Parametric study on board-level electronic test device subjected to JEDEC vibration loads

Abstract

We derive in this paper equations of motion of board-level IC packages subjected to swept sine vibration loads following the support excitation scheme. Harmonic analysis is performed based on the argument such that at each loading state over the swept sine process, hysteresis responses of solder joints following the isotropic hardening rule vanish fairly quickly so that plasticity is fully developed. Computed and measured acceleration response spectra of a board-level test vehicle are benchmarked. Stress-based failure indices as well as elastoplastic responses and strain rates of solder joints are examined for the test vehicle subjected to swept sine vibration tests of different acceleration levels with vibration frequencies up to 2 kHz.