SPIE MOEMS-MEMS最新文献_第7页

Mechanical assembly and magnetic actuation of polydimethylsiloxane-iron composite interconnects for microfluidic systems 微流控系统中聚二甲基硅氧烷-铁复合互连的机械装配和磁驱动

SPIE MOEMS-MEMS Pub Date : 2008-02-07 DOI: 10.1117/12.764068

S. Jaffer, B. Gray, D. Sahota, M. Sjoerdsma

{"title":"Mechanical assembly and magnetic actuation of polydimethylsiloxane-iron composite interconnects for microfluidic systems","authors":"S. Jaffer, B. Gray, D. Sahota, M. Sjoerdsma","doi":"10.1117/12.764068","DOIUrl":"https://doi.org/10.1117/12.764068","url":null,"abstract":"We present magnetically-actuated micromechanical interconnects for microfluidic applications fabricated in-house using PDMS-iron elastomer-ferromagnetic composites (EFCs). Interconnects are fluid-tight, interlocking cylindrical posts and holes whose assembly can be made easier by magnetically actuating the EFC cylinders via axial extension and radial contraction. Towards this goal, we demonstrate magnetic actuation of interconnect structures, and quantify the mechanical disassembly of PDMS-iron interconnects without an applied magnetic field. Previously, we showed the mechanical assembly and disassembly of hybrid combinations of non-magnetic SU-8, silicon, and polydimethylsiloxane (PDMS) microfluidic interconnects. We fabricate EFCs for our interconnects by embedding iron microspheres (<63% by weight) in PDMS. We employed permanent magnets to create 0.045-0.065T constant fields, along with an optics test set-up that included a diode laser and magnification to quantify micron-sized deflections. The interconnects exhibited radial contractions of 3-12% and axial elongation of 2-11%. Without the magnetic field, disassembly forces of 36-71mN were measured by a controlled force linear actuator for PDMS-iron cylinders from PDMS and PDMS-iron holes. This work shows promise for radial contraction of cylinders for assembly with lower forces while maintaining high disassembly forces once the interconnects are assembled and the magnetic field is removed.","PeriodicalId":130723,"journal":{"name":"SPIE MOEMS-MEMS","volume":"6886 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-02-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130718433","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 6

MEMS reliability: coming of age MEMS可靠性:成熟

SPIE MOEMS-MEMS Pub Date : 2008-02-07 DOI: 10.1117/12.791010

M. Douglass

引用次数: 12

Connecting interface for modularization of digital microfluidics 数字微流体模块化连接接口

SPIE MOEMS-MEMS Pub Date : 2008-02-07 DOI: 10.1117/12.765652

Hanping Yang, S. Fan, W. Hsu

引用次数: 0

Precise open-loop control of MEMS deformable mirror shape MEMS可变形镜面形状的精确开环控制

SPIE MOEMS-MEMS Pub Date : 2008-02-07 DOI: 10.1117/12.769492

T. Bifano, J. Stewart, A. Diouf

引用次数: 3

Fabrication of integrated channel waveguides in polydimethylsiloxane (PDMS) using proton beam writing (PBW): applications for fluorescence detection in microfluidic channels 质子束写入技术制备聚二甲基硅氧烷(PDMS)集成通道波导:微流控通道荧光检测的应用

SPIE MOEMS-MEMS Pub Date : 2008-02-07 DOI: 10.1117/12.762885

C. Udalagama, S. F. Chan, S. Homhuan, A. Bettiol, T. Wohland, F. Watt

{"title":"Fabrication of integrated channel waveguides in polydimethylsiloxane (PDMS) using proton beam writing (PBW): applications for fluorescence detection in microfluidic channels","authors":"C. Udalagama, S. F. Chan, S. Homhuan, A. Bettiol, T. Wohland, F. Watt","doi":"10.1117/12.762885","DOIUrl":"https://doi.org/10.1117/12.762885","url":null,"abstract":"Proton beam writing (PBW) is a lithographic technique that utilizes MeV protons in a direct write mode to fabricate micro/nano features in suitable resist material (E.g PMMA, SU-8, silicon, Foturan). These micro/nano structures may be used in an electroplating step to yield robust metallic stamps/molds for the replication of the original and lends itself to the fabrication of micro/nano fluidic channels that are important components in devices such as biophotonic chips. Another feature of proton bombardment is its ability to induce an increase in refractive index along the ions path, in particular at the end of its range where there is substantial nuclear scattering. This allows PBW to directly write buried waveguides that can be accurately aligned with fluidic channels. Polydimethylsiloxane (PDMS) is an optically clear, biocompatible polymer that can be readily used with a mold (such as that created with PBW) and easily sealed so as to produce biophotonic chips containing micro/nano fluidic channels. This has lead us to favour PDMS as the base material for our work on the development of these biophotonic chips. The present work is concerned with the production of integrating channel waveguides in PDMS chips, so as to have a working device that may be used to detect fluorescently tagged biological samples. For this we have adopted two approaches, namely(1) directly embedding optical fibres in the polymer and (2) using PBW to directly write buried waveguides in the polymer.","PeriodicalId":130723,"journal":{"name":"SPIE MOEMS-MEMS","volume":"119 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-02-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128768498","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 10

Measurement of thin films and interfacial surface roughness using SWLI 用SWLI测量薄膜和界面表面粗糙度

SPIE MOEMS-MEMS Pub Date : 2008-02-07 DOI: 10.1117/12.762824

M. Conroy

{"title":"Measurement of thin films and interfacial surface roughness using SWLI","authors":"M. Conroy","doi":"10.1117/12.762824","DOIUrl":"https://doi.org/10.1117/12.762824","url":null,"abstract":"Interferometry is now an established technique for the measurement of surface topography. It has the capability of combining sub-nanometre resolution, high measurement speed with high repeatability. A very useful extension to its capability is the ability to measure thick and thin films on a local scale. For films with thicknesses in excess of 1-2 μm (depending on refractive index), the SWLI interaction with the film leads to the formation of localised fringes, each corresponding to a surface interface. It is relatively trivial to locate the positions of these envelope maxima and therefore determine the film thickness, assuming the refractive index is known. For thin films (with thicknesses ~20 nm to ~2 μm, again depending on the refractive index), the SWLI interaction leads to the formation of a single interference maxima. In this context, it is appropriate to describe the thin film structure in terms of optical admittances; it is this regime that is addressed through the introduction of a new function, the 'helical conjugate field' (HCF) function. This function may be considered as providing a 'signature' of the multilayer measured so that through optimization, the thin film multilayer may be determined on a local scale.","PeriodicalId":130723,"journal":{"name":"SPIE MOEMS-MEMS","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-02-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117146046","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Simulation and interferometer results of MEMS deformable mirrors MEMS变形镜的仿真与干涉仪结果

SPIE MOEMS-MEMS Pub Date : 2008-02-07 DOI: 10.1117/12.766886

B. Fernández, J. Kubby

引用次数: 5

A biocompatible miniaturized package housing for a 3D micromirror-based optical bioprobe for OCT imaging application 用于OCT成像应用的基于三维微镜的光学生物探针的生物相容性小型化封装外壳

SPIE MOEMS-MEMS Pub Date : 2008-02-07 DOI: 10.1117/12.762949

C. Premachandran, A. Khairyanto, K. Chen, J. Singh

引用次数: 1

MEMS post-processing of MPW dies using BSOI carrier wafers 基于BSOI载流子晶圆的MPW模的MEMS后处理

SPIE MOEMS-MEMS Pub Date : 2008-02-07 DOI: 10.1117/12.763217

A. Mukherjee, M. Kiziroglou, A. Holmes, E. Yeatman

{"title":"MEMS post-processing of MPW dies using BSOI carrier wafers","authors":"A. Mukherjee, M. Kiziroglou, A. Holmes, E. Yeatman","doi":"10.1117/12.763217","DOIUrl":"https://doi.org/10.1117/12.763217","url":null,"abstract":"Multi-project-wafer (MPW) services provide an economical route for prototyping of new electronic circuit designs. However, addition of MEMS functionality to MPW circuits by post-processing (also known as MEMS-last processing) is difficult and inefficient because MPW typically yields individual dies. One solution to this problem is to embed the MPW dies in a carrier wafer prior to MEMS processing. We have developed a process which allows 300 μm-thick CMOS dies to be embedded in a BSOI (bonded silicon-on-insulator) carrier prior to low-temperature processing for integration of metal MEMS. Deep reactive ion etching (DRIE) with an STS Multiplex ICP etcher is used to form cavities in the device layer of a BSOI wafer. By adjusting the passivation and etching cycles, the DRIE process has been optimized to produce near-vertical sidewalls when stopping on the buried oxide layer. The cavity sizes are closely matched to the die dimensions to ensure placement of the dies to within ±15 μm. Dies are placed in all the cavities, and then a photoresist layer is deposited by spin-coating and patterned to provide access to the required IC contact pads. The photoresist has the dual role of securing the dies and also planarizing the top surface of the carrier. After an appropriate baking cycle this layer provides a suitable base for multi-level electroplating or other low-temperature MEMS processing.","PeriodicalId":130723,"journal":{"name":"SPIE MOEMS-MEMS","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-02-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122065505","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 7

Microfabrication of an integrated optical cell counter for cytometry application 用于细胞计数的集成光学细胞计数器的微加工

SPIE MOEMS-MEMS Pub Date : 2008-02-07 DOI: 10.1117/12.778332

Guocheng Shao, Wanjun Wang

引用次数: 3