IEEE electromagnetic compatibility magazine最新文献

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Testing 5G User Equipment: Review, Challenges, and Gaps from the Medical Device Perspective. 测试5G用户设备:从医疗设备角度的回顾、挑战和差距。
IEEE electromagnetic compatibility magazine Pub Date : 2022-01-01 DOI: 10.1109/memc.2022.9780281
Yongkang Liu, Mohamad Omar Al Kalaa
{"title":"Testing 5G User Equipment: Review, Challenges, and Gaps from the Medical Device Perspective.","authors":"Yongkang Liu,&nbsp;Mohamad Omar Al Kalaa","doi":"10.1109/memc.2022.9780281","DOIUrl":"https://doi.org/10.1109/memc.2022.9780281","url":null,"abstract":"<p><p>5G technology can enable novel healthcare applications and augment existing medical device use of wireless technology to improve healthcare delivery. Having the dual role of medical device and cellular user equipment (UE), 5G-enabled devices navigate a plethora of rules and tests before they can operate on a 5G network to deliver their intended medical function. In this paper, we review the state-of-the-art of 5G UE certification programs and testing specifications. We then identify test challenges and discuss the relevance of existing test practices to support the 5G-enabled medical device safety and effectiveness. This information is useful to medical device developers planning to incorporate 5G technology in their products and wireless engineers working to expand mobile services into the healthcare vertical.</p>","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9214773/pdf/nihms-1812012.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"10459841","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
A Look Back at The Washington Bulletin, July 1962 《华盛顿公报》回顾,1962年7月
IEEE electromagnetic compatibility magazine Pub Date : 2022-01-01 DOI: 10.1109/memc.2022.10058835
M. Violette
{"title":"A Look Back at The Washington Bulletin, July 1962","authors":"M. Violette","doi":"10.1109/memc.2022.10058835","DOIUrl":"https://doi.org/10.1109/memc.2022.10058835","url":null,"abstract":"","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62488299","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Announcing the 2022 Experiments and Demonstrations! 宣布2022年的实验和演示!
IEEE electromagnetic compatibility magazine Pub Date : 2022-01-01 DOI: 10.1109/memc.2022.9780304
Gabe Alcala, Jacob Dixon
{"title":"Announcing the 2022 Experiments and Demonstrations!","authors":"Gabe Alcala, Jacob Dixon","doi":"10.1109/memc.2022.9780304","DOIUrl":"https://doi.org/10.1109/memc.2022.9780304","url":null,"abstract":"","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62488375","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Statue of Liberty and Lightning: Remarks on the Commentary by Mike Violette, Published in the Chapter Chatter Column, EMC Magazine, 3rd Quarter 2022 自由女神像和闪电:迈克·维奥莱特评论的评论,发表在《EMC》杂志的章节闲聊专栏,2022年第3季度
IEEE electromagnetic compatibility magazine Pub Date : 2022-01-01 DOI: 10.1109/memc.2022.10058833
M. Mardiguian
{"title":"Statue of Liberty and Lightning: Remarks on the Commentary by Mike Violette, Published in the Chapter Chatter Column, EMC Magazine, 3rd Quarter 2022","authors":"M. Mardiguian","doi":"10.1109/memc.2022.10058833","DOIUrl":"https://doi.org/10.1109/memc.2022.10058833","url":null,"abstract":"","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62488736","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Investigation on Grounding Solutions for Shielded Cables by Simple SPICE Models 基于简单SPICE模型的屏蔽电缆接地方案研究
IEEE electromagnetic compatibility magazine Pub Date : 2022-01-01 DOI: 10.1109/MEMC.2022.9873813
S. Caniggia, F. Maradei
{"title":"Investigation on Grounding Solutions for Shielded Cables by Simple SPICE Models","authors":"S. Caniggia, F. Maradei","doi":"10.1109/MEMC.2022.9873813","DOIUrl":"https://doi.org/10.1109/MEMC.2022.9873813","url":null,"abstract":"The aim of the paper is to investigate the performance in terms of immunity of different grounding solutions of shielded cables such as coaxial, twinax and triaxial (doubled screened), by simple SPICE simulations. The cables are modeled by lumped equivalent circuits based on the key parameter of transfer impedance. It is shown that, cascading N electrically short unit cells of the cable, it is possible to obtain the same accurate results of a distributed model, valid without limit in frequency, for the frequency range of interest. The advantage of this approach is that these circuit models are suitable for both frequency and transient simulations. They can be easily implemented in the latest generation of commercial SPICE-like simulators with minimum effort, and the simulations run in very few seconds. The accuracy of the models is validated by comparison with measurements, with the results obtained by a full-wave 3D software and other methods. Some practical grounding cable structures are simulated and guidelines are given.","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62488889","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
NEW - Social Media Toolkit for Spokane Symposium 新的社会媒体工具包为斯波坎研讨会
IEEE electromagnetic compatibility magazine Pub Date : 2022-01-01 DOI: 10.1109/memc.2022.9780338
{"title":"NEW - Social Media Toolkit for Spokane Symposium","authors":"","doi":"10.1109/memc.2022.9780338","DOIUrl":"https://doi.org/10.1109/memc.2022.9780338","url":null,"abstract":"","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62488984","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
News on 2023 Student EMC Hardware Design Contest 2023学生EMC硬件设计竞赛新闻
IEEE electromagnetic compatibility magazine Pub Date : 2022-01-01 DOI: 10.1109/memc.2022.9982557
{"title":"News on 2023 Student EMC Hardware Design Contest","authors":"","doi":"10.1109/memc.2022.9982557","DOIUrl":"https://doi.org/10.1109/memc.2022.9982557","url":null,"abstract":"","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62489440","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
CEM 2023: Computation in Electromagnetics Conference cem2023:电磁学计算会议
IEEE electromagnetic compatibility magazine Pub Date : 2022-01-01 DOI: 10.1109/memc.2022.9873827
{"title":"CEM 2023: Computation in Electromagnetics Conference","authors":"","doi":"10.1109/memc.2022.9873827","DOIUrl":"https://doi.org/10.1109/memc.2022.9873827","url":null,"abstract":"","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62489101","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Technical Theme Topics 技术主题
IEEE electromagnetic compatibility magazine Pub Date : 2022-01-01 DOI: 10.1109/memc.2022.9873836
F. Grassi
{"title":"Technical Theme Topics","authors":"F. Grassi","doi":"10.1109/memc.2022.9873836","DOIUrl":"https://doi.org/10.1109/memc.2022.9873836","url":null,"abstract":"Protecting critical infrastructures, such as utilities (e.g. power utilities) and services (e.g. data and communication), against electromagnetic pulses (EMP) is a critical challenge for EMC engineers. Large-scale threats are associated with nuclear detonations, known as high-altitude EMP (HEMP). On a smaller scale, high-power microwave (HPM) weapons have smaller range and power but higher frequency content. Key aspects for electronics protection include the prediction of the disturbance reaching the susceptible device on the one hand, and the assessment of device vulnerability to such disturbance on the other.","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62489213","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
News on 2023 IEEE International Symposium on EMC+SIPI in Grand Rapids, Michigan 在密歇根州大急流城举行的2023 IEEE EMC+SIPI国际研讨会的新闻
IEEE electromagnetic compatibility magazine Pub Date : 2022-01-01 DOI: 10.1109/memc.2022.9982558
{"title":"News on 2023 IEEE International Symposium on EMC+SIPI in Grand Rapids, Michigan","authors":"","doi":"10.1109/memc.2022.9982558","DOIUrl":"https://doi.org/10.1109/memc.2022.9982558","url":null,"abstract":"","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62489511","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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