W. Law, Nicole Yong, Sh Liew, Daniel Phuah, K. Chung, Pn Ng
{"title":"一种可靠的低成本组装技术,适用于0201兼容QFN, X3 Thin QFN","authors":"W. Law, Nicole Yong, Sh Liew, Daniel Phuah, K. Chung, Pn Ng","doi":"10.1109/IEMT.2010.5746672","DOIUrl":null,"url":null,"abstract":"Electronics devices nowadays, especially the portable consumer devices like notebooks, GPS, multimedia players, digital cameras, camcorders, cellular phone handsets and accessories, are increasingly driving product demand and technological developments. Each succeeding product generation is expected to be smaller and lighter in weight, driving the needs of miniaturization technologies.","PeriodicalId":133127,"journal":{"name":"2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT)","volume":"31 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2010-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"A reliable low cost assembly technology for 0201 compatible QFN, X3 Thin QFN\",\"authors\":\"W. Law, Nicole Yong, Sh Liew, Daniel Phuah, K. Chung, Pn Ng\",\"doi\":\"10.1109/IEMT.2010.5746672\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Electronics devices nowadays, especially the portable consumer devices like notebooks, GPS, multimedia players, digital cameras, camcorders, cellular phone handsets and accessories, are increasingly driving product demand and technological developments. Each succeeding product generation is expected to be smaller and lighter in weight, driving the needs of miniaturization technologies.\",\"PeriodicalId\":133127,\"journal\":{\"name\":\"2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT)\",\"volume\":\"31 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2010-11-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEMT.2010.5746672\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMT.2010.5746672","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A reliable low cost assembly technology for 0201 compatible QFN, X3 Thin QFN
Electronics devices nowadays, especially the portable consumer devices like notebooks, GPS, multimedia players, digital cameras, camcorders, cellular phone handsets and accessories, are increasingly driving product demand and technological developments. Each succeeding product generation is expected to be smaller and lighter in weight, driving the needs of miniaturization technologies.