2008 International Conference on Electronic Packaging Technology & High Density Packaging最新文献_第5页

Novel low-temperature micro-insert bonding technology for 3D package 新型3D封装低温微插入键合技术

2008 International Conference on Electronic Packaging Technology & High Density Packaging Pub Date : 2008-07-28 DOI: 10.1109/ICEPT.2008.4606956

Po Xu, A. Hu, Zhuo Chen, Ming Li, D. Mao

引用次数: 1

Shear fracture behavior of Sn3.0Ag0.5Cu solder joints on Cu pads with different solder volumes 不同焊料体积Cu焊盘上Sn3.0Ag0.5Cu焊点剪切断裂行为

2008 International Conference on Electronic Packaging Technology & High Density Packaging Pub Date : 2008-07-28 DOI: 10.1109/ICEPT.2008.4607076

Yanhong Tian, Chunqing Wang, Shihua Yang, P. Lin, Le Liang

{"title":"Shear fracture behavior of Sn3.0Ag0.5Cu solder joints on Cu pads with different solder volumes","authors":"Yanhong Tian, Chunqing Wang, Shihua Yang, P. Lin, Le Liang","doi":"10.1109/ICEPT.2008.4607076","DOIUrl":"https://doi.org/10.1109/ICEPT.2008.4607076","url":null,"abstract":"To meet the urgent demands of future electronic packages, the solder joints have to become increasingly miniaturized. Compared to the large solder joints, mechanics behavior for the samll solder joints is very different, resulting in a series of reliability issues. Therefore, it is very important to understand the mechanics behavior of the small solder joints. In this paper, the shear test of the as-reflowed and aged Sn-3.0Ag-0.5Cu solder joints on Cu pads with the diameters of 200 mum to 600 mum were conducted, and fracture behavior was observed using SEM. The results show that shear strength of the solder joint increases with the decreasing of the solder joints volumes. For the large volume solder joints, the fracture occurs close to the interface, and the solder joint shows strong brittleness. Whereas, for the small solder joints, the fracture occurs within the bulk solder, and the solder joint shows ductile property. The Ag3Sn and Cu6Sn5 intermetallic compounds (IMCs) at the interface region have a prominent effect on the shear property and the propagation of the fracture.","PeriodicalId":6324,"journal":{"name":"2008 International Conference on Electronic Packaging Technology & High Density Packaging","volume":"30 1","pages":"1-4"},"PeriodicalIF":0.0,"publicationDate":"2008-07-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"90801915","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Layout optimization and modeling of an ESD-protection n-MOSFET in 0.13um silicide CMOS technology 0.13um硅化CMOS技术中esd保护n-MOSFET的布局优化和建模

2008 International Conference on Electronic Packaging Technology & High Density Packaging Pub Date : 2008-07-28 DOI: 10.1109/ICEPT.2008.4607003

Jia Yuxi, Li Jiao, Ran Feng, Dian Yang

引用次数: 4

High-Q on-chip inductors embedded in wafer-level package for RFIC applications 用于RFIC应用的高q级片上电感器嵌入晶圆级封装

2008 International Conference on Electronic Packaging Technology & High Density Packaging Pub Date : 2008-07-28 DOI: 10.1109/ICEPT.2008.4606957

Tao Feng, Jian Cai, Hye-Kyong Kwon, Qian Wang, Xinyu Dou

引用次数: 1

Strain-rate and impact velocity effects on joint adhesion strength 应变速率和冲击速度对接头粘结强度的影响

2008 International Conference on Electronic Packaging Technology & High Density Packaging Pub Date : 2008-07-28 DOI: 10.1109/ICEPT.2008.4607139

Chang-Lin Yeh, Y. Lai

引用次数: 8

The influence of low level doping of Ni on the microstructure and reliability of SAC solder joint 低含量Ni掺杂对SAC焊点组织和可靠性的影响

2008 International Conference on Electronic Packaging Technology & High Density Packaging Pub Date : 2008-07-28 DOI: 10.1109/ICEPT.2008.4607050

Zhenqing Zhao, Lei Wang, Xiaoqiang Xie, Qian Wang, Jaisung Lee

{"title":"The influence of low level doping of Ni on the microstructure and reliability of SAC solder joint","authors":"Zhenqing Zhao, Lei Wang, Xiaoqiang Xie, Qian Wang, Jaisung Lee","doi":"10.1109/ICEPT.2008.4607050","DOIUrl":"https://doi.org/10.1109/ICEPT.2008.4607050","url":null,"abstract":"In this paper, the behavior of BGA solder joints microstructures was studied as a function of Ni doping in SAC solder. Three kinds of solder compositions were selected including Sn3.0Ag0.5Cu, Sn1.0Ag0.5Cu and Sn1.0Ag0.5Cu0.02Ni to value the influence the effect of Ni doping, OSP and Au/Ni pad was employed on the PCB side. Emphasis was placed on studying the effect of low level doping with Ni on the joint microstructure and subsequent reliability. Both solder composition and PCB surface finish had a notable effect on the interfacial microstructure, the Ni addition can give rise to needle like NiCuSn IMC formation and reduce the grain size locally at solder/NiAu pad interface after one time reflow according to top-view interface analysis, and had no obvious effect on the IMC evolution of solder/OSP pad, the phenomena was investigated from the perspective of metallurgy. Bending and drop tests were conducted to evaluate the effect of solder composition and pad finish on the joint reliability. It was found that the decrease of Ag concentration and Ni addition in SAC solder could significantly improve the drop test performance when NiAu pad was used. In bending test, OSP pad show better performance than Au/Ni pad. The correlation between joint microstructure and joint reliability was discussed in detail. The work can give some directions on the solder alloy design and choice of pad finish in electronic packaging.","PeriodicalId":6324,"journal":{"name":"2008 International Conference on Electronic Packaging Technology & High Density Packaging","volume":"24 1","pages":"1-5"},"PeriodicalIF":0.0,"publicationDate":"2008-07-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"84773175","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 13

Electrodeposition of palladium films on Ni-Co coatings Ni-Co镀层上钯膜的电沉积

2008 International Conference on Electronic Packaging Technology & High Density Packaging Pub Date : 2008-07-28 DOI: 10.1109/ICEPT.2008.4607048

Yanping He, D. Ding, Xiang Gao, Z. Chen, Ming Li, D. Mao

引用次数: 0

A mixed- signal physical design and its verification 一种混合信号物理设计及其验证

2008 International Conference on Electronic Packaging Technology & High Density Packaging Pub Date : 2008-07-28 DOI: 10.1109/ICEPT.2008.4607009

Hu Yue-li, Yan Ke

引用次数: 0

Design and implementation of LED daylight lamp lighting system LED日光灯照明系统的设计与实现

2008 International Conference on Electronic Packaging Technology & High Density Packaging Pub Date : 2008-07-28 DOI: 10.1109/ICEPT.2008.4606997

R. Guan, Dalei Tian, Xing Wang

{"title":"Design and implementation of LED daylight lamp lighting system","authors":"R. Guan, Dalei Tian, Xing Wang","doi":"10.1109/ICEPT.2008.4606997","DOIUrl":"https://doi.org/10.1109/ICEPT.2008.4606997","url":null,"abstract":"LEDs have becoming the most suitable candidate replacing traditional fluorescent lamps because of its energy-efficient, the introduction of high brightness LEDs with white light and monochromatic colors have led to a movement towards general illumination. This revolutionizes the optoelectronics market, enabling engineers to use LEDs for general lighting applications as well as medical, indoor lighting and automotive solutions. So variable LED array modules were developed, they are making great strides in terms of lumen performance and reliability, however the barrier to widespread use in general illumination still remains the cost or luminous efficiency, special requirements concerning optical properties and optomechanical layout have to be met. In order to meet the requirements of indoor illumination, a LED daylight lamp model was designed, it can replace traditional fluorescent lamp without insteading additional power supply establishment. The optical properties of the model were simulated using optical analysis software, its luminous efficiency is about 41 lm/W, the illuminance is about 50 lux when the distance is 1.5 m between the center of the model and measured spot, With the theoretically-optimized design of the LED model, experiments based on the results of the optimal simulation in the laboratory were conducted to verify the performance of the proposed LED model, it reaches a power factor of about 0.8 at 11 W. Results of the simulation are very similar with the measured values, it was testified that simulative method is one of the effective tools for LED lighting optical design.","PeriodicalId":6324,"journal":{"name":"2008 International Conference on Electronic Packaging Technology & High Density Packaging","volume":"51 1","pages":"1-3"},"PeriodicalIF":0.0,"publicationDate":"2008-07-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"78595664","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 22

Study on non-uniformity of Through-Mask electroplated Ni thin-film 透掩膜镀镍薄膜不均匀性的研究

2008 International Conference on Electronic Packaging Technology & High Density Packaging Pub Date : 2008-07-28 DOI: 10.1109/ICEPT.2008.4606993

Jun Tang, Hong Wang, Rui Liu, Shengping Mao, Xiaolin Zhao, G. Ding

{"title":"Study on non-uniformity of Through-Mask electroplated Ni thin-film","authors":"Jun Tang, Hong Wang, Rui Liu, Shengping Mao, Xiaolin Zhao, G. Ding","doi":"10.1109/ICEPT.2008.4606993","DOIUrl":"https://doi.org/10.1109/ICEPT.2008.4606993","url":null,"abstract":"Through-mask electroplating has been widely used in the fabrication of chips, BGA substrates and PCBs etc. The uniformity of plating thin-film is the major factor contributed to the reliability of the products. Currently, it is usually by setting optimum plating parameters and adopting electrochemical method to achieve the uniformity of plating. However, the problem of non-uniform distribution of electric field, which is the major cause of the non-uniformity of the plating thin-film, has not been solved. In this paper, finite element method (FEM) was developed to analyze the non-uniform distribution of electric field under different conditions in the process of electroplating. The results show that different thickness of photo-resist and size of electroplating cell are two major factors contribute to the uniformity of plating thin-film. The uniform of electroplating cell can be improved by adding in-chip auxiliary electrode. Also better uniformity of the plating film in radial direction can achieved by setting a shield in the proper position of the plating solution and annular out-chip auxiliary electrode (Cu) around the wafer. The simulation results were consistent with experimental results, which proved that finite element method is an effect way to simulate the electroplating process.","PeriodicalId":6324,"journal":{"name":"2008 International Conference on Electronic Packaging Technology & High Density Packaging","volume":"162 1","pages":"1-4"},"PeriodicalIF":0.0,"publicationDate":"2008-07-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"78071201","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3