发布求助
文献互助 智能选刊 最新文献

IEEE electromagnetic compatibility magazine最新文献

筛选
英文 中文
IEEE Division IV Update IEEE第四部分更新
IEEE electromagnetic compatibility magazine Pub Date : 2023-01-01 DOI: 10.1109/memc.2023.10135168
A. Duffy
{"title":"IEEE Division IV Update","authors":"A. Duffy","doi":"10.1109/memc.2023.10135168","DOIUrl":"https://doi.org/10.1109/memc.2023.10135168","url":null,"abstract":"","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62489534","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
President's Message 总统的消息
IEEE electromagnetic compatibility magazine Pub Date : 2023-01-01 DOI: 10.1109/memc.2023.10201438
Vignesh Rajamani
{"title":"President's Message","authors":"Vignesh Rajamani","doi":"10.1109/memc.2023.10201438","DOIUrl":"https://doi.org/10.1109/memc.2023.10201438","url":null,"abstract":"Hello and welcome to Issue 2 of 2023! I want to keep you abreast on the developments in “Quarter 2” within our EMC Society.","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"135783387","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
S-Parameters for High Speed Digital Engineers: A Beginner's Guide 高速数字工程师的s参数:初学者指南
IEEE electromagnetic compatibility magazine Pub Date : 2023-01-01 DOI: 10.1109/MEMC.2023.10134760
E. Bogatin
{"title":"S-Parameters for High Speed Digital Engineers: A Beginner's Guide","authors":"E. Bogatin","doi":"10.1109/MEMC.2023.10134760","DOIUrl":"https://doi.org/10.1109/MEMC.2023.10134760","url":null,"abstract":"Scattering or S-parameters, have been used in RF applications for more than 70 years [1]. However, it has only been in the last 30 years they have been used extensively in high-speed digital applications, such as signal integrity, power integrity and EMC, and then only slowly accepted by the general community.","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62489457","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Seeing is Believing (Inductance in PCBs) 眼见为实(pcb中的电感)
IEEE electromagnetic compatibility magazine Pub Date : 2023-01-01 DOI: 10.1109/memc.2023.10136442
B. Archambeault, S. Scearce, J. Diepenbrock, Sam Wang
{"title":"Seeing is Believing (Inductance in PCBs)","authors":"B. Archambeault, S. Scearce, J. Diepenbrock, Sam Wang","doi":"10.1109/memc.2023.10136442","DOIUrl":"https://doi.org/10.1109/memc.2023.10136442","url":null,"abstract":"Typical university education focuses on ‘inductors’ not ‘inductance’. However, it is the inductance that determines the EMC and Power Integrity (PI) performance and to some degree, inductance affects signal integrity (SI). When inductance is discussed, there is usually a number of equations, equivalent circuits, and even simulations, etc. to try and help the student understand the concept of inductance.","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62489670","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Practical Papers, Articles and Application Notes 实用论文、文章及应用笔记
IEEE electromagnetic compatibility magazine Pub Date : 2023-01-01 DOI: 10.1109/MEMC.2023.10135170
K. See
{"title":"Practical Papers, Articles and Application Notes","authors":"K. See","doi":"10.1109/MEMC.2023.10135170","DOIUrl":"https://doi.org/10.1109/MEMC.2023.10135170","url":null,"abstract":"Electrostatic discharge (ESD) can affect the performance of an electronic product and one of the ESD coupling paths to the electronic circuit is through the interfacing cables of the product. The first paper, “Extraction of a SPICE Model for Investigating the Cable Discharge Event in Flat Ribbon Cables Based on Transmission Line Theory,” develops a SPICE model for the cable discharge event (CDE) with specific focus on flat ribbon cables (FRCs), which are widely used in many electronic products. The proposed method can also be expanded to the other types of cables to evaluate CDE. With the equivalent circuit, it allows early evaluation of the product's ESD immunity before final design and compliance test.","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62489585","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Young Professional Activities at 2023 IEEE International Symposium on EMC+SIPI in Grand Rapids 2023年IEEE EMC+SIPI国际研讨会青年专业活动在大急流城
IEEE electromagnetic compatibility magazine Pub Date : 2023-01-01 DOI: 10.1109/memc.2023.10136456
Patrick DeRoy
{"title":"Young Professional Activities at 2023 IEEE International Symposium on EMC+SIPI in Grand Rapids","authors":"Patrick DeRoy","doi":"10.1109/memc.2023.10136456","DOIUrl":"https://doi.org/10.1109/memc.2023.10136456","url":null,"abstract":"","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62489882","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Matters of EMC EMC事宜
IEEE electromagnetic compatibility magazine Pub Date : 2023-01-01 DOI: 10.1109/memc.2023.10201447
T. Braxton
{"title":"Matters of EMC","authors":"T. Braxton","doi":"10.1109/memc.2023.10201447","DOIUrl":"https://doi.org/10.1109/memc.2023.10201447","url":null,"abstract":"","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62489899","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Transactions on Electromagnetic Compatibility: Reviewer Appreciation Program IEEE电磁兼容性汇刊:审稿人赞赏计划
IEEE electromagnetic compatibility magazine Pub Date : 2023-01-01 DOI: 10.1109/memc.2023.10201433
Tzong-Lin Wu
{"title":"IEEE Transactions on Electromagnetic Compatibility: Reviewer Appreciation Program","authors":"Tzong-Lin Wu","doi":"10.1109/memc.2023.10201433","DOIUrl":"https://doi.org/10.1109/memc.2023.10201433","url":null,"abstract":"The IEEE Transactions on Electromagnetic Compatibility (EMC) established a program to recognize the voluntary work of our reviewers, which is fundamental to maintaining the highest standards of the Transactions on EMC.","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"135784650","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
APEMC 2022 Conference Report APEMC 2022会议报告
IEEE electromagnetic compatibility magazine Pub Date : 2023-01-01 DOI: 10.1109/memc.2023.10201432
E. Li, Jun Fan, E. Liu
{"title":"APEMC 2022 Conference Report","authors":"E. Li, Jun Fan, E. Liu","doi":"10.1109/memc.2023.10201432","DOIUrl":"https://doi.org/10.1109/memc.2023.10201432","url":null,"abstract":"","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62490109","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Letter from the Editor 编辑来信
IEEE electromagnetic compatibility magazine Pub Date : 2023-01-01 DOI: 10.1109/memc.2023.10201902
{"title":"Letter from the Editor","authors":"","doi":"10.1109/memc.2023.10201902","DOIUrl":"https://doi.org/10.1109/memc.2023.10201902","url":null,"abstract":"","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"135829207","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
首页 上一页 下一页 尾页
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整，为了账户安全，请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
请完成安全验证×
相关产品
×
本文献相关产品
联系我们：info@booksci.cn Book学术提供免费学术资源搜索服务，方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号：481959085
Book学术官方微信