{"title":"Interoperability beyond design: sharing knowledge between design and manufacturing","authors":"D. Cottrell, T. J. Grebinski","doi":"10.1109/ISQED.2003.1194734","DOIUrl":"https://doi.org/10.1109/ISQED.2003.1194734","url":null,"abstract":"The nature of IC design is necessarily evolving to a more data-centric design flow in which EDA tools share a common information in a design database without the negative cost and quality impacts of data translation from sequential files. In support of this new paradigm, a collection of mainstream companies within the IC supply chain have sponsored the development of an open industry data model and application program interface for IC design tools, along with a database that fully implements this. This technology, called OpenAccess, is now available and being adopted by the IC design community. Another industry effort is in operation with the goal of greatly improving the cost and efficiency for IC photomasks. That effort is exploring a new paradigm similar in nature to OpenAccess in that a common data model and data access language is proposed. This data model would span both the design and mask-making communities, and possibly expand into wafer fabrication over time. Thus, it has become known as the Universal Data Model (UDM). This paper discusses some of the rationale for the UDM and highlights the attributes of the OpenAccess technology that make it the ideal base on which to build an open industry UDM.","PeriodicalId":448890,"journal":{"name":"Fourth International Symposium on Quality Electronic Design, 2003. Proceedings.","volume":"59 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-03-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124393641","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"An embedded I/sub DDQ/ testing architecture and technique","authors":"Y. Tsiatouhas, T. Haniotakis, A. Arapoyanni","doi":"10.1109/ISQED.2003.1194773","DOIUrl":"https://doi.org/10.1109/ISQED.2003.1194773","url":null,"abstract":"In this paper an embedded I/sub DDQ/ testing architecture is presented that targets to overcome the excessive hardware overhead requirements in built-in current sensing based testing applications. Moreover, a technique that utilises the IEEE 1149.1 boundary scan standard to control the proposed architecture is provided. The proposed solution is characterised by low silicon area requirements and permits the application of I/sub DDQ/ testing also in case that the chip is mounted on a printed circuit board.","PeriodicalId":448890,"journal":{"name":"Fourth International Symposium on Quality Electronic Design, 2003. Proceedings.","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-03-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131626168","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Cycle-accurate energy measurement and high-level energy characterization of FPGAs","authors":"H. Lee, S. Nam, N. Chang","doi":"10.1109/ISQED.2003.1194744","DOIUrl":"https://doi.org/10.1109/ISQED.2003.1194744","url":null,"abstract":"Field programmable gate arrays (FPGAs) play many important roles, ranging from small glue logic replacement to system-on-chip designs. Nevertheless, FPGA vendors can not accurately specify the energy consumption information of their products on the device data sheets because the energy consumption of FPGAs is strongly dependent on target circuit including resource utilization, logic partitioning, mapping, placement and route. While major CAD tools have started to report average power consumption under given transition activities, energy optimal FPGA design demands more detailed energy estimation. In this paper, we introduce an in-house cycle-accurate energy measurement tool and energy characterization schemes from low level to operation level. The tool offers all the necessary capability to investigate the energy consumption of FPGAs for high-level, operation-based energy characterization, which is useful for high-level, system-wide energy estimation. It also includes features for low-level energy characterization. We compare our tool with Xilinx XPower and demonstrate state machine energy characterization of an LCD controller and an SDRAM controller.","PeriodicalId":448890,"journal":{"name":"Fourth International Symposium on Quality Electronic Design, 2003. Proceedings.","volume":"43 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-03-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128989375","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Is quality a design constraint for sub 100nm designs?","authors":"S. Ohr","doi":"10.1109/ISQED.2003.1194700","DOIUrl":"https://doi.org/10.1109/ISQED.2003.1194700","url":null,"abstract":"Deep sub-micron design (below 100nm) present a number of new design challenges. These include very high masking costs, new interconnect materials and parasitic phenomenon, significant re-engineering at the device level due to changes in basic device performance, very high gate count and pin count designs, complexity in high pin count packaging & test, and finally reduced product life in the marketplace do to the rapid rollout of new technologies. One of the trade offs that is taking place in the industry to address these issues is the decision toward “design existence”, which is the selection of the “first functional implementation” of a design, over “design quality” which is the selection of the “optimal implementation” of a design.","PeriodicalId":448890,"journal":{"name":"Fourth International Symposium on Quality Electronic Design, 2003. Proceedings.","volume":"325 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-03-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132201086","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"A proposal for routing-based timing-driven scan chain ordering","authors":"Puneet Gupta, A. Kahng, S. Mantik","doi":"10.1109/ISQED.2003.1194755","DOIUrl":"https://doi.org/10.1109/ISQED.2003.1194755","url":null,"abstract":"Scan chain insertion can have large impact on routability, wirelength and timing. We propose a routing-driven and timing-aware methodology for scan insertion with minimum wirelength. We take into account timing slacks at all sinks that are affected by scan insertion, to achieve a scan chain ordering that meets timing and has smallest wirelength. For the case where sink timing is not met, we also propose a buffer insertion methodology with minimum wirelength objective. The key contribution of this paper is a method to compute a timing-driven incremental connection suited to scan insertion; this has possible applications in general incremental routing.","PeriodicalId":448890,"journal":{"name":"Fourth International Symposium on Quality Electronic Design, 2003. Proceedings.","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-03-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117180648","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pradiptya Ghosh, Chung-shin Kang, Michael Sanie, David Pinto
{"title":"New DFM approach abstracts altPSM lithography requirements for sub-100 nm IC design domains","authors":"Pradiptya Ghosh, Chung-shin Kang, Michael Sanie, David Pinto","doi":"10.1109/ISQED.2003.1194721","DOIUrl":"https://doi.org/10.1109/ISQED.2003.1194721","url":null,"abstract":"Since the semiconductor industry hit the 0.18-micron generation, device feature sizes have become increasingly smaller than the wavelength of light used by available optical-lithography equipment. In this subwavelength arena, manufacturing requirements must be handled up front in the IC design stage-while changes can still be made-to enhance quality and yield. This paper defines the components needed to get clean alternating phase-shifting masks (altPSM) that ensure the manufacturability of subwavelength circuit designs. The authors present a new design for manufacturability (DFM) approach, creating an abstract set of rules that can be used to advantage in various IC CAD tool domains, especially for 100 nm and below design rules. A new methodology and algorithm are presented that can quickly and easily integrate altPSM into existing and future tools earlier in the IC design flow. Finally, experimental results show how the methodology and algorithm is used to debug process-aware designs and make them altPSM-compliant.","PeriodicalId":448890,"journal":{"name":"Fourth International Symposium on Quality Electronic Design, 2003. Proceedings.","volume":"138 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-03-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131944034","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Reduced-order modeling based on Prony's and Shank's methods via the bilinear transformation","authors":"M. Mansour, A. Mehrotra","doi":"10.1109/ISQED.2003.1194749","DOIUrl":"https://doi.org/10.1109/ISQED.2003.1194749","url":null,"abstract":"In this paper, we propose a new model-order reduction technique for linear dynamic systems. The idea behind this technique is to transform the dynamic system function from the s-domain into the z-domain via the bilinear transformation, then use Prony's or Shank's least-squares approximation methods instead of the commonly employed Pade approximation method, and finally transform the reduced system back into the s-domain using the inverse bilinear transformation. Simulation results for large practical systems show that this technique based on Prony's and Shank's methods give much higher accuracy than the traditional Pade method. and result in lower-order approximations with negligible increase in simulation time.","PeriodicalId":448890,"journal":{"name":"Fourth International Symposium on Quality Electronic Design, 2003. Proceedings.","volume":"280 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-03-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127387706","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Gilles-Eric Descamps, S. Bagalkotkar, S. Ganesan, S. Subramaniam, H. Hingarh
{"title":"The iFlow design factory: evolving chip design from an art to a process, through adaptive resource management, and qualified data exchange","authors":"Gilles-Eric Descamps, S. Bagalkotkar, S. Ganesan, S. Subramaniam, H. Hingarh","doi":"10.1109/ISQED.2003.1194723","DOIUrl":"https://doi.org/10.1109/ISQED.2003.1194723","url":null,"abstract":"With advancing semiconductor technology, growing design complexities, companies have turned to a global design team to build their system on a chip (SoC). The major challenge is the capacity to scale infrastructure and methodology, along with ASIC design. Silicon Access Networks recently shipped for revenue from first silicon, a family of four high performance SoC products. These high-end networking products were designed in state-of-the-art 0.13 /spl mu/m process and collectively had about 750-million transistors and a variety of analog, digital and memory functional blocks to provide the industry's highest performance OC-192 Data Plane Processing solution. This paper describes some of the key aspects of Silicon Access Networks' design methodology that enabled to accomplish repeatable \"first pass silicon\" successes. We gained predictability in our chip design cycle through real-time visibility of the processes. Quality enhancing strategies were applied to the chip design cycles. Adaptive resource management, and qualified data exchange were the two main techniques. Multi site design teams working in different time zones may be a pitfall, or may allow for true 24/7 operation, depending on whether the right data and resources are available. Building such large designs in parallel requires efficient management of resources - machines, tools and users - in a transparent but truly global environment.","PeriodicalId":448890,"journal":{"name":"Fourth International Symposium on Quality Electronic Design, 2003. Proceedings.","volume":"11 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-03-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132977660","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Optimizing the energy-delay-ringing product in on-chip CMOS line drivers","authors":"S. Abbaspour, Massoud Pedram, P. Heydari","doi":"10.1109/ISQED.2003.1194743","DOIUrl":"https://doi.org/10.1109/ISQED.2003.1194743","url":null,"abstract":"This paper presents a detailed empirical study and analytical derivation of voltage waveform and energy dissipation of global lines driven by CMOS drivers. It is shown that at high clock frequencies where the output voltage at the termination point of the transmission line may not reach its steady state value during the clock period, it is possible to reduce energy dissipation while meeting a DC noise margin by driver sizing. This is in sharp contrast with the steady state analysis, which states that driver size has no impact on the energy dissipation per output change. In addition, we propose a new design metric which is the product of energy, delay and some measure of ringing in lossy transmission lines. In particular, this paper provides closed-form expressions for the energy dissipation, 50% propagation delay and the percentage of maximum undershoot when the circuit exhibits an under-damped behavior. This metric is used during the driver sizing problem formulation for minimum energy-delay-ringing product.","PeriodicalId":448890,"journal":{"name":"Fourth International Symposium on Quality Electronic Design, 2003. Proceedings.","volume":"44 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-03-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132989395","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Proceedings Fourth International Symposium on Quality Electronic Design","authors":"","doi":"10.1109/ISQED.2003.1194698","DOIUrl":"https://doi.org/10.1109/ISQED.2003.1194698","url":null,"abstract":"The following topics are dealt with: VLSI design, modeling, simulation; IC packages; interconnected systems; noise analysis; system on chip; submicron technology; high speed circuits; reliability; IC testing; leakage currents; testing measurements.","PeriodicalId":448890,"journal":{"name":"Fourth International Symposium on Quality Electronic Design, 2003. Proceedings.","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122945383","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}