提高电源完整性的电源和接地桥接走线设计

2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) Pub Date : 2019-07-01 DOI:10.1109/ISEMC.2019.8825278

Hank Lin, B. Tseng, Jackson Yen

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引用次数: 0

摘要

如今，对更薄、性能更好的消费电子产品的需求急剧增加。随着PCB尺寸的不断缩小，由于缺乏电源和接地平面，以及密集的信号过孔造成的电源和接地形状损坏，导致高电压降和功率损耗等电源完整性问题出现。本文设计了一种新颖的电源和地桥接走线，将其置于通孔过孔的反焊盘之间，可以大大改善电压降问题。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Power & Ground Bridging Trace Design for Improved Power Integrity

Nowadays, demand for slimmer and better performance consumer electronics increases dramatically. As PCB size keeps shrinking, power integrity issues such as high voltage drop and power loss arise due to lack of power and ground planes and broken power and ground shapes caused by densely-populated signal vias. In this paper, a novel design of power and ground bridging trace, placed between anti-pads of through-hole vias, the voltage drop issue can be greatly improved.

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2019 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI)

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