2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT)最新文献_第8页

Impact of molding parameters on PBGA warpage characteristic 成型参数对PBGA翘曲特性的影响

2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) Pub Date : 2010-11-01 DOI: 10.1109/IEMT.2010.5746693

L. W. Keat, Quah Chin Aik, L. C. Kan, Leehu Loon

引用次数: 2

A reliable low cost assembly technology for 0201 compatible QFN, X3 Thin QFN 一种可靠的低成本组装技术，适用于0201兼容QFN, X3 Thin QFN

2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) Pub Date : 2010-11-01 DOI: 10.1109/IEMT.2010.5746672

W. Law, Nicole Yong, Sh Liew, Daniel Phuah, K. Chung, Pn Ng

引用次数: 1

The importance of reliability in electronics 可靠性在电子产品中的重要性

2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) Pub Date : 2010-11-01 DOI: 10.1109/IEMT.2010.5746759

J. Fjelstad

引用次数: 1

Past, present and future of electronic packaging 电子封装的过去、现在和未来

2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) Pub Date : 2010-11-01 DOI: 10.1109/IEMT.2010.5746773

J. Fjelstad

引用次数: 0

Environmental friendly package development by using copper wirebonding 利用铜线键合技术开发环保型封装

2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) Pub Date : 2010-11-01 DOI: 10.1109/IEMT.2010.5746747

C. Gan, T. Toong, CP Lim, Cy Ng

{"title":"Environmental friendly package development by using copper wirebonding","authors":"C. Gan, T. Toong, CP Lim, Cy Ng","doi":"10.1109/IEMT.2010.5746747","DOIUrl":"https://doi.org/10.1109/IEMT.2010.5746747","url":null,"abstract":"This paper focuses on the 1.0 mil Cu wire development and its reliability performance mainly at component level of a BGA wire bond package which consists of 2 metal layer organic substrate more than 500 pin counts. This paper covers package reliability tests such as THB (Temperature and Humidity Biased test), unbiased HAST, TCB (temperature cycling B), high temperature storage tests on BGA laminate with 1.0 mil 4N bare Cu wire. Selection of best package BOM was based on component reliability test and also assembly process data collected during the evaluation. Therefore selection of BOM is not solely based on reliability performance but also its process feasibility and manufacturability. Comprehensive experimental analysis has been carried out to determine the bill of materials for the most robust Cu wire bonding process and reliability performance. Failure analysis on the unbiased HAST failure unit was carried out to understand the failure mechanism and benchmark to the industrial finding. Final reliability validation based on the selected BOM and process condition was conducted and results have been covered in this paper. In addition, comprehensive ongoing reliability monitoring program and yield monitoring have been established to ensure flawless production implementation and package reliability of Altera's Cu wirebond BGA laminate package.","PeriodicalId":133127,"journal":{"name":"2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT)","volume":"43 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114672183","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 22

Flip chip technology 倒装芯片技术

2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) Pub Date : 2010-11-01 DOI: 10.1109/IEMT.2010.5746775

Y. Tsukada

引用次数: 20

Study on IMC morphology and impact to solder joint performance for different halogen free (HF) flux in semiconductor application 半导体应用中不同无卤助焊剂对IMC形貌及焊点性能影响的研究

2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) Pub Date : 2010-11-01 DOI: 10.1109/IEMT.2010.5746722

Ooi Wan Koon, M. Razai, Chan Boon Pin, N. Mohd Sharif

{"title":"Study on IMC morphology and impact to solder joint performance for different halogen free (HF) flux in semiconductor application","authors":"Ooi Wan Koon, M. Razai, Chan Boon Pin, N. Mohd Sharif","doi":"10.1109/IEMT.2010.5746722","DOIUrl":"https://doi.org/10.1109/IEMT.2010.5746722","url":null,"abstract":"With increased social governance awareness on the usage of halogen products, studies on halogen free (HF) products as replacements are now becoming highly important among semiconductor industry players as well as researchers. In this study, IMC morphology of SAC305 on NiP substrate was used to study or compare the performance for different HF fluxes and halogenated flux candidates. On top of this, the activator used within the flux candidates is also being identified in order to understand the impact on fluxing capability towards the oxides layer removal. The study was focussed on wetting performance of the SAC305 interacting with different fluxes candidates on NiP substrate was on the impact to solder joint strength. Ball shear test and ball pull test were conducted to validate the strength of solder joint developed through the use of various fluxes. In summary, the selected water soluble HF flux provides good solder joint in general than the other HF flux candidates. Comparing IMC morphology among all flux candidates, it is concluded that high angle within IMC layers plays an essential role in ensuring good solder joint as well as the contribution of scallope shape IMC and the present of small Ag3Sn along IMC layer in solder joint strengthening.","PeriodicalId":133127,"journal":{"name":"2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT)","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115807499","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Plasma process considerations in emerging semiconductor packaging technologies 新兴半导体封装技术中的等离子体工艺考虑

2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) Pub Date : 2010-11-01 DOI: 10.1109/IEMT.2010.5746732

J. Getty, D. Chir

{"title":"Plasma process considerations in emerging semiconductor packaging technologies","authors":"J. Getty, D. Chir","doi":"10.1109/IEMT.2010.5746732","DOIUrl":"https://doi.org/10.1109/IEMT.2010.5746732","url":null,"abstract":"Plasma cleaning technology is a well known method of contamination removal and surface activation to enhance the performance and reliability of advanced semiconductor packages. It has also gained widespread acceptance and implementation over the last 10 years. With the continued introduction of new packaging technologies and materials, the applications for plasma technology have also broadened. This paper will review the considerations and performance benefits of employing plasma technology in flip chip, copper wirebonding and LED lens molding applications. The importance of using the optimum combination of process parameters and plasma technology in conjunction with different combination of materials will be the key underlying theme. This will be clearly illustrated firstly with a flip chip application example where the correct gas chemistry is shown to be important in achieving the desired adhesion and reliability characteristics in a flip chip underfill process. Quantitative data obtained from field studies will also be presented to show how plasma treatment can enable the realization of the low-cost benefits of copper wirebonding. Also discussed will be how the advantages of inline type plasma over a batch type system can produce significantly improved wirebond results. Finally, we will discuss how the adhesion promotion ability of plasma treatment enables the high-volume, low cost production of molded silicone LED lenses.","PeriodicalId":133127,"journal":{"name":"2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT)","volume":"49 8","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132709234","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Package crack resolution through low stress dambar punch design: A six sigma DMAIC approach 通过低应力损伤冲床设计解决包装裂纹:六西格玛DMAIC方法

2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) Pub Date : 2010-11-01 DOI: 10.1109/IEMT.2010.5746729

Angelo R. Uy, M. Picardal, Patrocinio Enriquez, Arnold C. Alaraz

引用次数: 3

Evolutionary development of wafer level packaging 晶圆级封装的进化发展

2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) Pub Date : 2010-11-01 DOI: 10.1109/IEMT.2010.5746740

J. Hunt

引用次数: 1