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Is Amateur Radio Amateur? 业余无线电是业余的吗?
IEEE electromagnetic compatibility magazine Pub Date : 2023-01-01 DOI: 10.1109/memc.2023.10135166
Kimball Williams
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引用次数: 0
IEEE Division IV Update IEEE第四部分更新
IEEE electromagnetic compatibility magazine Pub Date : 2023-01-01 DOI: 10.1109/memc.2023.10135168
A. Duffy
{"title":"IEEE Division IV Update","authors":"A. Duffy","doi":"10.1109/memc.2023.10135168","DOIUrl":"https://doi.org/10.1109/memc.2023.10135168","url":null,"abstract":"","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"1 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62489534","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
President's Message 总统的消息
IEEE electromagnetic compatibility magazine Pub Date : 2023-01-01 DOI: 10.1109/memc.2023.10201438
Vignesh Rajamani
{"title":"President's Message","authors":"Vignesh Rajamani","doi":"10.1109/memc.2023.10201438","DOIUrl":"https://doi.org/10.1109/memc.2023.10201438","url":null,"abstract":"Hello and welcome to Issue 2 of 2023! I want to keep you abreast on the developments in “Quarter 2” within our EMC Society.","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"135783387","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
S-Parameters for High Speed Digital Engineers: A Beginner's Guide 高速数字工程师的s参数:初学者指南
IEEE electromagnetic compatibility magazine Pub Date : 2023-01-01 DOI: 10.1109/MEMC.2023.10134760
E. Bogatin
{"title":"S-Parameters for High Speed Digital Engineers: A Beginner's Guide","authors":"E. Bogatin","doi":"10.1109/MEMC.2023.10134760","DOIUrl":"https://doi.org/10.1109/MEMC.2023.10134760","url":null,"abstract":"Scattering or S-parameters, have been used in RF applications for more than 70 years [1]. However, it has only been in the last 30 years they have been used extensively in high-speed digital applications, such as signal integrity, power integrity and EMC, and then only slowly accepted by the general community.","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"12 1","pages":"34-41"},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62489457","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Seeing is Believing (Inductance in PCBs) 眼见为实(pcb中的电感)
IEEE electromagnetic compatibility magazine Pub Date : 2023-01-01 DOI: 10.1109/memc.2023.10136442
B. Archambeault, S. Scearce, J. Diepenbrock, Sam Wang
{"title":"Seeing is Believing (Inductance in PCBs)","authors":"B. Archambeault, S. Scearce, J. Diepenbrock, Sam Wang","doi":"10.1109/memc.2023.10136442","DOIUrl":"https://doi.org/10.1109/memc.2023.10136442","url":null,"abstract":"Typical university education focuses on ‘inductors’ not ‘inductance’. However, it is the inductance that determines the EMC and Power Integrity (PI) performance and to some degree, inductance affects signal integrity (SI). When inductance is discussed, there is usually a number of equations, equivalent circuits, and even simulations, etc. to try and help the student understand the concept of inductance.","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"12 1","pages":"42-43"},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62489670","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Practical Papers, Articles and Application Notes 实用论文、文章及应用笔记
IEEE electromagnetic compatibility magazine Pub Date : 2023-01-01 DOI: 10.1109/MEMC.2023.10135170
K. See
{"title":"Practical Papers, Articles and Application Notes","authors":"K. See","doi":"10.1109/MEMC.2023.10135170","DOIUrl":"https://doi.org/10.1109/MEMC.2023.10135170","url":null,"abstract":"Electrostatic discharge (ESD) can affect the performance of an electronic product and one of the ESD coupling paths to the electronic circuit is through the interfacing cables of the product. The first paper, “Extraction of a SPICE Model for Investigating the Cable Discharge Event in Flat Ribbon Cables Based on Transmission Line Theory,” develops a SPICE model for the cable discharge event (CDE) with specific focus on flat ribbon cables (FRCs), which are widely used in many electronic products. The proposed method can also be expanded to the other types of cables to evaluate CDE. With the equivalent circuit, it allows early evaluation of the product's ESD immunity before final design and compliance test.","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"12 1","pages":"49-49"},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62489585","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Young Professional Activities at 2023 IEEE International Symposium on EMC+SIPI in Grand Rapids 2023年IEEE EMC+SIPI国际研讨会青年专业活动在大急流城
IEEE electromagnetic compatibility magazine Pub Date : 2023-01-01 DOI: 10.1109/memc.2023.10136456
Patrick DeRoy
{"title":"Young Professional Activities at 2023 IEEE International Symposium on EMC+SIPI in Grand Rapids","authors":"Patrick DeRoy","doi":"10.1109/memc.2023.10136456","DOIUrl":"https://doi.org/10.1109/memc.2023.10136456","url":null,"abstract":"","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"1 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62489882","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Matters of EMC EMC事宜
IEEE electromagnetic compatibility magazine Pub Date : 2023-01-01 DOI: 10.1109/memc.2023.10201447
T. Braxton
{"title":"Matters of EMC","authors":"T. Braxton","doi":"10.1109/memc.2023.10201447","DOIUrl":"https://doi.org/10.1109/memc.2023.10201447","url":null,"abstract":"","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"1 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62489899","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Transactions on Electromagnetic Compatibility: Reviewer Appreciation Program IEEE电磁兼容性汇刊:审稿人赞赏计划
IEEE electromagnetic compatibility magazine Pub Date : 2023-01-01 DOI: 10.1109/memc.2023.10201433
Tzong-Lin Wu
{"title":"IEEE Transactions on Electromagnetic Compatibility: Reviewer Appreciation Program","authors":"Tzong-Lin Wu","doi":"10.1109/memc.2023.10201433","DOIUrl":"https://doi.org/10.1109/memc.2023.10201433","url":null,"abstract":"The IEEE Transactions on Electromagnetic Compatibility (EMC) established a program to recognize the voluntary work of our reviewers, which is fundamental to maintaining the highest standards of the Transactions on EMC.","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"135784650","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
APEMC 2022 Conference Report APEMC 2022会议报告
IEEE electromagnetic compatibility magazine Pub Date : 2023-01-01 DOI: 10.1109/memc.2023.10201432
E. Li, Jun Fan, E. Liu
{"title":"APEMC 2022 Conference Report","authors":"E. Li, Jun Fan, E. Liu","doi":"10.1109/memc.2023.10201432","DOIUrl":"https://doi.org/10.1109/memc.2023.10201432","url":null,"abstract":"","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"1 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62490109","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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