Scenes from the 2022 IEEE International Symposium on Electromagnetic Compatibility (EMC), Signal and Power Integrity (SIPI) in Spokane, Washington, August 1-5
{"title":"Scenes from the 2022 IEEE International Symposium on Electromagnetic Compatibility (EMC), Signal and Power Integrity (SIPI) in Spokane, Washington, August 1-5","authors":"","doi":"10.1109/memc.2022.9982562","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"1 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2022-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE electromagnetic compatibility magazine","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/memc.2022.9982562","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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