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50-25-10 Years Ago: A Review of EMC Society Newsletters 50-25-10年前:EMC协会通讯回顾
IEEE electromagnetic compatibility magazine Pub Date : 2023-01-01 DOI: 10.1109/memc.2023.10201364
Daniel D. Hoolihan
{"title":"50-25-10 Years Ago: A Review of EMC Society Newsletters","authors":"Daniel D. Hoolihan","doi":"10.1109/memc.2023.10201364","DOIUrl":"https://doi.org/10.1109/memc.2023.10201364","url":null,"abstract":"The cover story of this issue was “Message from the President” by Joseph F. Fischer, Jr. - President - EMC-Group. His message was as follows: During the past year your Administrative Committee (ADCOM) carried out two distinctive actions which were paramount in sustaining our Group.","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"135783386","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
ANSC 63® Workshops on C63.4 and NEW C63.25 Standard Series ANSC 63®C63.4和NEW C63.25标准系列研讨会
IEEE electromagnetic compatibility magazine Pub Date : 2023-01-01 DOI: 10.1109/memc.2023.10136446
{"title":"ANSC 63® Workshops on C63.4 and NEW C63.25 Standard Series","authors":"","doi":"10.1109/memc.2023.10136446","DOIUrl":"https://doi.org/10.1109/memc.2023.10136446","url":null,"abstract":"","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"1 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62489777","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Modeling and Mitigation of Radio Frequency Interference for Wireless Devices 无线设备射频干扰的建模与缓解
IEEE electromagnetic compatibility magazine Pub Date : 2023-01-01 DOI: 10.1109/MEMC.2023.10136454
C. Hwang, J. Fan
{"title":"Modeling and Mitigation of Radio Frequency Interference for Wireless Devices","authors":"C. Hwang, J. Fan","doi":"10.1109/MEMC.2023.10136454","DOIUrl":"https://doi.org/10.1109/MEMC.2023.10136454","url":null,"abstract":"This article reviews the electromagnetic framework used to model radio frequency interference (RFI) and the resulting development of mitigation methods. With the rise of IoT devices, wireless devices in which RF antennas are integrated with high-performance digital systems in small form factors suffer from electromagnetic interference, known as RF interference or RF desensitization. The simple yet rigorous framework can be used for a systematic RFI-aware design, saving time and effort for trial-and-error troubleshooting.","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"12 1","pages":"87-92"},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62489860","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
SPI 2023 Held in Aveiro, Portugal SPI 2023在葡萄牙阿威罗举行
IEEE electromagnetic compatibility magazine Pub Date : 2023-01-01 DOI: 10.1109/memc.2023.10201901
Joana Mendes, S. Grivet-Talocia
{"title":"SPI 2023 Held in Aveiro, Portugal","authors":"Joana Mendes, S. Grivet-Talocia","doi":"10.1109/memc.2023.10201901","DOIUrl":"https://doi.org/10.1109/memc.2023.10201901","url":null,"abstract":"","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"1 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62489951","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Latin American Symposium on Circuits and Systems (LASCAS) IEEE拉丁美洲电路与系统研讨会(LASCAS)
IEEE electromagnetic compatibility magazine Pub Date : 2023-01-01 DOI: 10.1109/memc.2023.10201365
Nicolas Mora
{"title":"IEEE Latin American Symposium on Circuits and Systems (LASCAS)","authors":"Nicolas Mora","doi":"10.1109/memc.2023.10201365","DOIUrl":"https://doi.org/10.1109/memc.2023.10201365","url":null,"abstract":"LASCAS is the international symposium and flagship event of the IEEE Circuits and Systems (CAS) Society in IEEE Region 9 (Latin America). It started 14 years ago and took place for the first time in Ecuador developing activities in micro and nanoelectronics. The symposium, held from February 28 to March 3 at the Swiss Hotel in Quito, Ecuador, provided a high-quality exchange and networking forum for more than 100 researchers, professionals, and students, gathering an international audience with experts worldwide. The best paper of the conference will be published in the IEEE Transactions on Circuits and Systems. More information may be found on the conference website https://www.ieee-lascas.org/","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"41 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"135784873","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Investigating the Effect of the DC Block Capacitor on Residual Current in a System-Level ESD-Protected Circuit 研究直流块电容对系统级esd保护电路中剩余电流的影响
IEEE electromagnetic compatibility magazine Pub Date : 2023-01-01 DOI: 10.1109/MEMC.2023.10201442
Emadodin Zia Khodadadian
{"title":"Investigating the Effect of the DC Block Capacitor on Residual Current in a System-Level ESD-Protected Circuit","authors":"Emadodin Zia Khodadadian","doi":"10.1109/MEMC.2023.10201442","DOIUrl":"https://doi.org/10.1109/MEMC.2023.10201442","url":null,"abstract":"This work aims to delve into the DC (Direct Current) block capacitor effect on the residual current in a system-level ESD (Electrostatic Discharge)-protected circuit. First, the relation between the residual current and DC block capacitor value has been introduced by applying two theoretical methods: circuit analysis and frequency response analysis. Then, a test circuit with 12 different DC block capacitors (0.5pF to 10nF) is employed to extract simulation and measurement results. Both SPICE (Simulation Program with Integrated Circuits Emphasis) transient analysis by simulating the IEC 61000-4-2 waveform and the measurement test setup by applying a system-level ESD simulator reveals that a test circuit with the lowest DC block capacitor is more unsusceptible than others. As a result, decreasing the value of the DC block capacitor can help reduce the destructive effect of ESD.","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"12 1","pages":"39-45"},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62489815","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Signal Integrity and Power Integrity 信号完整性和电源完整性
IEEE electromagnetic compatibility magazine Pub Date : 2023-01-01 DOI: 10.1109/memc.2023.10201366
J. N. Tripathi
{"title":"Signal Integrity and Power Integrity","authors":"J. N. Tripathi","doi":"10.1109/memc.2023.10201366","DOIUrl":"https://doi.org/10.1109/memc.2023.10201366","url":null,"abstract":"When modeling differential signal propagation in a two-conductor transmission line over ground, it is convenient to express the propagation as the sum of two orthogonal modes, common-mode and differential mode. These TEM modes propagate independently as long as there is no change in the electrical balance of the three-conductor configuration. Any change in the electrical balance results in an exchange of power between the two modes at the point of the discontinuity. This effect can be precisely modeled using simple load resistances and dependent sources.","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"1 1","pages":"35-35"},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62490021","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Background Information on the Founders of the EMC Society Since the Society's Founding in 1957 EMC协会自1957年成立以来的背景资料
IEEE electromagnetic compatibility magazine Pub Date : 2023-01-01 DOI: 10.1109/memc.2023.10201430
D. Hoolihan
{"title":"Background Information on the Founders of the EMC Society Since the Society's Founding in 1957","authors":"D. Hoolihan","doi":"10.1109/memc.2023.10201430","DOIUrl":"https://doi.org/10.1109/memc.2023.10201430","url":null,"abstract":"","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"1 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62490042","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
ANSC C63® ANNOUNCES NEW LEADERSHIP anc c63®宣布新的领导层
IEEE electromagnetic compatibility magazine Pub Date : 2023-01-01 DOI: 10.1109/memc.2023.10201431
{"title":"ANSC C63® ANNOUNCES NEW LEADERSHIP","authors":"","doi":"10.1109/memc.2023.10201431","DOIUrl":"https://doi.org/10.1109/memc.2023.10201431","url":null,"abstract":"","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"1 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62490076","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Cars Got More Complicated, EMC Got More Sophisticated 汽车变得越来越复杂，电磁兼容变得越来越复杂
IEEE electromagnetic compatibility magazine Pub Date : 2023-01-01 DOI: 10.1109/memc.2023.10136448
{"title":"Cars Got More Complicated, EMC Got More Sophisticated","authors":"","doi":"10.1109/memc.2023.10136448","DOIUrl":"https://doi.org/10.1109/memc.2023.10136448","url":null,"abstract":"","PeriodicalId":73281,"journal":{"name":"IEEE electromagnetic compatibility magazine","volume":"1 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62490171","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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