Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics最新文献_第5页

Use of Flow Simulation for Design and Process Optimisation for Flip Chip Underfill 流动模拟在倒装芯片底填设计和工艺优化中的应用

Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics Pub Date : 2005-10-23 DOI: 10.1109/POLYTR.2005.1596511

R. Miessner, T. Haeussermann

引用次数: 2

Reel-to-Reel Fabrication of Integrated Circuits Based on Soluble Polymer Semiconductor 基于可溶性聚合物半导体的卷对卷集成电路制造

Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics Pub Date : 2005-10-23 DOI: 10.1109/POLYTR.2005.1596477

G. Klink, E. Hammerl, A. Drost, D. Hemmetzberger, K. Bock

{"title":"Reel-to-Reel Fabrication of Integrated Circuits Based on Soluble Polymer Semiconductor","authors":"G. Klink, E. Hammerl, A. Drost, D. Hemmetzberger, K. Bock","doi":"10.1109/POLYTR.2005.1596477","DOIUrl":"https://doi.org/10.1109/POLYTR.2005.1596477","url":null,"abstract":"Rapid progress in the field of organic semiconductors makes the vision of plastic integrated circuits reachable. Polymer electronic is expected to be a promising technology for low-cost and large-area electronic systems, which can not be addressed by traditional chip technology. Solutions of polymer or polymer based pastes offer advantages due to their easy processing possibilities which give the opportunity to coat and pattern them like a printing ink. Cost requirements of polymer electronic imply that for manufacturing also very cost-effective processes must be used. Hence reel-to-reel manufacturing with endless substrates of foil is a key technology to fulfill the challenging cost demands of cheap flexible systems. Within this work a process for manufacturing integrated circuits based on solution processed polymer semiconductors has been developed. Basis is a reel-to-reel working photolithographic patterning process for metallized foils, which is used to fabricate the basic source-drain layer with high resolution. By two subsequent lacquering and three screen printing steps polymer field effect transistors are integrated to circuits.","PeriodicalId":436133,"journal":{"name":"Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131221136","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5

Thermal Modeling for System-in-a-Package Based on Embedded Chip Structure 基于嵌入式芯片结构的系统级封装热建模

Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics Pub Date : 2005-10-23 DOI: 10.1109/POLYTR.2005.1596524

Liu Chen, L. Ekstrand, J. Liu

引用次数: 0

Conductive Adhesives containing Ag-Sn Alloys as Conductive Filler 含银锡合金导电填料的导电胶粘剂

Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics Pub Date : 2005-10-23 DOI: 10.1109/POLYTR.2005.1596478

G. Toida, Y. Shirai, N. Mizmura, M. Komagata, K. Suzuki

{"title":"Conductive Adhesives containing Ag-Sn Alloys as Conductive Filler","authors":"G. Toida, Y. Shirai, N. Mizmura, M. Komagata, K. Suzuki","doi":"10.1109/POLYTR.2005.1596478","DOIUrl":"https://doi.org/10.1109/POLYTR.2005.1596478","url":null,"abstract":"Ag filled isotropic conductive adhesives (ICA) have been investigated as promising altenatives for lead containing solders in surface mount technology (SMT) applications; however, one serious concern is the ionic-migration of the silver filled in the ICA, especially when used in high density interconnection assemblies. In his study, ionic-migration resistance and the contact resistance of the ICA containing Ag-Sn alloy conductive fillers were evaluated. It was found that ionic-migration resistance depended on the Ag-Sn ratio and that Ag-Sn alloys containing 25 to 75 mol% of Sn had excellent ionic-migration resistance though their contact resistance was rather high, compared with silver. For the compatibility of the ionic-migration resistance with lower contact resistance, and to understand the effect of a Sn-Bi alloy powder mixture, several additives and polymer matrixes were also studied. New ICAs including these additives and a conventional ICA (as reference) were evaluated for SMT. Chip components with Sn plated terminations for stability in both contact resistance and adhesion strength were monitored during reliability tests. From the test results, it can be concluded that the new ICA is a potential material for SMT applications. Moreover, if mount loading was not sufficient and/or mount alignment was not suitable, initial contact resistance was unstable. Therefore, we selected materials with reduction effect and we dereased the Sn ratio as low as we could. The filler content rate was also increased. As a result the loading dependence was decreased. We were sucessful in keeping contact resistance more stable while maintaining good ionic-migration resistance.","PeriodicalId":436133,"journal":{"name":"Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics","volume":"138 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-10-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115092526","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Overmoulding of Electronics for End of Life Recovery 电子产品报废回收的复盖成型

Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics Pub Date : 1900-01-01 DOI: 10.1109/POLYTR.2005.1596502

D. Hutt, N. Teh, F. Sarvar, D. Whalley, P. J. Palmer, P. Anderson, B. Kandasubramanian, P. Morris, S. Prosser, P. O'Brien

{"title":"Overmoulding of Electronics for End of Life Recovery","authors":"D. Hutt, N. Teh, F. Sarvar, D. Whalley, P. J. Palmer, P. Anderson, B. Kandasubramanian, P. Morris, S. Prosser, P. O'Brien","doi":"10.1109/POLYTR.2005.1596502","DOIUrl":"https://doi.org/10.1109/POLYTR.2005.1596502","url":null,"abstract":"With the increasing use of electronic control systems in automotive applications, the environments in which they are required to operate are becoming evermore demanding. For improved functionality and to reduce the number of interconnections it is desirable to place the electronic control units (ECUs) as close as possible to the sensors and actuators they interact with, and they can increasingly be found mounted on engine, transmission and chassis components. The electronics are therefore exposed to high/low temperatures, high humidity, vibration and corrosive fluids. In order to protect the electronics and maintain reliability in safety critical areas, great lengths are taken to mount the devices in ways that will prevent the ingress of moisture, cushion shocks and dissipate heat. Potting of electrical devices with thermosetting polymers has been a commonplace method to install a protective layer over the circuit assemblies, which are often mounted in separate boxes within the vehicle. However, with the drive to reduce vehicle weight and increase recyclability, there has been much interest in the use of overmoulding with thermoplastic polymers, not only to provide protection, but to enable the electronics to be mounted into a structural component of the vehicle thereby saving space and weight and eliminating a level of packaging. While this has been shown to be a practical way forward in terms of reliability, the recyclability of the thermoplastic polymer is compromised by the intermixed electronics that are hard to separate economically.","PeriodicalId":436133,"journal":{"name":"Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics","volume":"257 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133809992","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1