Power & Ground Bridging Trace Design for Improved Power Integrity

Abstract

Nowadays, demand for slimmer and better performance consumer electronics increases dramatically. As PCB size keeps shrinking, power integrity issues such as high voltage drop and power loss arise due to lack of power and ground planes and broken power and ground shapes caused by densely-populated signal vias. In this paper, a novel design of power and ground bridging trace, placed between anti-pads of through-hole vias, the voltage drop issue can be greatly improved.