Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics最新文献_第3页

Physicochemical, electrical and stability properties of carbon black/polyesterimide thick-film resistors 碳黑/聚亚胺厚膜电阻器的物理化学、电学和稳定性

Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics Pub Date : 2005-10-23 DOI: 10.1109/POLYTR.2005.1596480

A. Dziedzic

引用次数: 2

Film Coating - Large Area Encapsulation Process for Electronics Packaging 薄膜涂层。电子封装用大面积封装工艺

Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics Pub Date : 2005-10-23 DOI: 10.1109/POLYTR.2005.1596482

K. Becker, T. Braun, M. Koch, V. Bader, R. Aschenbrenner, H. Reichl

{"title":"Film Coating - Large Area Encapsulation Process for Electronics Packaging","authors":"K. Becker, T. Braun, M. Koch, V. Bader, R. Aschenbrenner, H. Reichl","doi":"10.1109/POLYTR.2005.1596482","DOIUrl":"https://doi.org/10.1109/POLYTR.2005.1596482","url":null,"abstract":"For improved reliability of microelectronics an encapsulation of sensitive structures is crucial, this is true especially for polymer electronics, where oxygen diffusion and water vapor ingress do dramatically influence the electrical performance. For the protection of semiconducting polymers within organic LEDs a glass layer is the method of choice, providing optimized sealing except for the edge areas. Disadvantage of glass as a sealing material is its rigidity and its sensitivity against mechanical stress. For the realization of low cost applications as smart labels / RF ID tags besides barrier properties also mechanical protection is needed to ensure device functionality. This is especially true when these devices need to operate within harsh environment. Various approaches are possible to apply such barrier layers, typically CVD/PVD or spin coating are used, to yield thin, homogeneous layers of encapsulants of 1 to 5 μm thickness. For the high speed encapsulation of large areas also lamination is discussed, where multilayer films are applied using temperature and pressure, layer thickness is in the range of 5 to 30 μm. As a further technology, suited for the deposition of low viscosity liquid barrier materials, film coating processes are proposed. Focus of the technology development described is the application of homogeneous coating on large areas. Expected advantage is the contactless application at high speed on large area substrates, especially useful on substrates showing a 3D topography, as present with devices integrating heterogeneous structures as organic semiconductors (OSC), printed passives or coils.","PeriodicalId":436133,"journal":{"name":"Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics","volume":"38 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124972790","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Study on the Fabrication Process and Reliability Performance of Contactless Smart Card Using Nonconductive Film 非接触式非导电薄膜智能卡的制备工艺及可靠性研究

Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics Pub Date : 2005-10-23 DOI: 10.1109/POLYTR.2005.1596496

Y. Ma, Y. Chan

引用次数: 0

Electrically Conductive Formulations Filled Nano Size Silver Filler for Ink-Jet Technology 用于喷墨技术的纳米银填料的导电配方

Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics Pub Date : 2005-10-23 DOI: 10.1109/POLYTR.2005.1596484

A. Moscicki, T. Sobierajski, J. Felba, Józef Kudzia, A. Arp, Wilhelm Meyer

{"title":"Electrically Conductive Formulations Filled Nano Size Silver Filler for Ink-Jet Technology","authors":"A. Moscicki, T. Sobierajski, J. Felba, Józef Kudzia, A. Arp, Wilhelm Meyer","doi":"10.1109/POLYTR.2005.1596484","DOIUrl":"https://doi.org/10.1109/POLYTR.2005.1596484","url":null,"abstract":"As current studies and analyses imply, the future of modern microelectronics solutions is utterly dependent on nanotechnology within which nano size materials are more and more frequently produced and applied. This results in the unparalleled possibility of creating new, so far impossible to manufacture products as well as application technologies. Consequently, this results in a significant increase in the possibility of miniaturization of elements of electronic systems by reducing the dimensions of its elements themselves as well as increasing the density of their compaction. Polymer composites containing silver particles of single nanometers (several atoms) may be printed with the application of the Ink-Jet method in order to obtain a line or 'points' being electricity conductors or contacts in electronic assembly. The Ink-Jet printing method utilizes the percussive effect of a piezoelectric compressing capillary element within microsecond and thus resulting in sudden 'expenditure' of the dosed composition. During the very dosing process, the dosed portion is affected by acceleration of 105g, which may cause separation of elements of various specific weights from the dosed composition. Therefore, the physically best composition has the features of a specific solution in which the filler conducting electricity (silver) has the dimensions insignificantly differing from the dimensions of the binder in which it is 'suspended'. One of the crucial technical problems is the production of silver particles separated from one another and of adequately small and repetitive at defined time dimensions.","PeriodicalId":436133,"journal":{"name":"Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128489025","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 38

Cu/LCP Laminated Materials for New Generation FPC 新一代FPC用Cu/LCP层压材料

Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics Pub Date : 2005-10-23 DOI: 10.1109/POLYTR.2005.1596497

K. Nanbu, K. Saijo, K. Yoshida, H. Okayama, S. Ozawa, T. Suga

{"title":"Cu/LCP Laminated Materials for New Generation FPC","authors":"K. Nanbu, K. Saijo, K. Yoshida, H. Okayama, S. Ozawa, T. Suga","doi":"10.1109/POLYTR.2005.1596497","DOIUrl":"https://doi.org/10.1109/POLYTR.2005.1596497","url":null,"abstract":"As future materials for flexible printed circuits (FPCs) with high performance, we have studied copper clad lamination (CCL) materials of liquid crystal polymer (LCP) on copper (Cu) foil using a new laminating process, so called, surface activated bonding (SAB) method [1-5]. In previous report, it was found that the loss of peel strength during the heat-resistance test was improved by using copper-0.02% zirconium (Cu-Zr) alloy foil and a thicker sputter of copper-45% nickel (Cu-45Ni) or nickel-20% chromium (Ni-20Cr) alloys [5]. These improved materials showed excellent interface conductivity at high frequency and etching property. In this report, we tried to produce more improved materials with different sputtering metals and investigated various characteristics of the laminated materials such as scattering parameter (S21), etching property, and dimensional stability for the FPCs. It was clarified that the sputter metal of higher nickel content alloys prevented from the interface oxidation of the Cu-Zr alloy foil/LCP film laminated materials (Cu-Zr/LCP materials) after heat-resistance test. Especially in copper-80% nickel (Cu-80Ni)or nickel-10% chromium (Ni-10Cr) alloy, the peel strength of the laminated materials kept around 500N/m even after 144 hour heating. The S21 of micro-strip line of the laminated materials showed half attenuation when comparing with that produced by the conventional heat bonding method. It is also shown that the Cu-Zr materials produced by the SAB method (SAB material) have excellent etching property and dimensional stability.","PeriodicalId":436133,"journal":{"name":"Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics","volume":"85 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133986509","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Reliability Testing of Polytronics Components in the Micro-Nano Region 多电子元件的微纳可靠性测试

Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics Pub Date : 2005-10-23 DOI: 10.1109/POLYTR.2005.1596479

B. Michel, R. Dudek, H. Walter

引用次数: 3

Sol-gel materials for opto(electronic) applications 光电应用的溶胶-凝胶材料

Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics Pub Date : 2005-10-23 DOI: 10.1109/POLYTR.2005.1596509

K. Maruszewski

{"title":"Sol-gel materials for opto(electronic) applications","authors":"K. Maruszewski","doi":"10.1109/POLYTR.2005.1596509","DOIUrl":"https://doi.org/10.1109/POLYTR.2005.1596509","url":null,"abstract":"Conventional glass preparation requires melting of precursors at high temperatures, rapid cooling and subsequent vitrification of the glassy material. This procedure highly restricts choice of substances which can be entrapped in the glass products. Basically only metal oxides and some inorganic salts can survive such drastic conditions avoiding thermal decomposition. Furthermore, the way in which conventional glass is produced makes thin films preparation extremely cumbersome and the only method of preparation of porous classical glasses requires etching or partial dissolving (e.g. Vycor® glass). On the other hand glass and glassy materials possess several useful features for e.g. optical applications such as transparency, homogeneity, mechanical sturdiness, high refractive index etc. An alternative approach to glass and glass-like materials production is offered by the sol-gel technology. The process itself is known for more than a century, but it has gained a new importance in the last two decades after pioneering results of Dislich. He and other researchers improved the chemistry of the process so much that it is now possible to obtain samples in days (or even hours — in case of thin films) rather than months (or years) like in the case of the early samples. The sol-gel technique is based on hydrolysis of liquid precursors and formation of colloidal sols. The precursors are usually organosilicates (e.g. TEOS — tetraethoxysilane) giving silicate sol-gel materials. However, the method is not restricted to the silica compounds — for example precursors based on Ti, Zr, V etc.","PeriodicalId":436133,"journal":{"name":"Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics","volume":"2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116178466","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Reduced Amount of Conductive Ink with Gridded Printed Antennas 减少网格印刷天线的导电油墨量

Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics Pub Date : 2005-10-23 DOI: 10.1109/POLYTR.2005.1596493

J. Sidén, T. Olsson, A. Koptioug, Hans-Erik Nilsson

引用次数: 38

The effect of aging process on the parameters of a thin film optoelectronic NAND logical gate 老化过程对薄膜光电NAND逻辑门参数的影响

Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics Pub Date : 2005-10-23 DOI: 10.1109/POLYTR.2005.1596519

Z. Porada

引用次数: 0

A simple method to simulate polymer field-effect transistors 一种模拟聚合物场效应晶体管的简单方法

Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics Pub Date : 2005-10-23 DOI: 10.1109/POLYTR.2005.1596516

H. Qiu, R. Meixner, H. Goebel, W. Klix, R. Stenzel

引用次数: 1