用于RFIC应用的高q级片上电感器嵌入晶圆级封装

2008 International Conference on Electronic Packaging Technology & High Density Packaging Pub Date : 2008-07-28 DOI:10.1109/ICEPT.2008.4606957

Tao Feng, Jian Cai, Hye-Kyong Kwon, Qian Wang, Xinyu Dou

{"title":"用于RFIC应用的高q级片上电感器嵌入晶圆级封装","authors":"Tao Feng, Jian Cai, Hye-Kyong Kwon, Qian Wang, Xinyu Dou","doi":"10.1109/ICEPT.2008.4606957","DOIUrl":null,"url":null,"abstract":"Wafer level packaging (WLP) technology has been used to integrate high-Q inductor on Si substrate. These inductors consist of a thick Cu electroplated rerouting to reduce series resistance and a thick dielectric layer to separate the inductors from Si substrate. The measured results show that the peak O-factor is 30 at 4 GHz for a 0.77 nH inductor, which is good agreement with the simulated performance by HFSS. Therefore, this technology realizes embedded high-Q inductors in WLP and can improve the performance of RF system.","PeriodicalId":6324,"journal":{"name":"2008 International Conference on Electronic Packaging Technology & High Density Packaging","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2008-07-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"High-Q on-chip inductors embedded in wafer-level package for RFIC applications\",\"authors\":\"Tao Feng, Jian Cai, Hye-Kyong Kwon, Qian Wang, Xinyu Dou\",\"doi\":\"10.1109/ICEPT.2008.4606957\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Wafer level packaging (WLP) technology has been used to integrate high-Q inductor on Si substrate. These inductors consist of a thick Cu electroplated rerouting to reduce series resistance and a thick dielectric layer to separate the inductors from Si substrate. The measured results show that the peak O-factor is 30 at 4 GHz for a 0.77 nH inductor, which is good agreement with the simulated performance by HFSS. Therefore, this technology realizes embedded high-Q inductors in WLP and can improve the performance of RF system.\",\"PeriodicalId\":6324,\"journal\":{\"name\":\"2008 International Conference on Electronic Packaging Technology & High Density Packaging\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2008-07-28\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2008 International Conference on Electronic Packaging Technology & High Density Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEPT.2008.4606957\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 International Conference on Electronic Packaging Technology & High Density Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2008.4606957","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 1

摘要

晶圆级封装(WLP)技术已被用于在硅衬底上集成高q电感器。这些电感包括一个厚的镀铜重布线，以减少串联电阻和一个厚的介电层，将电感器与硅衬底分开。测量结果表明，0.77 nH电感在4 GHz时的峰值o因子为30，与HFSS模拟性能吻合较好。因此，该技术在WLP中实现了嵌入式高q电感器，可以提高射频系统的性能。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

High-Q on-chip inductors embedded in wafer-level package for RFIC applications

Wafer level packaging (WLP) technology has been used to integrate high-Q inductor on Si substrate. These inductors consist of a thick Cu electroplated rerouting to reduce series resistance and a thick dielectric layer to separate the inductors from Si substrate. The measured results show that the peak O-factor is 30 at 4 GHz for a 0.77 nH inductor, which is good agreement with the simulated performance by HFSS. Therefore, this technology realizes embedded high-Q inductors in WLP and can improve the performance of RF system.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2008 International Conference on Electronic Packaging Technology & High Density Packaging

自引率

0.00%

发文量