通过低应力损伤冲床设计解决包装裂纹:六西格玛DMAIC方法

2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) Pub Date : 2010-11-01 DOI:10.1109/IEMT.2010.5746729

Angelo R. Uy, M. Picardal, Patrocinio Enriquez, Arnold C. Alaraz

{"title":"通过低应力损伤冲床设计解决包装裂纹:六西格玛DMAIC方法","authors":"Angelo R. Uy, M. Picardal, Patrocinio Enriquez, Arnold C. Alaraz","doi":"10.1109/IEMT.2010.5746729","DOIUrl":null,"url":null,"abstract":"Package micro-crack has been a stern problem in ON Semiconductors Philippines Inc (OSPI) Trim and Form (T&F) process. That despite numerous studies to eliminate the problem it still persist. Package micro-crack was of concern as it has a high chance to escape assembly inspection control and electrical test. And potentially will contribute to the product failure upon application of stress.","PeriodicalId":133127,"journal":{"name":"2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2010-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Package crack resolution through low stress dambar punch design: A six sigma DMAIC approach\",\"authors\":\"Angelo R. Uy, M. Picardal, Patrocinio Enriquez, Arnold C. Alaraz\",\"doi\":\"10.1109/IEMT.2010.5746729\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Package micro-crack has been a stern problem in ON Semiconductors Philippines Inc (OSPI) Trim and Form (T&F) process. That despite numerous studies to eliminate the problem it still persist. Package micro-crack was of concern as it has a high chance to escape assembly inspection control and electrical test. And potentially will contribute to the product failure upon application of stress.\",\"PeriodicalId\":133127,\"journal\":{\"name\":\"2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT)\",\"volume\":\"3 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2010-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEMT.2010.5746729\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMT.2010.5746729","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 3

摘要

封装微裂纹一直是安森美半导体菲律宾公司(OSPI) Trim and Form (T&F)工艺中的一个严重问题。尽管有许多研究试图消除这个问题，但它仍然存在。由于包装微裂纹很有可能逃脱装配检验控制和电气测试，因此引起了人们的关注。并且在施加应力时可能会导致产品失效。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Package crack resolution through low stress dambar punch design: A six sigma DMAIC approach

Package micro-crack has been a stern problem in ON Semiconductors Philippines Inc (OSPI) Trim and Form (T&F) process. That despite numerous studies to eliminate the problem it still persist. Package micro-crack was of concern as it has a high chance to escape assembly inspection control and electrical test. And potentially will contribute to the product failure upon application of stress.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT)

自引率

0.00%

发文量