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Proceedings of the 6th International Conference on Intelligent Information Processing最新文献

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Design of Indoor Intelligent Alarm System Based on STM32 基于STM32的室内智能报警系统设计
Proceedings of the 6th International Conference on Intelligent Information Processing Pub Date : 2021-07-29 DOI: 10.1145/3480571.3480587
Lele Niu, Zu‐Pei Ou, Wenchen Wang
{"title":"Design of Indoor Intelligent Alarm System Based on STM32","authors":"Lele Niu, Zu‐Pei Ou, Wenchen Wang","doi":"10.1145/3480571.3480587","DOIUrl":"https://doi.org/10.1145/3480571.3480587","url":null,"abstract":"Nowadays, if indoor accidents are not discovered in time, they are likely to cause major casualties. For example, fires, toxic gases, water leaks in the house, etc. will cause a large degree of damage to the interior. In order to prevent such incidents from happening, STM32-based the indoor intelligent alarm system is of great significance. In the past years, some indoor disasters have been reported from time to time. For example, there were more than 290 incidents of fires and poisoning caused by gas leaks. 86% of them were caused by people's negligence, a seen that the development and design of indoor intelligent there were even more burglaries. More than 350. With the development of indoor alarm systems, the incidence of indoor fires has dropped by 60%, and the incidence of burglaries has dropped by as much as 70%. It can be alarm systems are extremely important. This article uses STM32f407VGT6 as the core indoor intelligent alarm system [1], and measures and detects in the real environment. After comparison and analysis, under the same function, compare the STM32f401 and 51 series single-chip microcomputers as the core system to detect indoor temperature and humidity. Detection [5], and outdoor infrared ranging [6], have higher, more accurate, and reliable measurement results, and a more stable system, which greatly improves energy efficiency.","PeriodicalId":113723,"journal":{"name":"Proceedings of the 6th International Conference on Intelligent Information Processing","volume":"44 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-07-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127327033","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Compatible process design and analysis of system-in-package 包中系统兼容工艺设计与分析
Proceedings of the 6th International Conference on Intelligent Information Processing Pub Date : 2021-07-29 DOI: 10.1145/3480571.3480634
Longsui Mo, X. Dai, Otilia Manta
{"title":"Compatible process design and analysis of system-in-package","authors":"Longsui Mo, X. Dai, Otilia Manta","doi":"10.1145/3480571.3480634","DOIUrl":"https://doi.org/10.1145/3480571.3480634","url":null,"abstract":"At present, system-level packaging technology has become the mainstream in the field of semiconductor packaging technology. In this era of rapid development of science and technology, it has a great market prospect.The finite element analysis is carried out by using ANSYS, and the failure mode that the maximum stress value appears on the corner of solder joint after welding and cooling down is simulated and analyzed, which is prone to stress concentration. This failure will directly damage the chip and substrate, affect its performance and affect the system function.Secondly, both the chip and the substrate are affected by stress. The stress generated by the contact between the chip and the substrate and the solder joint is greater than that in other places, and the stress generated by the solder joint will directly affect the components.This topic is to analyze the reliability and compatibility of system-level package integration. Emphasis is placed on the stress effect and reliability of the package after welding process, and the influence of the stress produced by solder joints on the whole package, especially on the chip.","PeriodicalId":113723,"journal":{"name":"Proceedings of the 6th International Conference on Intelligent Information Processing","volume":"148 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-07-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132525512","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Rock image segmentation based on salient target detection method 基于显著目标检测的岩石图像分割方法
Proceedings of the 6th International Conference on Intelligent Information Processing Pub Date : 2021-07-29 DOI: 10.1145/3480571.3480612
Pei-hua Li, Ziming Zou
{"title":"Rock image segmentation based on salient target detection method","authors":"Pei-hua Li, Ziming Zou","doi":"10.1145/3480571.3480612","DOIUrl":"https://doi.org/10.1145/3480571.3480612","url":null,"abstract":"∗In the process of rock image classification, the existence of rock image background affects the accuracy of rock recognition. In this paper, a saliency target detection network based on the attention mechanism is used to generate the saliency map of the rock image, and the local and global information of the image is extracted through a grid structure of multiple resolutions, and they are merged into prediction features; The saliency map uses an adaptive threshold method to segment the background area of the rock image, and only retains the rock area image, which further improves the accuracy of rock sample classification. By comparing the traditional histogram-based threshold segmentation, the edge detection method based on the Canny algorithm and the salient target detection method based on the attention mechanism, the results show that the result of using the salient target detection method to achieve rock image segmentation is more accurate. It proves its effectiveness for rock image segmentation.","PeriodicalId":113723,"journal":{"name":"Proceedings of the 6th International Conference on Intelligent Information Processing","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-07-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131668517","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Study on the influence of Taguchi melt deposition molding on tensile properties 田口熔体沉积成型对拉伸性能影响的研究
Proceedings of the 6th International Conference on Intelligent Information Processing Pub Date : 2021-07-29 DOI: 10.1145/3480571.3480592
Haixiong Wang, Jinhui He, Yajun Li
{"title":"Study on the influence of Taguchi melt deposition molding on tensile properties","authors":"Haixiong Wang, Jinhui He, Yajun Li","doi":"10.1145/3480571.3480592","DOIUrl":"https://doi.org/10.1145/3480571.3480592","url":null,"abstract":"∗In order to study the influence factors of melt deposition molding (FDM) process parameters on the mechanical properties of materials and determine the internal law of its influence on the tensile strength, the Taguchi test was used to study the influence of four factors, including layer thickness, shell thickness, filling density and printing speed, on the tensile properties of polylactic acid (PLA) products. The results show that the filling density has the greatest influence on the tensile strength of PLA parts, followed by the shell thickness, and the printing speed and layer thickness have a weak influence. After optimization, the optimal process parameters are as follows: the filling density is 100%, the shell thickness is 1.2mm, the printing speed is 50mm/min and the printing layer thickness is 0.2mm.","PeriodicalId":113723,"journal":{"name":"Proceedings of the 6th International Conference on Intelligent Information Processing","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-07-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130982508","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Cycle thermal simulation of nano silver paste based on Anand model 基于Anand模型的纳米银浆循环热模拟
Proceedings of the 6th International Conference on Intelligent Information Processing Pub Date : 2021-07-29 DOI: 10.1145/3480571.3480599
Hui Yang, Z. Zhan
{"title":"Cycle thermal simulation of nano silver paste based on Anand model","authors":"Hui Yang, Z. Zhan","doi":"10.1145/3480571.3480599","DOIUrl":"https://doi.org/10.1145/3480571.3480599","url":null,"abstract":"Since the advantages of low temperature sintering of nano-silver paste, nano silver can sintering at low temperature and work at high temperatures, compared with other lead-free solders, low temperature sintering of nano-silver paste has been applied in various chip packages. In this paper, Anand viscoelastic constitutive model was adopted, and WORKBENCH software was used to simulate the hot cycle load of the array chip of nano-silver paste. The simulation results show that the after four cycles of thermal cycle load, the temperature distribution of the solder joints gradually increases from the center to the surroundings, and the solder joints at the corners have the highest temperature, so the maximum plastic strain accumulation occurred at corner solder joints. For a single solder joint, the temperature near the substrate is higher, so deformation and destroy more prone occurred at the bottom of the solder joints, which is the main two reason that may cause the failure of chip connection.","PeriodicalId":113723,"journal":{"name":"Proceedings of the 6th International Conference on Intelligent Information Processing","volume":"64 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-07-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131059698","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Analysis of important components of rubber extruder 橡胶挤出机重要部件分析
Proceedings of the 6th International Conference on Intelligent Information Processing Pub Date : 2021-07-29 DOI: 10.1145/3480571.3480601
Faguo Huang, Shouqi Zhang, Jiafang Pan
{"title":"Analysis of important components of rubber extruder","authors":"Faguo Huang, Shouqi Zhang, Jiafang Pan","doi":"10.1145/3480571.3480601","DOIUrl":"https://doi.org/10.1145/3480571.3480601","url":null,"abstract":"∗This paper introduces several important parts of the rubber extruder on the stability of the extrusion quality and uniformity, including the feeder, screw, barrel and head of the extruder, and analyzes the influence of some important parameters (such as screw speed, barrel temperature, etc.) on the extrusion stability of the products.","PeriodicalId":113723,"journal":{"name":"Proceedings of the 6th International Conference on Intelligent Information Processing","volume":"41 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-07-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115183356","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Research on Influencing Parameters of Ultrasonic Welding Quality of Car Wheel Eyebrow 影响汽车轮眉超声焊接质量的参数研究
Proceedings of the 6th International Conference on Intelligent Information Processing Pub Date : 2021-07-29 DOI: 10.1145/3480571.3480593
Yuchao Hu, Hui Yang
{"title":"Research on Influencing Parameters of Ultrasonic Welding Quality of Car Wheel Eyebrow","authors":"Yuchao Hu, Hui Yang","doi":"10.1145/3480571.3480593","DOIUrl":"https://doi.org/10.1145/3480571.3480593","url":null,"abstract":"∗The main parameters that affect the quality of ultrasonic welding are welding time, holding pressure time, welding depth, trigger air pressure, welding air pressure, and the vibration frequency and amplitude of the ultrasonic generator. Ultrasonic vibration when the equipment is installed at a fixed point The frequency and vibration amplitude are fixed, and the ultrasonic trigger mode of the equipment used in this paper is delayed trigger, and only needs to delay until the set time to trigger the ultrasonic. Therefore, this article mainly studies the effects of holding pressure time, welding depth, and welding air pressure on the welding quality of car wheel eyebrows. Orthogonal experiments of welding parameters were carried out with drawing force and appearance as indicators to explore the relevant technical parameters that can achieve the best welding quality.","PeriodicalId":113723,"journal":{"name":"Proceedings of the 6th International Conference on Intelligent Information Processing","volume":"24 4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-07-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123274360","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Design and numerical simulation analysis of valve-less piezoelectric pump with semi-cylinder bluff body 半圆柱钝体无阀压电泵的设计与数值模拟分析
Proceedings of the 6th International Conference on Intelligent Information Processing Pub Date : 2021-07-29 DOI: 10.1145/3480571.3480626
Cheng Li, Tianxiang Yan
{"title":"Design and numerical simulation analysis of valve-less piezoelectric pump with semi-cylinder bluff body","authors":"Cheng Li, Tianxiang Yan","doi":"10.1145/3480571.3480626","DOIUrl":"https://doi.org/10.1145/3480571.3480626","url":null,"abstract":"∗A valve-less piezoelectric pump with semi-cylinder bluff body was designed. The structure and working principle of pump were illustrated, and the output flow rate was theoretically analyzed. The flow field of pump cavity was simulated by ANSYS. The internal pressure and velocity distributions of flow field suggest that the valve-less piezoelectric pump with semi-cylinder bluff body can carry out the one-way fluid transmission. The influence of structure parameters of pump cavity on the output flow rate was investigated, and the optimal structure parameters were obtained. When the radius (R) of semi-cylinder bluff body is 3.5 mm and the spacing (L) between the semi-cylinder and cavity top is 1 mm, the maximum output flow rate is 4.21 g/s, suggesting that the designed pump has a good fluid transport capacity.","PeriodicalId":113723,"journal":{"name":"Proceedings of the 6th International Conference on Intelligent Information Processing","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-07-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124992989","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Impact of farmer organization forms on agricultural product quality from the perspective of technology adoption 技术采用视角下农民组织形式对农产品质量的影响
Proceedings of the 6th International Conference on Intelligent Information Processing Pub Date : 2021-07-29 DOI: 10.1145/3480571.3480586
Xi Chen, Xiaoming Ou, Xiaoling Dong, Hongmei Yang, U. Comite, Xiaoguang Yue
{"title":"Impact of farmer organization forms on agricultural product quality from the perspective of technology adoption","authors":"Xi Chen, Xiaoming Ou, Xiaoling Dong, Hongmei Yang, U. Comite, Xiaoguang Yue","doi":"10.1145/3480571.3480586","DOIUrl":"https://doi.org/10.1145/3480571.3480586","url":null,"abstract":"This paper innovatively incorporates organizational form, technology adoption, and product quality into a unified analysis framework for discussion. It analyzes the different impacts of different organizational forms on farmers' technology adoption and product quality. Through a survey of chicken farmers in Wenchang City, Hainan Province, the proposed hypothesis is tested by Ologit model and OLS model. The results show that: different organizational forms exert different impacts on farmers' technology adoption, and the degree of technology adoption directly determines product quality. That is, technology adoption plays a certain mediating role between organizational form and product quality. Enlightenment: Since mass-produced products are easier to trace, companies face higher foul cost and exit cost, thus naturally transmitting product quality pressure downward. Supervisors only need supervise the company to reduce the supervision cost. For those agricultural products allowing socialized production, organizations such as companies should be encouraged to integrate with them, so that the power of companies can be used to facilitate farmers’ technology adoption behavior and enable better agricultural product quality.","PeriodicalId":113723,"journal":{"name":"Proceedings of the 6th International Conference on Intelligent Information Processing","volume":"115 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-07-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128253534","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 11
Mechanical Properties of Steel-roll Round Baler during the Baling Process 钢辊圆捆机在打包机过程中的力学性能
Proceedings of the 6th International Conference on Intelligent Information Processing Pub Date : 2021-07-29 DOI: 10.1145/3480571.3480625
Junle Lei, Shuaiwei Wang
{"title":"Mechanical Properties of Steel-roll Round Baler during the Baling Process","authors":"Junle Lei, Shuaiwei Wang","doi":"10.1145/3480571.3480625","DOIUrl":"https://doi.org/10.1145/3480571.3480625","url":null,"abstract":"∗To further analyze the baling mechanism of steel-roll round baler, the mechanical properties of intact rice straw during the baling process were studied in this paper by a self-designed test stand for steel-roll round balers. The results showed that the baling process of steel-roll round baler could be divided into the rotary straw core forming, rotary straw core filling and straw bale rolling stages. In the rotary straw core forming and filling stages, the torque required for baling slowly increased with the increase in the mass of straw bale, and the steel roll had no extrusion force on the straw bale. In the straw bale rolling stage, the torque required for baling first increased in a relatively quick manner and then rose rapidly with the increase in the mass of straw bale, and the straw bale began to be extruded by the steel roll and generated positive pressure on the steel roll, where the positive pressure increased slowly at first and rose rapidly then.","PeriodicalId":113723,"journal":{"name":"Proceedings of the 6th International Conference on Intelligent Information Processing","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-07-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117235487","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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