IEEE electromagnetic compatibility magazine最新文献_第4页

Letter from the Editor 编辑来信

IEEE electromagnetic compatibility magazine Pub Date : 2023-01-01 DOI: 10.1109/memc.2023.10201902

引用次数: 0

IEEE Latin American Symposium on Circuits and Systems (LASCAS) IEEE拉丁美洲电路与系统研讨会(LASCAS)

IEEE electromagnetic compatibility magazine Pub Date : 2023-01-01 DOI: 10.1109/lascas16614.2010

N. Mora

引用次数: 1

Signal Integrity Analysis of the Structure with Single Modal Reservation Before and After Failures 单模态保留结构失效前后信号完整性分析

IEEE electromagnetic compatibility magazine Pub Date : 2023-01-01 DOI: 10.1109/MEMC.2023.10136459

Y. Zhechev, A. Medvedev, T. Gazizov

{"title":"Signal Integrity Analysis of the Structure with Single Modal Reservation Before and After Failures","authors":"Y. Zhechev, A. Medvedev, T. Gazizov","doi":"10.1109/MEMC.2023.10136459","DOIUrl":"https://doi.org/10.1109/MEMC.2023.10136459","url":null,"abstract":"To improve the reliability of radio electronic devices, engineers use redundancy of the most relevant circuits. The simplest and most common solution is classical cold redundancy in which the primary and redundant circuits are located far from each other. Meanwhile, locating the primary and redundant circuits close together makes it possible to use modal distortions to protect both circuits from unwanted ultra-wideband interference. This approach is known as modal redundancy or modal reservation (MR). This paper presents the results of signal integrity analysis for a structure with single MR before and after failures. It is shown that the bandwidth after failures changes. This affects the rate of data that can be excited to the input of the device without significant distortion of the useful signal. The authors used pseudorandom binary sequences with a data rate of 50 and 200 Mbps. It is experimentally shown that failures in the redundant circuit do not significantly degrade the quality of signal integrity in the bandwidth. Thus, the data-dependent jitter changes from 12 (before failures) to 19 ps (after the worst failure). In all investigated variants, the eye stays open; as a result, the bit error rate will be low. The mismatch of the redundant circuit has the largest effect on the noise amplitude. As a result, the signal-to-noise ratio decreases from 57 (before failures) to 28 (after the worst failure). To confirm the measurements, we performed electrodynamic simulations. Their results are in good agreement with the experimental data.","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"12 1","pages":"69-73"},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62489928","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Probe Design and Source Reconstruction for Near-Field Scanning and Modeling 近场扫描与建模探头设计与震源重建

IEEE electromagnetic compatibility magazine Pub Date : 2023-01-01 DOI: 10.1109/MEMC.2023.10136447

Di Wang, Xing-Chang Wei, En-Xiao Liu, Richard Xian-Ke Gao

{"title":"Probe Design and Source Reconstruction for Near-Field Scanning and Modeling","authors":"Di Wang, Xing-Chang Wei, En-Xiao Liu, Richard Xian-Ke Gao","doi":"10.1109/MEMC.2023.10136447","DOIUrl":"https://doi.org/10.1109/MEMC.2023.10136447","url":null,"abstract":"This paper elaborates the near-field scanning and modeling technique developed for electromagnetic interference (EMI) analysis. The technique has been increasingly deployed in many R&D labs of universities and testing centers of industry companies due to its advantages in terms of time and cost, comparing with conventional EMI measurement methods. The major research works related to the near-field scanning and modeling are probe design and source reconstruction method (SRM). In this article, the working principle of electric and magnetic probes are firstly introduced. Probe parameters including calibration factor, electric center, sensitivity, spatial resolution and bandwidth are discussed. Next, the equivalent radiation source modeling approach is presented. Through SRM, a complex and unknown EMI source is substituted with the simplified equivalent radiation source based on the electromagnetic fields measured by magnetic and/or electric probes. The phaseless SRM is thereafter discussed for addressing the limitations in conventional SRM and its applications prove that the near-field scanning and modeling technique can effectively predict EMI far-field radiation and near-field coupling.","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"12 1","pages":"75-86"},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62490154","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Investigation on Fractional Bandwidth Enhancement of a Resonant Absorber 共振吸收器分数阶带宽增强研究

IEEE electromagnetic compatibility magazine Pub Date : 2023-01-01 DOI: 10.1109/MEMC.2023.10201437

Manish Mathew Tirkey, N. Gupta

引用次数: 0

Chapter Chatter 章喋喋不休

IEEE electromagnetic compatibility magazine Pub Date : 2023-01-01 DOI: 10.1109/memc.2023.10201444

Gabe Alcala

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NEW Signal Integrity/Power Integrity Short Course at 2023 EMC+SIPI Symposium 2023 EMC+SIPI研讨会新信号完整性/电源完整性短期课程

IEEE electromagnetic compatibility magazine Pub Date : 2023-01-01 DOI: 10.1109/memc.2023.10136461

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An Overview of the IEEE P2715 Guide for the Characterization of the Shielding Effectiveness of Planar Materials IEEE P2715平面材料屏蔽效能表征指南综述

IEEE electromagnetic compatibility magazine Pub Date : 2023-01-01 DOI: 10.1109/MEMC.2023.10201434

Adrian Suarez Zapata, J. Dawson, Yoeri Ariën, J. Catrysse, D. Pissoort, A. Marvin

{"title":"An Overview of the IEEE P2715 Guide for the Characterization of the Shielding Effectiveness of Planar Materials","authors":"Adrian Suarez Zapata, J. Dawson, Yoeri Ariën, J. Catrysse, D. Pissoort, A. Marvin","doi":"10.1109/MEMC.2023.10201434","DOIUrl":"https://doi.org/10.1109/MEMC.2023.10201434","url":null,"abstract":"An electromagnetic shielding material is any material used to make shielding enclosures, typically to shield electronic components, circuits and systems against incoming electromagnetic fields, and to reduce the emission of electromagnetic waves by a circuit or system. For most applications, the choice of the material for designing and manufacturing the shielding enclosure is based on the characterization of planar samples of the shielding material. Several techniques are available to measure the shielding properties of materials. The “IEEE P2715 Guide for the Characterization of the Shielding Effectiveness of Planar Materials” provides guidance on the use of recognized techniques for the measurement of planar material shielding effectiveness. The guide describes the features and limitations of commonly accepted techniques for characterizing the shielding effectiveness of planar materials, and provides a basis for comparing the techniques. This contribution introduces the P2715 standard and summarizes the methods currently available to measure the shielding provided by a planar material.","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"7 1","pages":"78-88"},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62490182","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

2023 IEEE International Symposium on EMC+SIPI - Announcing Technical Program Highlights 2023 IEEE EMC+SIPI国际研讨会-宣布技术计划亮点

IEEE electromagnetic compatibility magazine Pub Date : 2023-01-01 DOI: 10.1109/memc.2023.10136455

引用次数: 0

EMC Personality Profile EMC个性配置文件

IEEE electromagnetic compatibility magazine Pub Date : 2023-01-01 DOI: 10.1109/memc.2023.10201443

Frank Sabath

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