Overmoulding of Electronics for End of Life Recovery

D. Hutt, N. Teh, F. Sarvar, D. Whalley, P. J. Palmer, P. Anderson, B. Kandasubramanian, P. Morris, S. Prosser, P. O'Brien
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引用次数: 1

Abstract

With the increasing use of electronic control systems in automotive applications, the environments in which they are required to operate are becoming evermore demanding. For improved functionality and to reduce the number of interconnections it is desirable to place the electronic control units (ECUs) as close as possible to the sensors and actuators they interact with, and they can increasingly be found mounted on engine, transmission and chassis components. The electronics are therefore exposed to high/low temperatures, high humidity, vibration and corrosive fluids. In order to protect the electronics and maintain reliability in safety critical areas, great lengths are taken to mount the devices in ways that will prevent the ingress of moisture, cushion shocks and dissipate heat. Potting of electrical devices with thermosetting polymers has been a commonplace method to install a protective layer over the circuit assemblies, which are often mounted in separate boxes within the vehicle. However, with the drive to reduce vehicle weight and increase recyclability, there has been much interest in the use of overmoulding with thermoplastic polymers, not only to provide protection, but to enable the electronics to be mounted into a structural component of the vehicle thereby saving space and weight and eliminating a level of packaging. While this has been shown to be a practical way forward in terms of reliability, the recyclability of the thermoplastic polymer is compromised by the intermixed electronics that are hard to separate economically.
电子产品报废回收的复盖成型
随着电子控制系统在汽车应用中的应用越来越多,它们所需要的运行环境也变得越来越苛刻。为了改进功能并减少互连数量,希望将电子控制单元(ecu)尽可能靠近与其交互的传感器和执行器,并且越来越多地安装在发动机,变速箱和底盘组件上。因此,电子设备暴露在高/低温,高湿,振动和腐蚀性流体中。为了保护电子设备并保持安全关键区域的可靠性,我们花了很大的时间来安装设备,以防止湿气进入,缓冲冲击和散热。用热固性聚合物对电气设备进行灌封是在电路组件上安装保护层的常用方法,这些电路组件通常安装在车辆内的单独盒子中。然而,随着减少车辆重量和提高可回收性的驱动,人们对使用热塑性聚合物覆盖成型产生了很大的兴趣,不仅可以提供保护,而且可以使电子设备安装到车辆的结构部件中,从而节省空间和重量,并消除一定程度的包装。虽然这在可靠性方面已被证明是一种实用的方法,但热塑性聚合物的可回收性受到混合电子元件的影响,这些电子元件难以经济地分离。
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