SPIE MOEMS-MEMS最新文献_第8页

Highly integrated microfluidic sensors 高度集成的微流体传感器

SPIE MOEMS-MEMS Pub Date : 2008-02-07 DOI: 10.1117/12.764028

D. Angelescu, Hua Chen, J. Jundt, H. Berthet, B. Mercier, F. Marty

引用次数: 6

Advances in the fabrication of surface modified microfluidic devices in nonfluorescing UV cured materials 非荧光UV固化材料表面改性微流控器件的制备进展

SPIE MOEMS-MEMS Pub Date : 2008-02-07 DOI: 10.1117/12.758755

M. Watts, N. Cramer, R. Sebra, H. Simms, K. Masters, T. Haraldsson, K. Anseth, C. Bowman

引用次数: 1

Sensitivity and stress effects of composite membranes with micro/macro porous silicon for pressure sensor applications 微/大孔硅压力传感器复合膜的灵敏度和应力效应

SPIE MOEMS-MEMS Pub Date : 2008-02-07 DOI: 10.1117/12.762868

L. Sujatha, E. Bhattacharya

{"title":"Sensitivity and stress effects of composite membranes with micro/macro porous silicon for pressure sensor applications","authors":"L. Sujatha, E. Bhattacharya","doi":"10.1117/12.762868","DOIUrl":"https://doi.org/10.1117/12.762868","url":null,"abstract":"Since porous silicon (PS) has a lower Young's Modulus as compared to silicon, Silicon/Porous Silicon (Si/PS) composite membranes are expected to show higher sensitivity as compared to membranes of silicon alone. In this paper we discuss the fabrication and testing of Si/PS composite membranes where a part of the silicon membrane depth is converted into PS. Composite membranes with Si/ microPS and Si/ macroPS were fabricated with varying porosity and same thickness. The composite membranes with micro PS show higher sensitivity than composite membranes with macro PS. Formation of microporous and macroporous silicon produces stress on the membrane varying with the porosity. The variation in compressive stress on the membrane with porosity for both micro and macro PS has been studied by measuring the deformation of the composite membrane with a surface profiler and the stress is found to be larger for microPS. The compressive stress results in an increase in the offset voltage by more than an order of magnitude for composite membranes with porosity above 50% as compared to one with a single crystalline silicon one. Though the composite membranes exhibit saturation and hysteresis at higher pressures, the response is linear and repeatable at pressures below 1 bar making this a viable option for sensing low pressures.","PeriodicalId":130723,"journal":{"name":"SPIE MOEMS-MEMS","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-02-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133298809","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Reliability of MEMS devices in shock and vibration overload situations 冲击和振动过载情况下MEMS器件的可靠性

SPIE MOEMS-MEMS Pub Date : 2008-02-07 DOI: 10.1117/12.763617

S. Kurth, A. Shaporin, K. Hiller, C. Kaufmann, T. Gessner

引用次数: 5

Advances in roll to roll processing of optics 光学卷对卷加工技术的进展

SPIE MOEMS-MEMS Pub Date : 2008-02-07 DOI: 10.1117/12.762668

M. Watts

引用次数: 4

Micro-inductors integrated on silicon for DC-DC converters 用于DC-DC转换器的硅集成微电感器

SPIE MOEMS-MEMS Pub Date : 2008-02-07 DOI: 10.1117/12.763085

T. El Mastouli, J. Laur, J. Sanchez, M. Brunet, D. Bourrier, M. Dilhan

引用次数: 8

Challenges of designing and processing extreme low-G microelectromechanical system (MEMS) accelerometers 设计和加工极低重力微电子机械系统(MEMS)加速度计的挑战

SPIE MOEMS-MEMS Pub Date : 2008-02-07 DOI: 10.1117/12.778244

T. Swiler, U. Krishnamoorthy, P. Clews, M. Baker, D. M. Tanner

{"title":"Challenges of designing and processing extreme low-G microelectromechanical system (MEMS) accelerometers","authors":"T. Swiler, U. Krishnamoorthy, P. Clews, M. Baker, D. M. Tanner","doi":"10.1117/12.778244","DOIUrl":"https://doi.org/10.1117/12.778244","url":null,"abstract":"There is an increasing demand to build highly sensitive, low-G, microscale acceleration sensors with the ability to sense accelerations in the nano-G (10-8 m/s2) regime. To achieve such sensitivities, these sensors require compliant mechanical springs attached to large masses. The high sensitivities and the difficulty in integrating robust mechanical stops into these designs make these parts inherently weak, lacking the robustness to survive even the low level accelerations encountered in standard handling, from release processing, where supporting interlayers present during fabrication are etched away, through packaging. Thus, the process of transforming a MEMS-based acceleration sensor from an unreleased state to a protected functional state poses significant challenges. We summarize prior experiences with packaging such devices and report on recent work in packaging and protecting a highly sensitive acceleration sensor that optically senses displacement through the use of sub-wavelength nanogratings. We find that successful implementation of such sensors requires starting with a clean and robust MEMS design, performing careful and controlled release processing, and designing and executing a robust handling and packaging solution that keeps a fragile MEMS device protected at all times.","PeriodicalId":130723,"journal":{"name":"SPIE MOEMS-MEMS","volume":"141 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-02-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124234030","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 10

Compact MEMS-based adaptive optics: optical coherence tomography for clinical use 紧凑型基于mems的自适应光学:用于临床的光学相干断层扫描

SPIE MOEMS-MEMS Pub Date : 2008-02-07 DOI: 10.1117/12.772035

Diana C. Chen, S. Olivier, S. Jones, R. Zawadzki, J. W. Evans, Stacey S. Choi, J. Werner

引用次数: 1

Photosensitive etch protection coating for silicon wet-etch applications 用于硅湿蚀刻应用的光敏蚀刻保护涂层

SPIE MOEMS-MEMS Pub Date : 2008-02-07 DOI: 10.1117/12.778246

J. Dalvi-Malhotra, X. Zhong, C. Planje

{"title":"Photosensitive etch protection coating for silicon wet-etch applications","authors":"J. Dalvi-Malhotra, X. Zhong, C. Planje","doi":"10.1117/12.778246","DOIUrl":"https://doi.org/10.1117/12.778246","url":null,"abstract":"A spin-on polymeric material has been developed to replace the silicon nitride mask used in the MEMS industry for silicon wet-etch processing. Built-in photosensitivity eliminates the need for additional photoresists in the system. The process consists of applying an organosilane-based primer layer onto a silicon wafer, followed by spin coating the photosensitive layer. After a soft bake, the coating is imaged by exposing it to ultraviolet light. After a post-exposure bake, the coating is developed by a solvent. After a final bake, the prepared wafer is then etched in a hot concentrated alkaline solution to complete the pattern transfer. The polymer-coated area remains protected with insignificant and controllable undercut after extended hours of wet etching. Etch protection performance was characterized as a ratio of undercut (u) to etch depth (h). The polymeric mask allows silicon substrates to be etched anisotropically in the same way as silicon nitride masks although more undercut occurs when KOH or NaOH are used as etchants. With use of tetramethylammonium hydroxide (TMAH) as an etchant, a consistent 1-2% undercut ratio (u/h×100%) was obtained. The effects of various parameters such as use of different etchants and the effects of etchant concentration and delayed processing on undercut ratio are investigated.","PeriodicalId":130723,"journal":{"name":"SPIE MOEMS-MEMS","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2008-02-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127875220","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Development and characterization of a microheater array device for real-time DNA mutation detection 用于实时DNA突变检测的微加热器阵列装置的研制与表征

SPIE MOEMS-MEMS Pub Date : 2008-02-07 DOI: 10.1117/12.767286

Layne D. Williams, M. Okandan, A. Chagovetz, S. Blair

引用次数: 1