Shen Lin, Z. Peng, E. Schamiloglu, Zachary B. Drikas, T. Antonsen
{"title":"A Novel Statistical Model for the Electromagnetic Coupling to Electronics inside Enclosures","authors":"Shen Lin, Z. Peng, E. Schamiloglu, Zachary B. Drikas, T. Antonsen","doi":"10.1109/ISEMC.2019.8825194","DOIUrl":"https://doi.org/10.1109/ISEMC.2019.8825194","url":null,"abstract":"The goal of this paper is to investigate fundamental mathematical and statistical algorithms for the spatio-spectral analysis of electromagnetic coupling in large, complex electronic systems. A novel stochastic Green’s function and a statistical representation formula are proposed, which statistically replicates the multipath wave-chaotic dynamics inside cavity environments. The work achieves a physics-based modeling and simulation capability that predicts the probabilistic behavior of high power radio-frequency induced current and voltages in complex electronic systems.","PeriodicalId":137753,"journal":{"name":"2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI)","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129291094","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Comparative Analysis of Magnetic Materials, Coil Structures and Shielding Materials for Efficient Wireless Power Transfer 高效无线电力传输的磁性材料、线圈结构和屏蔽材料的对比分析
M. Bima, I. Bhattacharya, S. R. Hasan
{"title":"Comparative Analysis of Magnetic Materials, Coil Structures and Shielding Materials for Efficient Wireless Power Transfer","authors":"M. Bima, I. Bhattacharya, S. R. Hasan","doi":"10.1109/ISEMC.2019.8825316","DOIUrl":"https://doi.org/10.1109/ISEMC.2019.8825316","url":null,"abstract":"While wireless power transfer (WPT) promises a more convenient means of powering devices, its fruition is primarily predicated on how much efficiency can be derived. Coil structures and shielding materials play pivotal role in increasing power transfer efficiency. However, existing coil structures still perform inefficiently in WPT and shielding materials used in the literature need to be improved upon. This paper proposes a layered DD coil structure as an efficient option for WPT application. Also, materials known to have good magnetic properties are investigated alongside ferrite, which is known to have a good efficiency for WPT but at resonant frequency, its absolute power transfer capability reduces significantly. It can be deduced from our results that the proposed layered DD structure provides better efficiency than its nearest competitor structure, DD coil. Our results also show that for high power transmitting application, cobalt-iron material should be considered instead of Ferrite.","PeriodicalId":137753,"journal":{"name":"2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI)","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123936414","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
E1 HEMP Tests of Gas Discharge Tube Surge Protectors for HF Radios 高频无线电用气体放电管浪涌保护器的E1 HEMP试验
E. Savage, W. Radasky
{"title":"E1 HEMP Tests of Gas Discharge Tube Surge Protectors for HF Radios","authors":"E. Savage, W. Radasky","doi":"10.1109/ISEMC.2019.8825280","DOIUrl":"https://doi.org/10.1109/ISEMC.2019.8825280","url":null,"abstract":"Radio transceivers are vulnerable to E1 HEMP by their very nature; they need an antenna to collect radio waves, and so they collect E1 HEMP also. To prevent damage to the radio, especially its receiver front end, antenna-coupled high-level E1 HEMP signals must be prevented from getting to the receiver. Inexpensive gas tube surge protectors are marketed as protection of radios, and here we report on laboratory tests of samples of these for possible use for E1 HEMP protection.","PeriodicalId":137753,"journal":{"name":"2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI)","volume":"93 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121308223","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
EMC+SIPI 2019 TOC
{"title":"EMC+SIPI 2019 TOC","authors":"","doi":"10.1109/isemc.2019.8825211","DOIUrl":"https://doi.org/10.1109/isemc.2019.8825211","url":null,"abstract":"","PeriodicalId":137753,"journal":{"name":"2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI)","volume":"27 5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116291210","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Impedance Mismatch Effects in Microstrip and Stripline EBG Common-Mode Filters 微带和带状线EBG共模滤波器中的阻抗失配效应
M. Koledintseva, S. Radu, J. Nuebel
{"title":"Impedance Mismatch Effects in Microstrip and Stripline EBG Common-Mode Filters","authors":"M. Koledintseva, S. Radu, J. Nuebel","doi":"10.1109/ISEMC.2019.8825212","DOIUrl":"https://doi.org/10.1109/ISEMC.2019.8825212","url":null,"abstract":"In this paper, impedance mismatch effects on the characteristics of common-mode (CM) electromagnetic bandgap (EBG) filters are studied using 3D full-wave numerical simulations. Herein, the terminations are fixed at 50 Ohms, and the effect of the differential line impedance variations are studied. Two types of CM EBG filters are considered in this work, both are designed using standard printed circuit board technology. The first group contains microstrip (MS) differential pairs running above the EBG plane, and the second group contains stripline (SL) differential pairs running on one of the layers next to the EBG plane. It is shown that the lines impedance mismatch in MS and SL has different effects on the EBG CM filter behavior. Overall, the considered variations in the widths of the traces and edge-to-edge separation distances in the MS and SL structures do not drastically deteriorate the performance of the EBG CM filters. Notch frequencies do not vary much, especially in the MS case, and the filter bandwidth at -15 dB just increases as mismatch increases, which is the favorable effect. Below -15 dB, the CM notch depth itself does not matter from the CM mitigation point of view as soon as the filter bandwidth at the required frequency is achieved.","PeriodicalId":137753,"journal":{"name":"2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI)","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132167793","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
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