IEEE electromagnetic compatibility magazine最新文献

筛选
英文 中文
Save the Date! 2023 IEEE EMC+SIPI Symposium 保存日期!2023 IEEE EMC+SIPI研讨会
IEEE electromagnetic compatibility magazine Pub Date : 2022-01-01 DOI: 10.1109/memc.2022.9872435
{"title":"Save the Date! 2023 IEEE EMC+SIPI Symposium","authors":"","doi":"10.1109/memc.2022.9872435","DOIUrl":"https://doi.org/10.1109/memc.2022.9872435","url":null,"abstract":"","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"1 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62488824","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Student EMC Hardware Design Contest 2022 学生EMC硬件设计竞赛2022
IEEE electromagnetic compatibility magazine Pub Date : 2022-01-01 DOI: 10.1109/memc.2022.9982537
Pavithrakrishnan Radhakrishnan
{"title":"Student EMC Hardware Design Contest 2022","authors":"Pavithrakrishnan Radhakrishnan","doi":"10.1109/memc.2022.9982537","DOIUrl":"https://doi.org/10.1109/memc.2022.9982537","url":null,"abstract":"","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"1 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62488908","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Industry Luminaries Presenting in Spokane 业界杰出人士在斯波坎发表演讲
IEEE electromagnetic compatibility magazine Pub Date : 2022-01-01 DOI: 10.1109/memc.2022.9780336
{"title":"Industry Luminaries Presenting in Spokane","authors":"","doi":"10.1109/memc.2022.9780336","DOIUrl":"https://doi.org/10.1109/memc.2022.9780336","url":null,"abstract":"","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"1 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62488931","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Wiley-IEEE Press: Call for Book Authors on EMC Theory and Practice Wiley-IEEE出版社:EMC理论与实践图书作者征集
IEEE electromagnetic compatibility magazine Pub Date : 2022-01-01 DOI: 10.1109/memc.2022.9780340
{"title":"Wiley-IEEE Press: Call for Book Authors on EMC Theory and Practice","authors":"","doi":"10.1109/memc.2022.9780340","DOIUrl":"https://doi.org/10.1109/memc.2022.9780340","url":null,"abstract":"","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"1 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62489022","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
EMC Compo 2021 - Online Edition Organized from KU Leuven Bruges Campus EMC Compo 2021-在线版由鲁汶大学布鲁日分校组织
IEEE electromagnetic compatibility magazine Pub Date : 2022-01-01 DOI: 10.1109/memc.2022.9873831
D. Pissoort
{"title":"EMC Compo 2021 - Online Edition Organized from KU Leuven Bruges Campus","authors":"D. Pissoort","doi":"10.1109/memc.2022.9873831","DOIUrl":"https://doi.org/10.1109/memc.2022.9873831","url":null,"abstract":"","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"1 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62489142","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Homage to Heinrich Hertz 向海因里希·赫兹致敬
IEEE electromagnetic compatibility magazine Pub Date : 2022-01-01 DOI: 10.1109/memc.2022.9780287
D. Forfar
{"title":"Homage to Heinrich Hertz","authors":"D. Forfar","doi":"10.1109/memc.2022.9780287","DOIUrl":"https://doi.org/10.1109/memc.2022.9780287","url":null,"abstract":"g “In his 1870 Presidential Address to the Mathematical and Physical Section of the British Association for the Advancement of Science, the great Clerk Maxwell spoke of, as an undecided question, whether electromagnetic phenomena are due to ‘direct action at a distance’ or ‘the action of an intervening medium’. The year, 1888, will ever be memorable as the year in which this great question has been experimentally decided by Hertz...” Professor G.F. Fitzgerald, President, in 1888, of the Mathematical and Physical Section of the British Association for the Advancement of Science","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"1 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62488334","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
You're Invited! Opportunities to Attend Standards and Technical Community Activities in August 2022 你邀请!2022年8月参加标准和技术社区活动的机会
IEEE electromagnetic compatibility magazine Pub Date : 2022-01-01 DOI: 10.1109/memc.2022.9780298
R. Carlton
{"title":"You're Invited! Opportunities to Attend Standards and Technical Community Activities in August 2022","authors":"R. Carlton","doi":"10.1109/memc.2022.9780298","DOIUrl":"https://doi.org/10.1109/memc.2022.9780298","url":null,"abstract":"","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"1 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62488340","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Numerical Evaluation of the HEMP Diffusion into Buried Infrastructures 埋地基础设施中HEMP扩散的数值评价
IEEE electromagnetic compatibility magazine Pub Date : 2022-01-01 DOI: 10.1109/MEMC.2022.10058848
Nicolas Mora, A. Kaelin, Carlos Romero
{"title":"Numerical Evaluation of the HEMP Diffusion into Buried Infrastructures","authors":"Nicolas Mora, A. Kaelin, Carlos Romero","doi":"10.1109/MEMC.2022.10058848","DOIUrl":"https://doi.org/10.1109/MEMC.2022.10058848","url":null,"abstract":"The use of High Altitude Electromagnetic Pulses (HEMP) as a threat to society has prompted the scientific community to produce methodologies to address the electromagnetic compatibility (EMC) of installations against radiated and conducted interference with frequency and amplitude ranges that may differ from traditional sources of disturbance, such as lightning, industrial noise, or communications broadcasting. This has led to a trend toward providing more effective modeling strategies for studying the response of large complex systems. The main issues that arise when analyzing such systems are the significant amount of memory and CPU time required to process these simulations and the ability to include physical models of generally neglected components (materials, vents, slots) that are necessary to obtain an accurate description of current distributions [1].","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"11 1","pages":"85-93"},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62488525","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Young Professionals EMC — Get Ready to Meet In Person in Spokane! 年轻的专业人士EMC -准备在斯波坎亲自见面!
IEEE electromagnetic compatibility magazine Pub Date : 2022-01-01 DOI: 10.1109/memc.2022.9780283
Patrick DeRoy
{"title":"Young Professionals EMC — Get Ready to Meet In Person in Spokane!","authors":"Patrick DeRoy","doi":"10.1109/memc.2022.9780283","DOIUrl":"https://doi.org/10.1109/memc.2022.9780283","url":null,"abstract":"","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"1 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62488725","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Women in Engineering IEEE工程女性
IEEE electromagnetic compatibility magazine Pub Date : 2022-01-01 DOI: 10.1109/memc.2022.9982539
Mariya Antyufeyeva
{"title":"IEEE Women in Engineering","authors":"Mariya Antyufeyeva","doi":"10.1109/memc.2022.9982539","DOIUrl":"https://doi.org/10.1109/memc.2022.9982539","url":null,"abstract":"","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"1 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62488919","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
相关产品
×
本文献相关产品
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信