Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics最新文献_第4页

Modelling of Carbon Nanotubes as Heat Sink Fins in Microchannels for Microelectronics Cooling 碳纳米管作为微电子冷却微通道散热片的建模

Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics Pub Date : 2005-10-23 DOI: 10.1109/POLYTR.2005.1596514

L. Ekstrand, Z. Mo, Yan Zhang, J. Liu

引用次数: 13

Low temperature snap cure thermoset adhesives with good worklife 低温快速固化热固性粘合剂，具有良好的工作寿命

Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics Pub Date : 2005-10-23 DOI: 10.1109/POLYTR.2005.1596510

S. Gillissen, E. Nelis, G. van Wuytswinkel, M. de Pater, Chih-Min Cheng, V. Buffa, W. O'hara, B. Xia, Jayesh Shah

{"title":"Low temperature snap cure thermoset adhesives with good worklife","authors":"S. Gillissen, E. Nelis, G. van Wuytswinkel, M. de Pater, Chih-Min Cheng, V. Buffa, W. O'hara, B. Xia, Jayesh Shah","doi":"10.1109/POLYTR.2005.1596510","DOIUrl":"https://doi.org/10.1109/POLYTR.2005.1596510","url":null,"abstract":"A break-through adhesive chemistry has been developed that achieves cure in seconds at temperatures below 110°C. These adhesives enable low cost RFID tag construction with low temperature substrates at extremely high assembly speed. Assemblies that require electrically conductive or non-conductive adhesives can benefit from this innovation. The cure speed of isotropic conductive paste (ICP) adhesive is demonstrated by measuring dynamic conductivity development during the heating process. Rheological stability at room temperature persists for days. The impact of rheological behavior on high speed processing is discussed. Silver ink based antenna and simulated die strap are used as test vehicles for processing and reliability tests. The integrity of the assembly is shown using a mandrel bend test to simulate downstream processing such as converting and printing. Together with a proprietary thermal radiation cure method, assembly speeds up to 300 feet/minute are achievable. The electrical stability of these bend-tested tags were evaluated in air to air thermal shock (-40°C to 80°C) and 85°C/85%RH conditions and found to be stable. The reliability results are presented and the challenge of high speed reel-to-reel processing are also discussed based on an isotropic conductive adhesive approach. This paper discusses these results and presents an adhesive technology that enables low cost RFID tag assembly.","PeriodicalId":436133,"journal":{"name":"Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics","volume":"41 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130081847","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5

Organic Electronics - Towards a Cost-Efficient Heterointegration Platform for Multi-Functional Systems? 有机电子学-迈向多功能系统的低成本异质集成平台?

Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics Pub Date : 2005-10-23 DOI: 10.1109/POLYTR.2005.1596525

K. Bock

{"title":"Organic Electronics - Towards a Cost-Efficient Heterointegration Platform for Multi-Functional Systems?","authors":"K. Bock","doi":"10.1109/POLYTR.2005.1596525","DOIUrl":"https://doi.org/10.1109/POLYTR.2005.1596525","url":null,"abstract":"Current trends in the development of electronics systems show, that the provision of thin flexible components and semiconductors plays a decisive role in the steadily progressing development of highly integrated systems. A new generation of thin flexible electronic systems arises. At present, this world is very much dominated by inorganic active materials, in particular thin flexible silicon integrated circuits, but new functionality based on conductive and semi-conductive plastic materials is developing fast. Freedom of design, compact portable products, cost-effective production and assembly, environment friendly materials, software based printed ICs, flexible polymer transistors and thin flexible silicon ICS-there are unquestionable advantages of flexible electronics. Microsystems incorporating fluidic, mechanical, optical and electrical components are under research and development at present. A new word, \"polytronics\" (polymer+electronics) has appeared in electronic vocabulary as a short name of this quickly developed technology. This paper aims to present an overview of these technologies.","PeriodicalId":436133,"journal":{"name":"Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics","volume":"124 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125584358","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Contact resistance measurement for Au bumped IC to ITO on glass for LCD's LCD玻璃上Au碰撞IC到ITO的接触电阻测量

Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics Pub Date : 2005-10-23 DOI: 10.1109/POLYTR.2005.1596507

L. Beckers, E. Schiepers, M. Raes, M. Smeets, A. van der Lugt

引用次数: 0

Development of Active Functional Polymers for p- and n-type OFET- Applications 用于p型和n型OFET的活性功能聚合物的开发

Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics Pub Date : 2005-10-23 DOI: 10.1109/POLYTR.2005.1596490

S. Janietz, D. Sainova, U. Asawapirom

{"title":"Development of Active Functional Polymers for p- and n-type OFET- Applications","authors":"S. Janietz, D. Sainova, U. Asawapirom","doi":"10.1109/POLYTR.2005.1596490","DOIUrl":"https://doi.org/10.1109/POLYTR.2005.1596490","url":null,"abstract":"Here we present a concept to improve the field effect transistor performance of P3HT in terms of threshold voltage stability as well as the stability in ambient atmosphere by introducing a strong acceptor dopant in the main polymer chain. In our concept the direct introduction of the acceptor dopant in the polymer main chain ensures the strucural stability against diffusion processes. P3HTs with different contents of acceptor molecules which are fixed linked in the main chain of the polymer, have been synthesized using the McCullough Grignard metathesis method. As acceptor unit has been integrated tetrafluorbenzene (TFB). The introduced dopant amount has been varied in order to obtain an optimum between the processability of the polymers and the resultant transistor performance. Compared to the p-type semionducting polymers the n-type organic materials are markedly less developed. Recently an interesting solution to this task has been proposed in the form of a conjugated ladder-type poly(benzo-bisimidazobenzo-phenanthroline) (BBL) showing either ambipolar or n-type field effect properties dependent upon the sample preparation and processing. However this rigid-chain ladder polymer is not soluble in the common organic solvents resulting in a rather complicated technological transfer. We report the significant improvement of the BBL-processing utilizing aqueous colloidal dispersions and their OFET-application. The resultant devices demonstrate ambipolar electronic transport with charge carrier mobilities in the range of 10-5cm2/Vs without specific optimization procedures.","PeriodicalId":436133,"journal":{"name":"Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics","volume":"131 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122747267","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

CMP of PC, PMMA and SU-8 Polymers PC, PMMA和SU-8聚合物的CMP

Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics Pub Date : 2005-10-23 DOI: 10.1109/POLYTR.2005.1596487

Z. Zhong, Z. Wang, B. Zirajutheen, Y. Tan, Y. Tan

{"title":"CMP of PC, PMMA and SU-8 Polymers","authors":"Z. Zhong, Z. Wang, B. Zirajutheen, Y. Tan, Y. Tan","doi":"10.1109/POLYTR.2005.1596487","DOIUrl":"https://doi.org/10.1109/POLYTR.2005.1596487","url":null,"abstract":"Polymers such as PC (polycarbonate), PMMA (poly methyl methacryate) and SU-8 epoxy resin are replacing silicon as the major substrate in microfluidic system (or BioMEMS) fabrication. Chemical mechanical polishing (CMP) is an important technology for many advanced microelectromechanical system (MEMS) and micro-optoelectromechanical system applications. In this study, CMP of PC, PMMA and SU-8 polymers was investigated. Four types of slurry were tested for CMP of PC and PMMA. Experiments were then designed and performed to investigate effects of two key process parameters. The experimental results show that an increase in head load or table speed would cause an increase in material removal rates (MRRs). Within the chosen experimental parameter ranges, the variation of table speed introduced a more significant change in MRRs than that of head load. ANOVA was also carried out, and it was found that the interaction of head load and table speed had a significant (95% confidence) effect on surface finish of polished PMMA samples while table speed had a significant effect on surface finish of polished PC samples. CMP is also a process well suited for polishing high-aspect-ratio SU-8 structures. Polished PC, PMMA and SU-8 surfaces had nanometer-order surface roughness, acceptable to most MEMS applications.","PeriodicalId":436133,"journal":{"name":"Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics","volume":"41 3","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"113978712","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Direct Writing of Light Guiding Structures 导光结构的直接书写

Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics Pub Date : 2005-10-23 DOI: 10.1109/POLYTR.2005.1596500

T. Fahlbusch, L. Overmeyer

引用次数: 3

Structural, thermal and electrical properties of plasma deposited a-C:F films 等离子体沉积a-C:F薄膜的结构、热学和电学性能

Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics Pub Date : 2005-10-23 DOI: 10.1109/POLYTR.2005.1596521

Zhenyu Wu, Yintang Yang, JiaYou Wang

{"title":"Structural, thermal and electrical properties of plasma deposited a-C:F films","authors":"Zhenyu Wu, Yintang Yang, JiaYou Wang","doi":"10.1109/POLYTR.2005.1596521","DOIUrl":"https://doi.org/10.1109/POLYTR.2005.1596521","url":null,"abstract":"Flurinated amorphous carbon (a-C:F) films were deposited at room temperature using C<inf>4</inf>F<inf>8</inf>and CH<inf>4</inf>as precursor gases by electron cyclotron resonance chemical vapour deposition (ECR-CVD). Chemical compositions and bond structures were investigated by Fourier transform infrared (FTIR) spectroscopy and X-ray photoelectron spectroscopy (XPS). CF=C (1680cm-1), as well as CF<inf>2</inf>=CF (1780cm-1) that acted as termination groups of the cross-linking film structure were identified in the deposited a-C:F films. C 1s peaks were assigned to CF<inf>3</inf>(295eV), CF<inf>2</inf>(293eV), CF(291eV), C-O(289eV), C-CF<inf>x</inf>(x=1∼3) (287eV) and C-C termination bond(285eV), respectively. The CF<inf>3</inf>and C-C termination bonds were thermally liable and could induce reduction of film thickness after heat treatment through out-gassing effect. The thermal stability of a-C:F films improved with increasing cross-linking C-CF<inf>x</inf>bonds and decreasing CF<inf>3</inf>and C-C termination bonds. The dissipation factor of the as-deposited metal-insulator-semiconductor capacitor (MIS-C) was approximately 0.07 at 1MHz. The dielectric constant of a-C:F films increased after heat treatment due to reduced electronic polarization and enhanced film density. The interface trap density decreased from (5∼9) ×1011eV-1cm-2to (4∼6) ×1011eV-1cm-2after 300°C annealing in a nitrogen environment. The current-voltage characteristics for a-C:F films was explained using ohmic conduction at low fields and Poole-Frankel(PF) conduction mechanism at high fields. The trap energy of the traps at band tails formed by the delocalized π electrons decreased after annealing, which led to increase of leakage current due to field-enhanced thermal excitation of trapped electrons into the conduction band.","PeriodicalId":436133,"journal":{"name":"Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics","volume":"38 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133798640","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Low-Temperature Process for Manufacturing All Polymer Thin-Film Transistors 制造全聚合物薄膜晶体管的低温工艺

Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics Pub Date : 2005-10-23 DOI: 10.1109/POLYTR.2005.1596518

R. Meixner, F. A. Yildirim, R. R. Schliewe, H. Goebel, W. Bauhofer, W. Krautschneider

引用次数: 0

Microsystem Interconnections Modelling Using Micropolar Theory and Discontinuous Approximation 基于微极理论和不连续逼近的微系统互连建模

Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics Pub Date : 2005-10-23 DOI: 10.1109/POLYTR.2005.1596512

Yan Zhang, R. Larsson, Jing-yu Fan, Z. Cheng, J. Liu

引用次数: 0