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Technical Theme Topics 技术主题
IEEE electromagnetic compatibility magazine Pub Date : 2022-01-01 DOI: 10.1109/memc.2022.9873836
F. Grassi
{"title":"Technical Theme Topics","authors":"F. Grassi","doi":"10.1109/memc.2022.9873836","DOIUrl":"https://doi.org/10.1109/memc.2022.9873836","url":null,"abstract":"Protecting critical infrastructures, such as utilities (e.g. power utilities) and services (e.g. data and communication), against electromagnetic pulses (EMP) is a critical challenge for EMC engineers. Large-scale threats are associated with nuclear detonations, known as high-altitude EMP (HEMP). On a smaller scale, high-power microwave (HPM) weapons have smaller range and power but higher frequency content. Key aspects for electronics protection include the prediction of the disturbance reaching the susceptible device on the one hand, and the assessment of device vulnerability to such disturbance on the other.","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"12 1","pages":"85-85"},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62489213","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
News on 2023 IEEE International Symposium on EMC+SIPI in Grand Rapids, Michigan 在密歇根州大急流城举行的2023 IEEE EMC+SIPI国际研讨会的新闻
IEEE electromagnetic compatibility magazine Pub Date : 2022-01-01 DOI: 10.1109/memc.2022.9982558
{"title":"News on 2023 IEEE International Symposium on EMC+SIPI in Grand Rapids, Michigan","authors":"","doi":"10.1109/memc.2022.9982558","DOIUrl":"https://doi.org/10.1109/memc.2022.9982558","url":null,"abstract":"","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"1 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62489511","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Scenes from the 2022 IEEE International Symposium on Electromagnetic Compatibility (EMC), Signal and Power Integrity (SIPI) in Spokane, Washington, August 1-5 8月1日至5日，2022年IEEE电磁兼容性、信号与电源完整性国际研讨会在美国华盛顿州斯波坎举行
IEEE electromagnetic compatibility magazine Pub Date : 2022-01-01 DOI: 10.1109/memc.2022.9982562
{"title":"Scenes from the 2022 IEEE International Symposium on Electromagnetic Compatibility (EMC), Signal and Power Integrity (SIPI) in Spokane, Washington, August 1-5","authors":"","doi":"10.1109/memc.2022.9982562","DOIUrl":"https://doi.org/10.1109/memc.2022.9982562","url":null,"abstract":"","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"1 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62489574","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
STANDARDS WEEK 2022: Standards Activities at the EMC+SIPI Symposium in Spokane, Washington 2022年标准周:EMC+SIPI研讨会上的标准活动
IEEE electromagnetic compatibility magazine Pub Date : 2022-01-01 DOI: 10.1109/memc.2022.9982568
E. Hare, R. Carlton
{"title":"STANDARDS WEEK 2022: Standards Activities at the EMC+SIPI Symposium in Spokane, Washington","authors":"E. Hare, R. Carlton","doi":"10.1109/memc.2022.9982568","DOIUrl":"https://doi.org/10.1109/memc.2022.9982568","url":null,"abstract":"","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"1 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62489723","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Testing 5G User Equipment: Review, Challenges, and Gaps from the Medical Device Perspective. 测试5G用户设备：从医疗设备角度的回顾、挑战和差距。
IEEE electromagnetic compatibility magazine Pub Date : 2022-01-01 DOI: 10.1109/memc.2022.9780281
Yongkang Liu, Mohamad Omar Al Kalaa
{"title":"Testing 5G User Equipment: Review, Challenges, and Gaps from the Medical Device Perspective.","authors":"Yongkang Liu, Mohamad Omar Al Kalaa","doi":"10.1109/memc.2022.9780281","DOIUrl":"10.1109/memc.2022.9780281","url":null,"abstract":"<p><p>5G technology can enable novel healthcare applications and augment existing medical device use of wireless technology to improve healthcare delivery. Having the dual role of medical device and cellular user equipment (UE), 5G-enabled devices navigate a plethora of rules and tests before they can operate on a 5G network to deliver their intended medical function. In this paper, we review the state-of-the-art of 5G UE certification programs and testing specifications. We then identify test challenges and discuss the relevance of existing test practices to support the 5G-enabled medical device safety and effectiveness. This information is useful to medical device developers planning to incorporate 5G technology in their products and wireless engineers working to expand mobile services into the healthcare vertical.</p>","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"11 1","pages":"33-44"},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.ncbi.nlm.nih.gov/pmc/articles/PMC9214773/pdf/nihms-1812012.pdf","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"10459841","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Announcing the “Ask The Experts” Panels at the 2022 IEEE International Symposium on EMC+SIPI in Spokane, Washington 在华盛顿斯波坎举行的2022年IEEE EMC+SIPI国际研讨会上宣布“询问专家”小组
IEEE electromagnetic compatibility magazine Pub Date : 2022-01-01 DOI: 10.1109/memc.2022.9780299
F. Leferink
{"title":"Announcing the “Ask The Experts” Panels at the 2022 IEEE International Symposium on EMC+SIPI in Spokane, Washington","authors":"F. Leferink","doi":"10.1109/memc.2022.9780299","DOIUrl":"https://doi.org/10.1109/memc.2022.9780299","url":null,"abstract":"","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"1 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62488366","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
The John Howard Memorial EMC Education Grant Call for Proposals 约翰·霍华德纪念EMC教育基金征集提案
IEEE electromagnetic compatibility magazine Pub Date : 2022-01-01 DOI: 10.1109/memc.2022.10058854
{"title":"The John Howard Memorial EMC Education Grant Call for Proposals","authors":"","doi":"10.1109/memc.2022.10058854","DOIUrl":"https://doi.org/10.1109/memc.2022.10058854","url":null,"abstract":"","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"1 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62488660","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Computational Intelligence Based Selection and Placement of Decoupling Capacitors: A Comparative Study 基于计算智能的去耦电容选择与放置的比较研究
IEEE electromagnetic compatibility magazine Pub Date : 2022-01-01 DOI: 10.1109/MEMC.2022.9873812
Surendra Hemaram, J. N. Tripathi
{"title":"Computational Intelligence Based Selection and Placement of Decoupling Capacitors: A Comparative Study","authors":"Surendra Hemaram, J. N. Tripathi","doi":"10.1109/MEMC.2022.9873812","DOIUrl":"https://doi.org/10.1109/MEMC.2022.9873812","url":null,"abstract":"In high-speed VLSI systems, decoupling capacitors are the key components to minimize power supply noise in power delivery networks. For efficiently maintaining power integrity in these systems, optimal selection and placement of decoupling capacitors is necessary. This paper presents a computational intelligence based generic framework to solve the industrial problem of decoupling capacitor optimization in a practical power delivery network using metaheuristic algorithms. The cumulative impedance of a power delivery network is minimized below the target impedance by optimal selection and placement of decoupling capacitors using the state-of-the-art metaheuristic algorithms. A comparative analysis of the performance of these algorithms is presented with the insights of practical implementation.","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"11 1","pages":"49-59"},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62488832","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
2022 EMC+SIPI Symposium: Clayton R. Paul Global University Announced 2022 EMC+SIPI研讨会:克莱顿保罗全球大学宣布
IEEE electromagnetic compatibility magazine Pub Date : 2022-01-01 DOI: 10.1109/memc.2022.9780337
{"title":"2022 EMC+SIPI Symposium: Clayton R. Paul Global University Announced","authors":"","doi":"10.1109/memc.2022.9780337","DOIUrl":"https://doi.org/10.1109/memc.2022.9780337","url":null,"abstract":"","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"1 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62488948","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Practical papers, articles and application notes 实用论文、文章及应用笔记
IEEE electromagnetic compatibility magazine Pub Date : 2022-01-01 DOI: 10.1109/MEMC.2022.9873814
K. See
{"title":"Practical papers, articles and application notes","authors":"K. See","doi":"10.1109/MEMC.2022.9873814","DOIUrl":"https://doi.org/10.1109/MEMC.2022.9873814","url":null,"abstract":"RF receivers for airborne applications are critical systems for wireless signal reception and processing. Any unwanted interfering signals received by the receiver have a direct impact on the quality of the intended signals. The first paper, “Improved Complex Receiver System Design Strategies to Overcome EMI/EMC Challenges,” describes the strategies and implementation techniques for a complex receiver system design to meet environmental stress screening (ESS) requirements, especially EMC. The proposed design methodology segregates the various modules and stacks them together tactfully without compromising EMC. By applying these techniques, an actual design with four modules is demonstrated and tested for EMC compliance over an extreme temperature range from -40°C to +71°C.","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"3 1","pages":"37-37"},"PeriodicalIF":0.0,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62488953","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
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