2020 IEEE 15th International Conference on Nano/Micro Engineered and Molecular System (NEMS)最新文献_第2页

Ultralight Weight Piezoresistive Spongy Graphene Sensors for Human Gait Monitoring Applications 用于人体步态监测的超轻质压阻海绵状石墨烯传感器

2020 IEEE 15th International Conference on Nano/Micro Engineered and Molecular System (NEMS) Pub Date : 2020-09-27 DOI: 10.1109/NEMS50311.2020.9265580

Debarun Sengupta, A. Kottapalli

引用次数: 3

Study of Gold Particles in HFSS with Varying Physical Parameters and Arrangements 不同物理参数和排列方式下HFSS中金颗粒的研究

2020 IEEE 15th International Conference on Nano/Micro Engineered and Molecular System (NEMS) Pub Date : 2020-09-27 DOI: 10.1109/NEMS50311.2020.9265619

Annesha Mazumder, Syed Azeemuddin, T. Sau, P. Bhimalapuram

引用次数: 4

A MEMS Based Electrochemical Rotational Vibration Sensor 基于MEMS的电化学旋转振动传感器

2020 IEEE 15th International Conference on Nano/Micro Engineered and Molecular System (NEMS) Pub Date : 2020-09-27 DOI: 10.1109/NEMS50311.2020.9265612

Bowen Liu, Junbo Wang, Deyong Chen, Jian Chen, Chao Xu, Tian Liang, Wenjie Qi, Xu She

引用次数: 0

An integrated microfluidic platform for cholangiocarcinoma diagnosis from clinical bile juice samples by utilizing multiple affinity reagents 利用多种亲和试剂对临床胆汁液样本进行胆管癌诊断的集成微流控平台

2020 IEEE 15th International Conference on Nano/Micro Engineered and Molecular System (NEMS) Pub Date : 2020-09-27 DOI: 10.1109/NEMS50311.2020.9265566

Tsung-Han Lu, N. Chiang, Chien-Jui Huang, P. Gopinathan, Hsiu-Chi Tu, Yi-Cheng Tsai, Y. Shan, S. Hung, Gwo-Bin Lee

引用次数: 0

Dielectric Constant and van der Waals Interlayer Interaction of MoS2-Graphene Heterostructures mos2 -石墨烯异质结构的介电常数和范德华层间相互作用

2020 IEEE 15th International Conference on Nano/Micro Engineered and Molecular System (NEMS) Pub Date : 2020-09-27 DOI: 10.1109/NEMS50311.2020.9265634

Amit Singh, Seunghan Lee, Hoonkyung Lee, Hiroshi Watanabe

引用次数: 2

Capturing subtle changes during plant growth using wearable mechanical sensors fabricated through liquid-phase fusion 通过液相融合制造的可穿戴机械传感器捕捉植物生长过程中的细微变化

2020 IEEE 15th International Conference on Nano/Micro Engineered and Molecular System (NEMS) Pub Date : 2020-09-27 DOI: 10.1109/NEMS50311.2020.9265565

H. Ibrahim, Satyanarayana Moru, Sung-Min Kang, S. Yin, Yuncong Chen, Liang Dong

引用次数: 0

A Module-level Weathering and Durability Testing on Silver Nanowire Transparent Conductors 银纳米线透明导体的模块级耐候性和耐久性测试

2020 IEEE 15th International Conference on Nano/Micro Engineered and Molecular System (NEMS) Pub Date : 2020-09-27 DOI: 10.1109/NEMS50311.2020.9265599

Chiao-Chi Lin, Bo-Ju You, Yu-Xuan Yang, I. Tseng

{"title":"A Module-level Weathering and Durability Testing on Silver Nanowire Transparent Conductors","authors":"Chiao-Chi Lin, Bo-Ju You, Yu-Xuan Yang, I. Tseng","doi":"10.1109/NEMS50311.2020.9265599","DOIUrl":"https://doi.org/10.1109/NEMS50311.2020.9265599","url":null,"abstract":"We adopt a pseudo-module methodology for investigating the degradation behaviors of silver nanowire (AgNW) transparent conductors (TC). The pseudo-module allows assembly and disassembly for accessing TC during aging test without causing artificial damage to the AgNWs. Aging tests on the AgNWs inside pseudo-module were performed under ultraviolet (UV) irradiation at elevated temperature and damp heat conditions. There was no deterioration concerning electrical DC conductivity for both UVA/75ºC and damp heat aging conditions after aging for 69 days and 100 days, respectively. However, microscopy and spectroscopy results indicated that damp heat aging resulted in significant damage to the morphologies of AgNWs, inferring the importance of encapsulation to the stability of pristine AgNWs inside modules. Morphological and junctional change of AgNWs networks caused the decrease in optical transmittance of TC. The UVA/75ºC aging results showed early sign of sulfidation after aging for 100 days. Electrical stress tests by applying stepwise current were conducted. The failure mode of both pristine AgNW TC and AgNW TC inside pseudo-module were identical. However, the AgNW TC inside pseudo-module generated higher heating temperature. Preliminary outdoor exposure has been conducted by our research team, and comprehensive investigation will be carried out in the near future.","PeriodicalId":6787,"journal":{"name":"2020 IEEE 15th International Conference on Nano/Micro Engineered and Molecular System (NEMS)","volume":"27 1","pages":"9-13"},"PeriodicalIF":0.0,"publicationDate":"2020-09-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"79839976","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Electrical modeling of Copper and Mixed Carbon bundles as a composite for 3D Interconnect applications 铜和混合碳束的电建模作为3D互连应用的复合材料

2020 IEEE 15th International Conference on Nano/Micro Engineered and Molecular System (NEMS) Pub Date : 2020-09-27 DOI: 10.1109/NEMS50311.2020.9265633

M. Rao

{"title":"Electrical modeling of Copper and Mixed Carbon bundles as a composite for 3D Interconnect applications","authors":"M. Rao","doi":"10.1109/NEMS50311.2020.9265633","DOIUrl":"https://doi.org/10.1109/NEMS50311.2020.9265633","url":null,"abstract":"Generally Copper filled through silicon vias (TSVs) are considered effective for 3D IC applications, however Copper (Cu) filled interconnects are not devoid of electrical and mechanical problems. Carbon nanotubes (CNTs) are considered more robust, with high current carrying capacity, and mechanically tough compared to other materials considered. The fabrication of the Cu/CNTs in the TSVs are investigated thoroughly and a process to consistently grow vertical CNTs with Cu filling post CNT growth in a TSVs is established. The grown CNTs are observed to be mixed bundles comprising of Single Walled Nanotubes (SWNT), and Multiwalled Nanotubes (MWNT) in different proportions. The paper presents the designed closed loop surface current density, bidirectional vertical delay and crosstalk models for Mixed Carbon bundles (MCB) with Copper filled TSV interconnects. The developed models are expressed as a function of Cu filling ratio, SWNT/MWNT proportion in the mixed carbon bundles, TSV geometry including tapered profile of the via, and the diameter of CNTs. The current density, delay and S-parameters are analyzed using the developed models for a standard TSV design. The surface current density model indicates consistent current density along the surface, for higher proportion of SWNT in the MCB, with minimum Copper in the via. The cross talk models suggests similar transmission and reflection properties for MCB/Cu composite when compared to Cu based TSVs. The delay models suggests improvement in the signal propagation for composite consisting of Cu, and MCB with higher proportion of MWNTs. The models are considered a useful tool for 3D IC designers, especially towards placement and routing stage of the chip design.","PeriodicalId":6787,"journal":{"name":"2020 IEEE 15th International Conference on Nano/Micro Engineered and Molecular System (NEMS)","volume":"14 1","pages":"495-499"},"PeriodicalIF":0.0,"publicationDate":"2020-09-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"83919244","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

On-skin Based Soft Triboelectric Nanogenerator for Electronics Skin 用于电子皮肤的基于皮肤的柔性摩擦电纳米发电机

2020 IEEE 15th International Conference on Nano/Micro Engineered and Molecular System (NEMS) Pub Date : 2020-09-27 DOI: 10.1109/NEMS50311.2020.9265583

Jiwon Park, Da Eun Kim, Youn Tae Kim

{"title":"On-skin Based Soft Triboelectric Nanogenerator for Electronics Skin","authors":"Jiwon Park, Da Eun Kim, Youn Tae Kim","doi":"10.1109/NEMS50311.2020.9265583","DOIUrl":"https://doi.org/10.1109/NEMS50311.2020.9265583","url":null,"abstract":"Currently, with the transition to the ubiquitous era, next-generation electronic devices such as artificial electronic skin, wearable computers, and flexible displays have been developed that are light and portable and can be easily applied to human life. Therefore, in order to supply power to such devices, the importance for the development of an energy devices is increasing. To address this issue, a stretchable on-skin based triboelectric nanogenerator (TENG) that contacts to the skin and can generate energy from the free movement is proposed. It is easier to manufacture than the previously reported body-attachable TENG and is ultrathin with a total thickness of 200 μm. As an electrode, the conductive thread was formed in a winding pattern on an elastomer substrate, showed high elasticity of 100% or more, and stability without distortion even under repeated strain. It adhered to the back hand to generate an electrical output of 280 V and 12 μA, and the test on the electronic drive demonstrated its practical applicability. The on-skin based TENG may be utilized as a stretchable and flexible energy device that can replace the conventional bulk battery, and has the potential to be an important core technology in combination with E-skin and wearable sensors.","PeriodicalId":6787,"journal":{"name":"2020 IEEE 15th International Conference on Nano/Micro Engineered and Molecular System (NEMS)","volume":"15 1","pages":"273-276"},"PeriodicalIF":0.0,"publicationDate":"2020-09-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"86031132","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Inkjet-Printed Capacitive Micromachined Ultrasonic Transducer (CMUT) for Moisture Sensing 用于湿度传感的喷墨印刷电容式微机械超声换能器

2020 IEEE 15th International Conference on Nano/Micro Engineered and Molecular System (NEMS) Pub Date : 2020-09-27 DOI: 10.1109/NEMS50311.2020.9265591

Zhou Zheng, Naeun Kim, Jiaqi Wang, W. Wong, J. Yeow

引用次数: 0