Suryasnata Tripathy, R. Gangwar, S. Vanjari, S. Singh
{"title":"Polyaniline Nanofibers as Chemiresistive Transducers: Seeded Synthesis, Characterization and DNA Sensing","authors":"Suryasnata Tripathy, R. Gangwar, S. Vanjari, S. Singh","doi":"10.1109/icee50728.2020.9776939","DOIUrl":"https://doi.org/10.1109/icee50728.2020.9776939","url":null,"abstract":"In this paper, seeded synthesis of Polyaniline (PANi) nanofibers, their characterization and use as transducers in chemiresistive DNA sensing have been reported. PANi, among many one-dimensional conductive polymers, has shown great potential as a transducer in chemiresistive biosensing in general and DNA sensing in particular, on account of its natural conductivity, ease of doping and surface functionalization. Herein, PANi nanofibers were synthesized using a seeding method, using single walled carbon nanotube (SWCNT) seeds. Surface morphology of the thus synthesized nanofibers were investigated using scanning electron microscopy (SEM) and transmission electron microscopy (TEM). The nanofibers were surface modified with 2% glutaraldehyde for facilitating probe-DNA immobilization, and the results of the same were investigated using Fourier transform infrared spectroscopy. Further, towards analyzing the electrical transport properties of the PANi nanofibers, I-V characteristics were recorded in the applied bias range of −10 V - +10 V, using Agilent B1500A parametric analyzer. As inferred, the I-V response was symmetric about the vertical axis, revealing a crossover between near-Ohmic and power-law dominated regions. As a case study, in this work, the PANi nanofibers were used as transducers for chemiresistive detection of Dengue virus specific consensus primers (DENVCP).","PeriodicalId":436884,"journal":{"name":"2020 5th IEEE International Conference on Emerging Electronics (ICEE)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-11-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123055410","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Optimization of Drain Extended MOS Devices for Reliability in High Switching applications","authors":"Shraddha Pali, Ankur Gupta","doi":"10.1109/icee50728.2020.9777045","DOIUrl":"https://doi.org/10.1109/icee50728.2020.9777045","url":null,"abstract":"In this work, we investigate the static and transient performance of Drain Extended NMOS (DeNMOS) devices with and without Shallow Trench Isolation (STI). Devices drain-to-source pitch and layout parameters are kept constant, except gate overlap length which is reduced by applying a suitable gate edge termination technique to ensure Safe Operating Area (SOA) and lower the gate charge. A comparative study of optimized STI and NonSTI based DeNMOS for switching applications and gate edge reliability is shown. It is found that the reduction of gate length over the drift region reduces gate to drain coupling charge by more than 60%. We present that a FOM improvement of 55% in STI and 45% in NonSTI DeNMOS w.r.t their respective standard devices can be achieved using gate edge termination techniques without compromising in SOA and gate edge reliability.","PeriodicalId":436884,"journal":{"name":"2020 5th IEEE International Conference on Emerging Electronics (ICEE)","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-11-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121872677","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Shruti Pathak, A. M. Chauhan, Jayadeva, Bhaskar Mitra
{"title":"Design of 3-D Printed Quadrupole Mass Spectrometer","authors":"Shruti Pathak, A. M. Chauhan, Jayadeva, Bhaskar Mitra","doi":"10.1109/icee50728.2020.9777055","DOIUrl":"https://doi.org/10.1109/icee50728.2020.9777055","url":null,"abstract":"Previous attempts at miniaturizing Quadrupole mass spectrometers (QMS) have focused on micromachined devices. The resolution of a QMS varies with the square of its length (for a fixed frequency). Thus, MEMS scale QMS have limited resolution due to their small lengths. Also, macroscale QMS requires higher vacuum levels as the scattering tends to degrade the resolution. The length scales in 3-D printed devices promise a better balance between resolution and higher-pressure operation than previous miniaturization efforts. This paper reports a design and fabrication of portable QMS using 3-D printing technology. 3-D printing provides a more optimum scale for miniaturizing QMS as the devices can be a few cm's in length with the various components being correctly aligned. The simulation of QMS is performed using COMSOL Multiphysics. Mathieu's first stability region is plotted for the base peaks of chemicals in the range 20-200 amu. The 3-D printed prototype of QMS is illustrated with hollow cathode as an ionizer, quadrupole mass filter as a mass analyzer, and Faraday cup as a detector. N2+ ions are passed through the QMS for preliminary testing of the device. A 2 MHz AC signal is applied to the mass filter. Preliminary testing gave a current of $22 mumathrm{A}$ when the device was tuned to N2+ and $0 mumathrm{A}$ when the mass filter voltage is not applied.","PeriodicalId":436884,"journal":{"name":"2020 5th IEEE International Conference on Emerging Electronics (ICEE)","volume":"81 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-11-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121910267","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Monika Sharma, R. Narang, M. Saxena, Mridula Gupta
{"title":"Effect of Interface Charges on InGaN and InGaAs Based Dopingless TFET and its Circuit Analysis","authors":"Monika Sharma, R. Narang, M. Saxena, Mridula Gupta","doi":"10.1109/icee50728.2020.9776962","DOIUrl":"https://doi.org/10.1109/icee50728.2020.9776962","url":null,"abstract":"In this paper, the doping-less tunnel field-effect transistor with its gate-engineered structures is studied in which the effect of interface charges and its circuit performance are presented. The charge plasma method is used for reinforcing the desired doping by depositing the metal layer of required work-function on it, which makes it free from random doping fluctuations. While, the deposition of the oxide layer on the semiconducting bar leads to the formation of dangling bonds on the surface, to include the effect of breakage of bonds on the interface both positive and negative interface charges are considered. The comparison of different materials with different interface charges shows the improvement in the characteristics for InGaAs DL TFET. Further, the gate engineered structures are compared for InGaN and InGaAs based DL TFET, and among these InGaAs based DL TFET shows higher ON-current characteristics for positive interface charges. The CV and transient behavior of all the structures are also studied. Among all the structures studied for DC and RF performance estimation shows InGaAs HD-HG DL TFET as the most prominent structure for digital circuits because of its lower miller capacitance. Hence, it can be used for faster switching circuits and sensing applications.","PeriodicalId":436884,"journal":{"name":"2020 5th IEEE International Conference on Emerging Electronics (ICEE)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-11-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123162265","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Optimized MEMS Circular Membrane Resonators for Mechanical Energy Harvesting and Sensing for IoT Application","authors":"F. Beigh, J. Sheikh, N. Beigh","doi":"10.1109/icee50728.2020.9777018","DOIUrl":"https://doi.org/10.1109/icee50728.2020.9777018","url":null,"abstract":"The Internet of Things (IoT) definition tends to be the common denominator of all distributed sensing systems, providing intelligent entities with connectivity and interoperability within a pervasive network. Normally, IoT nodes are powered with the conventional batteries, but since the lifetime of battery is constrained and often their replacement is impracticable. Thus, there is strong need of self-powered devices or alternative sources of energy to continuously power the IoT devices. Proposed solution to this limitation is use of vibration based Micro electromechanical systems (MEMS) piezoelectric energy harvester that could provide a free, green, and virtually unlimited secondary powering source over traditional energy sources (batteries). Due recent development in field of MEMS technology, vibration energy harvesting is gaining attention and with an abundant vibration energy available generate power using MEMS devices within microwatts to few mW ranges, it is going to become the technology of future. In this paper we are proposing variants of circular membrane type of MEMS structures which can be used for piezoelectric vibrational energy harvesting and sensing. The aim of proposed structures is efficient energy harvesting as well as condition monitoring of remote or standalone vibrating sources such as water pumps and rotors that produce a narrow frequency range vibration depending upon the physical condition of the source.","PeriodicalId":436884,"journal":{"name":"2020 5th IEEE International Conference on Emerging Electronics (ICEE)","volume":"36 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-11-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122639166","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Three-axis Piezoresistive MEMS Accelerometer with Extended Twin Mass Structure","authors":"Jesma R. Raeann, Shalini Singh, V. Seena","doi":"10.1109/icee50728.2020.9777051","DOIUrl":"https://doi.org/10.1109/icee50728.2020.9777051","url":null,"abstract":"In this paper, we report the design and Finite Element Analysis (FEA) based simulation of a novel three-axis MEMS piezoresistive accelerometer with high resonant frequency and sensitivity. The design of this accelerometer allows extended bandwidth without compromising the sensitivities in all the three axes. The accelerometer also exhibits good cross-axis performance. The resonant frequency can be increased further without affecting the sensitivity of our proposed device by reducing the length of the intermediate beam. We have suggested a new approach to reduce the length of the intermediate beam by extending the proof mass into the intermediate beam. The resulting device showed an increase in the mode 1 frequency by 2 kHz along with a considerable increase in the z-axis acceleration sensitivity by 10 microvolts for 1 g of acceleration. Whereas, the device with direct reduction of length of the intermediate beams exhibited an increase in the mode 1 frequency by 2 kHz without any improvement in the sensitivity.","PeriodicalId":436884,"journal":{"name":"2020 5th IEEE International Conference on Emerging Electronics (ICEE)","volume":"47 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-11-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122672469","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Fabrication of CMOS Compatible 2-terminal NEMS for Low Power Applications","authors":"S. Saha, M. Baghini, Mayank Goel, V. Rao","doi":"10.1109/icee50728.2020.9776893","DOIUrl":"https://doi.org/10.1109/icee50728.2020.9776893","url":null,"abstract":"Nano-electro-mechanical switch (NEMS) plays a key role to reduce the leakage current as compared to the traditional CMOS in ultra-low power applications. This is because of the air gap between two metal plates in 2-terminal (2T) NEMS i.e. there is almost zero leakage current while it's in OFF-state. In this paper, we demonstrate a CMOS compatible NEMS with 1.5 V pull-in voltage, $sim 150 Omega$ ON-state resistance (RON), 15 ns turn ON delay, and 109 ON/OFF current ratio (ION/IOFF) in the ambient conditions. This work exhibits the combination of electron beam lithography (EBL) and a bilayer lift-off process at room temperature (RT) to realize the NEMS. This combination facilitates easy release of structures with an air gap of 25 nm and a beam size of $1 mu mtimes 1.5 mu m$. This low power NEMS will be useful for the zero leakage switch for the variety of low power applications.","PeriodicalId":436884,"journal":{"name":"2020 5th IEEE International Conference on Emerging Electronics (ICEE)","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-11-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129459121","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Contact Study of MEMS High g Impact Sensor","authors":"Vikram Maharshi, A. Agarwal, Bhaskar Mitra","doi":"10.1109/icee50728.2020.9776769","DOIUrl":"https://doi.org/10.1109/icee50728.2020.9776769","url":null,"abstract":"In this paper, we report the contact behavior of a MEMS high g impact sensor. These devices are designed to measure high g shock loads with precision and latch in response to a threshold input. The contact mechanics of latching and impact need to be modelled in detail to design to a high degree of precision. The COMSOL Multiphysics tools and analytical solutions were used to analyze the contact behavior for impact sensors. The design validation using contact mechanics simulation of an acceleration sensor and an impact mass is reported. The electrical contact resistance of the latching switch is modelled using Hertzian contact mechanics theory. Diffusion transport resistance is seen to be the dominant mechanism and was determined to be $0.45 mathrm{m}Omega$ for $0.19 mumathrm{m}^{2}$ contact area. The maximum temperature at the contact area was analyzed using the finite element method was quite close to the analytical solution.","PeriodicalId":436884,"journal":{"name":"2020 5th IEEE International Conference on Emerging Electronics (ICEE)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-11-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129186444","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pritam Yogi, M. Kumar, K. Aditya, Charu Gupta, A. Dixit
{"title":"Impact of Hot Carrier Injection on Total Ionizing Dose Effect of 10-nm N-channel Bulk FinFETs","authors":"Pritam Yogi, M. Kumar, K. Aditya, Charu Gupta, A. Dixit","doi":"10.1109/icee50728.2020.9776895","DOIUrl":"https://doi.org/10.1109/icee50728.2020.9776895","url":null,"abstract":"In this paper, the effect of hot-carrier injection (HCI) on Total Ionization Dose (TID) for the 10-nm technology node N-channel bulk FinFETs is reported. The Gamma radiation (60CO chamber) has been used as the source of Total Ionization Dose (TID), while DC bias stress ($mathrm{V}_{text{gs}}=mathrm{V}_{text{ds}}=1.2mathrm{V}$) is used for HCI degradation. We performed experiments on n-channel bulk FinFETs with two gate lengths, i.e. $text{Lg}=30$ and 70nm. A set of these devices was subjected to hot-carrier stress, while another set kept virgin. All of the devices were then irradiated in the gamma-ray chamber for a cumulative dose of 43 Mrad (Si). The devices were analyzed afresh as well as after the hot-carrier stress and irradiation for changes in threshold voltage (Vth), sub-threshold slope (SS), on-current (Ion), off-current (Ioff) for linear and saturation regions of operation. Our results are useful as they predict, for the first time ever, an interesting scenario for space applications as to how the performance of the device degrades in space, not just due to exposure to gamma radiation but also due to aging.","PeriodicalId":436884,"journal":{"name":"2020 5th IEEE International Conference on Emerging Electronics (ICEE)","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-11-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127683902","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Fabrication of Freestanding Metallic MEMS Actuator for Minimal Stress-Induced Air-gap Variations","authors":"Sushil Kumar, D. S. Arya, Pushpapraj Singh","doi":"10.1109/icee50728.2020.9776983","DOIUrl":"https://doi.org/10.1109/icee50728.2020.9776983","url":null,"abstract":"Suspended micro/nano-structures are the essential building blocks for a variety of micro/nano electromechanical (N/MEMS) applications. Owing to process variability these suspended blocks comprised significant residual-stress/stress-gradient during the fabrication, resulting in curled actuator profile that directly affects the actuation-gap ($G$). The electrostatic switching devices are highly sensitive to gap variations (as pull-in voltage, $V_{pi}^{2}propto G^{3}$). The present method and the results of its experimental investigation provide a compatible process for realizing invariant actuation air-gap using effective bending control essential requirement for electrostatic devices. We report a laser-driven scheme for stress reduction in the cantilever-based molybdenum micro-actuators without using any high-temperature process, like rapid thermal annealing (RTA). Finally, this method helps to realize freestanding micro/nano-actuators for various M/NEM devices (e.g. resonators, sensors and actuators) and can be used to reduce stress in back end of line (BEOL) technology.","PeriodicalId":436884,"journal":{"name":"2020 5th IEEE International Conference on Emerging Electronics (ICEE)","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2020-11-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124114490","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}