IEEE electromagnetic compatibility magazine最新文献

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Call for EMC Society Awards Nominations: Nominations Due: February 15, 2023 EMC协会奖提名征集:提名截止日期:2023年2月15日
IEEE electromagnetic compatibility magazine Pub Date : 2022-01-01 DOI: 10.1109/memc.2022.9982574
Flavia Grassi
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引用次数: 0
IBIS Update: 2022 IEEE International Symposium on Electromagnetic Compatibility, Signal & Power Integrity (EMC+SIPI) IBIS更新:2022年IEEE电磁兼容性、信号和电源完整性国际研讨会(EMC+SIPI)
IEEE electromagnetic compatibility magazine Pub Date : 2022-01-01 DOI: 10.1109/memc.2022.9982579
Randy Wolff, Zhiping Yang
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引用次数: 0
Signal Integrity and Power Integrity 信号完整性和电源完整性
IEEE electromagnetic compatibility magazine Pub Date : 2022-01-01 DOI: 10.1109/memc.2022.9780310
Zhiping Yang
{"title":"Signal Integrity and Power Integrity","authors":"Zhiping Yang","doi":"10.1109/memc.2022.9780310","DOIUrl":"https://doi.org/10.1109/memc.2022.9780310","url":null,"abstract":"","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62488548","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
EMC Society Podcasts Featuring Industry Luminaries EMC协会播客以行业名人为特色
IEEE electromagnetic compatibility magazine Pub Date : 2022-01-01 DOI: 10.1109/memc.2022.9873826
{"title":"EMC Society Podcasts Featuring Industry Luminaries","authors":"","doi":"10.1109/memc.2022.9873826","DOIUrl":"https://doi.org/10.1109/memc.2022.9873826","url":null,"abstract":"","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62489094","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Recent Trends in Image Information Recovery Using Leaked Electromagnetic Wave from Electronic Equipment 利用电子设备泄漏电磁波恢复图像信息的新趋势
IEEE electromagnetic compatibility magazine Pub Date : 2022-01-01 DOI: 10.1109/MEMC.2022.9982567
D. Choi, Euibum Lee, Taesik Nam, J. Yook
{"title":"Recent Trends in Image Information Recovery Using Leaked Electromagnetic Wave from Electronic Equipment","authors":"D. Choi, Euibum Lee, Taesik Nam, J. Yook","doi":"10.1109/MEMC.2022.9982567","DOIUrl":"https://doi.org/10.1109/MEMC.2022.9982567","url":null,"abstract":"Information input/output technology has been employed in various fields in our modern lives, and it is almost impossible for society to function without the devices based on this technology. Therefore, security issues associated with such electronic devices have attracted extensive attention. This study thoroughly reviews various TEMPEST-related research outcomes and trends. It contains both conventional and deep learning-based image processing techniques and research involving realistic scenarios, including concrete walls, information recovery under multiple devices, and reconstruction of color information.","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62489706","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Simultaneous Security and EMC Evaluations Based on Measuring Electromagnetic Field Distribution on PCBs 基于pcb上电磁场分布测量的安全性和EMC同步评估
IEEE electromagnetic compatibility magazine Pub Date : 2022-01-01 DOI: 10.1109/MEMC.2022.9982569
Youngwoo Kim, Daisuke Fujimoto, Y. Hayashi
{"title":"Simultaneous Security and EMC Evaluations Based on Measuring Electromagnetic Field Distribution on PCBs","authors":"Youngwoo Kim, Daisuke Fujimoto, Y. Hayashi","doi":"10.1109/MEMC.2022.9982569","DOIUrl":"https://doi.org/10.1109/MEMC.2022.9982569","url":null,"abstract":"This article introduces a method to simultaneously evaluate the security and electromagnetic compatibility (EMC) of information devices equipped with cryptographic modules by measuring the electromagnetic (EM) field distribution on a printed circuit board (PCB). The proposed method requires a single correlation analysis above the cryptographic integrated circuit (IC) to define the frequency band of the EM field containing the secret information. Then, focusing on the radiation intensity in the frequency domain, an efficient method capable of obtaining the EM field distribution that contributes to the leakage of confidential information is proposed. Simultaneous EMC and security evaluations can be conducted by analyzing the obtained EM field distribution. Using the proposed method, EM field radiation and information leakage of an actual cryptographic device are analyzed. Compared to conventional methods requiring a large computational resource and analysis time, the proposed method can efficiently obtain the distribution of electric and magnetic fields that cause leakage of confidential information. Lastly, discussion, design guide, and future research directions are briefly provided.","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62489759","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
New Credential Program at iNARTE iNARTE的新证书课程
IEEE electromagnetic compatibility magazine Pub Date : 2022-01-01 DOI: 10.1109/memc.2022.9780305
Christian Thornton
{"title":"New Credential Program at iNARTE","authors":"Christian Thornton","doi":"10.1109/memc.2022.9780305","DOIUrl":"https://doi.org/10.1109/memc.2022.9780305","url":null,"abstract":"","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62488382","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Vulnerability Assessment Method for Electronic Devices Excited by Transient Electromagnetic Disturbances 瞬变电磁干扰下电子器件易损性评估方法
IEEE electromagnetic compatibility magazine Pub Date : 2022-01-01 DOI: 10.1109/MEMC.2022.10058843
Yu-hao Chen, Kejie Li, Zongyang Wang, Yi Zhou, Yan-zhao Xie
{"title":"Vulnerability Assessment Method for Electronic Devices Excited by Transient Electromagnetic Disturbances","authors":"Yu-hao Chen, Kejie Li, Zongyang Wang, Yi Zhou, Yan-zhao Xie","doi":"10.1109/MEMC.2022.10058843","DOIUrl":"https://doi.org/10.1109/MEMC.2022.10058843","url":null,"abstract":"Vulnerability assessment of electronic devices excited by various transient electromagnetic disturbances (TEDs) has been a key issue in electromagnetic susceptibility research. This paper proposes a generalized vulnerability assessment method that includes acquiring data and building assessment model. The data is normally acquired by carrying out experiments, while the assessment model is mainly determined by prior information. As different devices under test (DUTs) could offer a different amount of prior information, a generalized assessment model consisting of a white-box model, a grey-box model, and a black-box model is built to deal with situations of sufficient prior information, partial prior information, and no prior information, respectively.","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62488463","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
What's New with IBIS and Upcoming Opportunities for SI and PI Engineers to Learn More IBIS的最新动态以及SI和PI工程师了解更多信息的机会
IEEE electromagnetic compatibility magazine Pub Date : 2022-01-01 DOI: 10.1109/memc.2022.9780308
Randy Wolff
{"title":"What's New with IBIS and Upcoming Opportunities for SI and PI Engineers to Learn More","authors":"Randy Wolff","doi":"10.1109/memc.2022.9780308","DOIUrl":"https://doi.org/10.1109/memc.2022.9780308","url":null,"abstract":"","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62488473","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Analysis of Several Electromagnetic Band Gap Topologies for Reducing Simultaneous Switching Noise 几种降低同时开关噪声的电磁带隙拓扑分析
IEEE electromagnetic compatibility magazine Pub Date : 2022-01-01 DOI: 10.1109/memc.2022.9780309
Y. U. Maheswari, A. Amudha, L. Kumar
{"title":"Analysis of Several Electromagnetic Band Gap Topologies for Reducing Simultaneous Switching Noise","authors":"Y. U. Maheswari, A. Amudha, L. Kumar","doi":"10.1109/memc.2022.9780309","DOIUrl":"https://doi.org/10.1109/memc.2022.9780309","url":null,"abstract":"In the case of high-speed PCB design, the use of electromagnetic band gap (EBG) structure technology is useful in reducing simultaneous switching noise (SSN) in high-frequency applications. In high-frequency processes, parasitic filters are ineffective. Conducted emission is reduced by including the planar EBG structure into PCB plane layers. Various planar structures are taken and simulated in this research, including LC type, Z-Bridge with embedded double square, L-Bridge with slit type, alternating impedance, slit type EBG, Triple square type, and two topology type structures. A frequency sweep of 0 GHz to 10 GHz is used with a FEM solution. Theoretical calculations of the structures are performed and compared to simulation results, which show that they are very similar. Based on the best bandwidth and noise depth, the L-Bridge with slit and Triple square type cases were chosen, constructed, and analyzed using a vector network analyzer; it was discovered that the noise depth and bandwidth are in good accord. In addition, the AC analysis-Electric Field distribution for power and ground planes is explored, and the maximum and minimum field levels may be understood as a consequence.","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62488481","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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