{"title":"第四届质量电子设计国际研讨会论文集","authors":"","doi":"10.1109/ISQED.2003.1194698","DOIUrl":null,"url":null,"abstract":"The following topics are dealt with: VLSI design, modeling, simulation; IC packages; interconnected systems; noise analysis; system on chip; submicron technology; high speed circuits; reliability; IC testing; leakage currents; testing measurements.","PeriodicalId":448890,"journal":{"name":"Fourth International Symposium on Quality Electronic Design, 2003. Proceedings.","volume":"13 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":"{\"title\":\"Proceedings Fourth International Symposium on Quality Electronic Design\",\"authors\":\"\",\"doi\":\"10.1109/ISQED.2003.1194698\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The following topics are dealt with: VLSI design, modeling, simulation; IC packages; interconnected systems; noise analysis; system on chip; submicron technology; high speed circuits; reliability; IC testing; leakage currents; testing measurements.\",\"PeriodicalId\":448890,\"journal\":{\"name\":\"Fourth International Symposium on Quality Electronic Design, 2003. Proceedings.\",\"volume\":\"13 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1900-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"9\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Fourth International Symposium on Quality Electronic Design, 2003. Proceedings.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISQED.2003.1194698\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Fourth International Symposium on Quality Electronic Design, 2003. Proceedings.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISQED.2003.1194698","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Proceedings Fourth International Symposium on Quality Electronic Design
The following topics are dealt with: VLSI design, modeling, simulation; IC packages; interconnected systems; noise analysis; system on chip; submicron technology; high speed circuits; reliability; IC testing; leakage currents; testing measurements.