{"title":"碳黑/聚亚胺厚膜电阻器的物理化学、电学和稳定性","authors":"A. Dziedzic","doi":"10.1109/POLYTR.2005.1596480","DOIUrl":null,"url":null,"abstract":"This paper describes carbon/polyesterimide thick-film resistive composites. Polyesterimide (PEI) resin with high thermal durability served as an insulative matrix whereas medium structure carbon black (MSCB), blend of MSCB and graphite (G), and high structure carbon black (HSCB) have been used as an active phase. Chosen physicochemical investigations, standard electrical measurements (dependence of basic electrical properties on kind and content of conductive filler, curing method and curing temperature) as well as nonstandard electrical methods (1/f noise and voltage nonlinearity properties) and various stability tests have been used for complete description of MSCB/PEI, (MSCB+G)/PEI and HSCB/PEI thick-film resistor series.","PeriodicalId":436133,"journal":{"name":"Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics","volume":"48 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Physicochemical, electrical and stability properties of carbon black/polyesterimide thick-film resistors\",\"authors\":\"A. Dziedzic\",\"doi\":\"10.1109/POLYTR.2005.1596480\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper describes carbon/polyesterimide thick-film resistive composites. Polyesterimide (PEI) resin with high thermal durability served as an insulative matrix whereas medium structure carbon black (MSCB), blend of MSCB and graphite (G), and high structure carbon black (HSCB) have been used as an active phase. Chosen physicochemical investigations, standard electrical measurements (dependence of basic electrical properties on kind and content of conductive filler, curing method and curing temperature) as well as nonstandard electrical methods (1/f noise and voltage nonlinearity properties) and various stability tests have been used for complete description of MSCB/PEI, (MSCB+G)/PEI and HSCB/PEI thick-film resistor series.\",\"PeriodicalId\":436133,\"journal\":{\"name\":\"Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics\",\"volume\":\"48 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2005-10-23\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/POLYTR.2005.1596480\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/POLYTR.2005.1596480","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Physicochemical, electrical and stability properties of carbon black/polyesterimide thick-film resistors
This paper describes carbon/polyesterimide thick-film resistive composites. Polyesterimide (PEI) resin with high thermal durability served as an insulative matrix whereas medium structure carbon black (MSCB), blend of MSCB and graphite (G), and high structure carbon black (HSCB) have been used as an active phase. Chosen physicochemical investigations, standard electrical measurements (dependence of basic electrical properties on kind and content of conductive filler, curing method and curing temperature) as well as nonstandard electrical methods (1/f noise and voltage nonlinearity properties) and various stability tests have been used for complete description of MSCB/PEI, (MSCB+G)/PEI and HSCB/PEI thick-film resistor series.
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